TW200407248A - Film carrier tape for mounting electronic parts - Google Patents

Film carrier tape for mounting electronic parts Download PDF

Info

Publication number
TW200407248A
TW200407248A TW092131060A TW92131060A TW200407248A TW 200407248 A TW200407248 A TW 200407248A TW 092131060 A TW092131060 A TW 092131060A TW 92131060 A TW92131060 A TW 92131060A TW 200407248 A TW200407248 A TW 200407248A
Authority
TW
Taiwan
Prior art keywords
film
tape
electronic parts
solder resist
wiring pattern
Prior art date
Application number
TW092131060A
Other languages
Chinese (zh)
Other versions
TWI284106B (en
Inventor
Shuichi Kawasaki
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200407248A publication Critical patent/TW200407248A/en
Application granted granted Critical
Publication of TWI284106B publication Critical patent/TWI284106B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Abstract

The present invention relates to a film carrier tape for mounting electronic parts, which is a film carrier tape for mounting electronic parts consisting of plural circuit pattern formed from conductive metal on a surface of a long insulating film. The film carrier tape for mounting electronic parts is characterized that each circuit pattern is independently coated with a solder resist layer except for the connection terminal, and the solder resist layer formed on the surface of the circuit pattern is divided into several parts. According to the present invention, a bending deformation of the film carrier in the film carrier tape for mounting electronic parts such as CSP﹑COF﹑BGA will be decreased.

Description

200407248 玫、發明說明： 【發明所屬之技術領域】 本發明係關於減低了變曲變形的電子零件安裝用薄膜承載膠帶。 更詳言之本發明係有關於在各個薄膜承載中顯著的予以減低彎曲變形 的電子零件安裝用薄膜承載膠帶，為例如C0F(薄膜覆晶接合，Chip on film)、CSP(晶片尺寸封裝，Chip Size package)、BGA(球格栅陣列，200407248 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a film carrier tape for mounting electronic parts with reduced warpage. More specifically, the present invention relates to a film carrier tape for mounting electronic parts, which significantly reduces bending deformation in each film carrier, and is, for example, COF (Chip on Film), CSP (Chip Size Package, Chip). Size package), BGA (ball grid array,

Ball grid array)之安裝薄膜承載尺寸略相同於安裝電子零件，且由 長尺寸絕緣薄膜所成膠帶之橫向排列2個以上薄膜承載所製造之電子t 零件安裝用薄膜承載膠帶。 【先前技術】 為了搭載積體電路等電子零件於電子機器，使用有電子零件安裝 用薄膜承載膠帶。此電子零件安裝用薄膜承載膠帶，係在長尺寸之絕 緣薄膜表面形成由導電性金屬所成之配線圖型，其中大多數之電子零 件安裝用薄膜承載膠帶’除端子部分以外，依據在此配線圖型表面形參 成軟焊抗輔予以製造。於如此的電子零件安裝用薄膜承載膝帶中作鲁 為形成軟焊抗蝕劑層的樹脂’係使用環氧樹脂等之熱硬化性樹脂。 於未形成軟焊抗蝕劑層的電子零件安裝用薄膜承載膠帶中未看到 大的彎曲魏，但欲形成料抗_層賴硬化性雛祕硬化之際 具有稱微硬化收縮的特性，對形成這種軟焊抗靖層的熱硬化性樹脂 之硬化收縮，對電子零件安裝用薄膜承载謬帶產生橫向縱向之彎曲 變形。 產生在如此的長尺寸薄膜承載膠帶之橫向、縱向的彎曲變形，例 IP030054/SF-969f 5 200407248 如可依在加熱下使薄膜承載通過多數輥子之間的方法、與所產生變形 反方向邊彎曲薄膜承載膠帶(邊給與逆彎曲）加熱的方法等加以改正。 這種取彎曲方法，_是對由絕緣薄膜所成膠帶之橫向形成一個配線 圖型的薄膜承載膠帶之取彎曲方法有效。 可是於最近的電子零件之安裝技術中，乃變成大多數使用c〇f (薄 膜覆晶接合)、CSP(晶片尺寸封裝)或BGA(球格栅陣列)等電子零件與薄 膜承载為大致相等面積的薄膜承载。而因這樣的薄膜承載佔有面積 小’所以可在絕緣_所成膠帶之橫耐_造複數蝴如兩個或四t 個)薄膜承載。於如此的CSP、c〇F、職等，為了於各個薄膜承載中 形成軟焊抗_層’形翁軟焊抗蝴層的各個薄膜承載彎曲對在 橫向形成有複數㈣麻_料傾逆彎㈣，_會在橫向雜 的薄膜承载之境界部分彎曲，無法對各個對彎曲變形的薄膜承載部分 有效地加以逆彎。因此如csp、BGA在膠帶橫向形成複數薄膜承載的 電子零件安㈣_承娜帶，其實情乃林在有朗改錄各個薄 膜承載產生的彎曲變形之取彎曲方法。 隹 專利文獻1特願2001_249499號說明書。 【發明内容】 本發明在於提供電子零件安袭用薄膜承载膠其為於料橫向形 成複數薄麻珊細帛_嶋，_了錢薄膜承 載之彎曲變形為目的。 本發月之電子零件安裝用薄膜承載膠帶，係在長尺寸之絕緣薄膜 IP030054/SF-969f 6 200407248 表面上由導電性金屬形成之多數配線圖型所成之電子零件安裝用薄膜 承載膠帶，其特徵為 該各個之配線圖型’除連接端子部分外，各獨立地由軟焊抗钱劑 所被覆，且形成在各個配線圖型表面的軟焊抗餘劑層，予以分割及/或 畫分為複數個者。 又’本發明之電子零件安裝用薄膜承载膠帶，係在長尺寸之絕緣 溥膜表面上形成由導電性金屬所構成之多數配線圖型，且於該長尺寸 絕緣薄膜之橫向至少併設兩個該配線圖型所成之電子零件安裝用薄膜t 承載膠帶，其特徵為 該各配線圖型，除連接端子部分外，各個獨立地由軟焊抗姓劑層 所被覆，且形成於各個配線圖型表面的軟焊抗餘劑層係分割及/或晝分 為複數個。 本發明之電子零件安裝用薄膜承載膠帶係分割塗覆軟焊抗蝕劑， 因所分割之各個軟焊抗蝕劑層的硬化收縮應力小，故其薄膜承載的變鲁 形可能變小。 φ 【實施方式】 其次參照圖式具體的說明本發明之電子零件安裝用薄膜承載膠 帶。 第1圖表示本發明電子零件安裝用薄膜承載膝帶之一例平棚， 第2圖係於第1圖的面圖。 如第1圖及第2騎示，本發明之電子零件安裝用薄膜承載膠帶 IP030054/SF-969f 7 200407248 l〇，係形成有多數薄膜承載12於長尺寸之絕緣薄膜11。 此長尺寸之絕緣薄膜11，在蝕刻之際會接觸酸等情況，其具有不 會被此種藥品所侵犯之耐藥品性，及在接合之際加熱亦不變質的耐熱 性。作為形成此絕緣性薄膜11之材料例，可列舉聚酯、聚醯胺及聚醯 亞胺等。尤其是本發明使用由聚醯亞胺所成薄膜為理想，此聚醯亞胺 與其他樹脂比較，具有卓越的耐熱性，同時兼具優異耐藥品性。 作為此聚醯亞胺樹脂之例，可列舉由苯均四酸二酐及芳族二胺合$ 成的全芳族聚醯亞胺，由聯苯四羧酸二酐及芳族二胺所合成具有聯苯鲁 骨架的全芳族聚醯亞胺。尤其在本發明使用具有聯苯骨架的全芳族聚 酿亞胺(例：商品名：猶畢列克斯S，曰本宇部興產(股)公司製)為理想。 具有聯苯骨架的全芳族聚醯亞胺之吸水率較其他全芳族聚醯亞胺低。 在本發明對可使用的絕緣薄膜厚度並無特別限制，但厚度75"m以下 之絕緣薄膜之自己形態保持力變低，容易產生變形，故本發明使用絕 緣薄膜厚度(平均厚度)為75/zm以下，理想為在50〜12.5/m範圍内的_ 絕緣薄製造薄型薄膜承載之際有用性高。 鲁 在此長尺寸絕緣薄膜11之橫向緣部，形成多數用以移動此絕緣薄 膜11並實行定位用之定位孔。又此絕緣薄膜U，亦可以再形成定位孔、 裝置孔、成為外部端子用來配置軟焊珠的軟焊珠孔、為了碟保與電子 零件連接用之開缝等。該等可由衝孔製程、使用雷射光的穿孔製程來 形成。 在如此之形成必要透孔的絕緣薄膜上形成配線圖型15 0例如，係 IP030054/SF-969f 8 200407248 於如上述的絕緣薄膜11表面配置導電性金屬箔，在此導電性金屬箔表 面塗覆感光性樹脂，使用所希望的圖型使所形成的感光性樹脂層曝光 及顯像，形成由感光性樹脂所成之圖型，可藉由此圖作為遮蔽材使用 以選擇性钱刻導電性金屬箔而形成此配線圖型15。作為在此所用導電 性金屬之例，係可列舉鋁箔及銅箔。作為如此的導電性金屬屬箔，可 以使用在通常3〜35/zm，較好在9〜25/zm範圍内的金屬箔。又可於絕 緣薄膜表面上設置導電性金屬之核，亦可在該核中析出導電性金屬。 作為本發明使用的導電性金屬箔以使用銅箔為理想，在此可使用l 的銅箔中，雖有電解銅箔及壓延銅箔，但考慮蝕刻特性，操作性等時 使用電解銅箔為理想。 於本發明之電子零件安裝用薄膜承載膠帶中，由上述導電性金屬 所形成配線圖型予以形成的薄膜承載12，係以複數個形成在絕緣薄膜 所成膠帶的橫向上，第1圖顯示於膠帶橫向並列2個薄膜承載12的形 態。 於本發明之電子零件安裝用薄膜承載膠帶中，如上述的薄膜承載鲁 Π各獨立在膠帶之橫向形成複數個。例如於有效寬35mm的絕緣薄膜 11中例如可在橫向並排形成2個14mm薄膜承載，又於有效寬7〇mm 的絕緣薄膜11中，例如可在橫向並排形成4個14mm之薄膜承載。 形成於電子零件安裝用薄膜承載膠帶10的薄膜承載，在csp或 BGA之情況下，在形成有絕緣薄膜n之配線圖型15之該面，除了確 保與電子零件連接用的端子部分16以外，在該形成之配線圖案表面上 IP030054/SF-969f 9 200407248 塗覆軟焊抗钱劑油墨而形成軟焊抗姓劑層20。形成該塗佈之軟焊抗银 劑層20的樹脂，通常為熱硬化性樹脂溶於或分散於有機溶劑之塗覆 液該等軟焊抗钱劑油墨塗佈後，依據加熱形成軟烊抗餘劑層2〇。然 後’此軟焊抗钱層油墨硬化形成軟焊抗韻劑層2〇之際，因形成軟焊抗 蝕劑層的樹脂係稍微地硬化收縮，所以在塗覆此軟焊抗蝕劑油墨的部 分以軟焊抗姓劑2〇為内侧向内產生彎曲變形。 又亦有不需形成軟焊抗姓劑層的型式之電子零件安裝用薄膜承 載膠帶。 $ 該等在膠帶寬方向並排形成複數個薄膜承載12時，對此膠帶加以 逆彎曲也僅在薄膜承載12之間的膠帶曲折，對產生彎曲變形的薄膜承 載12之部分幾乎不會加以逆彎。因而，對各個薄膜承載12來看，幾 乎不作改正彎曲變形。 因而如上述在膠帶之寬方向排列形成複數薄膜載體12時，可有效 率地使各個薄膜承載12本身不產生彎曲變形。 產生彎曲變形的原因，為絕緣膠帶與導電性金屬等材料之膨脹係$ 數差異，或如上述軟焊抗餘劑之硬化收縮，由此硬化收縮產生的内部 應力恆常的高賊緣細等自己形態麟性時，難焊祕劑層内在 應力乃作為薄膜承載之彎曲變形予以外表化者。然後軟焊抗姓劑層2〇 之形成面變大時，社面積轉抗_層W __職力就互相連帶 谷易變成大的内部應力。然而，於產生這樣的大内部應力之軟焊抗敍 劑層20巾，部分來看，其内部應力並非那樣程度的大者。 IP030054/SF-969f 10 200407248 於疋本發日轉先體塗覆所形成之全體_體化的軟焊抗钱齊!層 2〇 ’刀贼畫分為好幾部分而塗覆職，盡量册各齡割或畫分的 劃區應力小’予以抑制在與此所劃區軟焊抗钱剤層2〇部分的絕緣薄膜 之自己t/先、支持力相抗衡之程度以下，抑制於所劃區軟焊抗韻劑層 20形成部的彎曲變形在最小限度。 亦即，在本發明之電子零件安裝用薄膜承載膠帶1〇，如第！圖〜 第3圖所示將軟焊抗靖層2〇分割為如a劃區挪、b劃區挪、c 劃區2〇C、D劃區20d的複數劃區，予以塗布軟焊抗輔油墨予以形成。t 於本發明中形成軟焊抗蝕劑層2〇的樹脂為硬化性樹脂，例如較好 使用環氧樹脂、胺基甲酸㈣性之環氧樹脂、嶋樹脂、聚酿亞胺樹 脂前驅物等熱硬化性脂。此熱硬化性樹脂可溶解或分散於溶劑中，使 用網筛依_缝布，度通常調㈣1G〜術a s，理縣Mohs 範圍内。 於第㈣中’形成軟焊抗_層2〇的區域，為合併A劃區施、 B劃區20b、C劃區心、D劃區2〇d的區域，但先前技藝中該等區 域係-體塗綠舰_。絲，這·範目喊姑鋪予以塗佈 並硬化時’在樹脂硬化之際進行硬化收縮，如第4圖所示，對各個薄 膜承載12，產生將軟焊抗钱劑層2〇向内側的彎曲變形。 在本發明之電子零件安裝薄膜承載膠帶中，分割如上述應予塗覆 軟焊抗侧的區域為複數懈塗覆軟焊抗_，亦即於第丨圖及第3 圖中’應予塗麵抗_的區域，為合併她2心劃區撕及 IP030054/SF-969f 200407248 D劃區2Gd，但第1圖及第3圖所示例係分割此區域為4分割，將各個 區從雜薦獨立塗覆軟焊抗蝕劑，使其硬化形成分割為4劃區的軟 焊抗侧層20。又，_承载之縱、橫尺寸為5咖以下献多為不會 產生成為問題程度的彎峻形狀況，觀本發明於麵承載之縱、橫 尺寸在5mm社_膜承載似分彡絲焊抗侧較為理想。 如此由於分割軟焊抗輔層，在各個劃區内雖產生由軟焊抗_ 之硬化收縮應力’但其應力小，由於使其與絕緣_及形成其上的配 線圖型等之内在應力她衡，可抑止於其細承載_變形在最小限$ 這樣的效果，於寬方向形成有1個薄膜承載12時也同樣地有效。 如此的軟焊抗餘劑層20雖取決於薄膜承載之尺寸、絕緣薄膜、軟 焊抗钱劑、其他村料之物性值，但作2〜16分割為理想，作2〜8分割更 特別理想。由於此軟焊抗钱劑層2〇之分割，在各個劃區由軟焊抗餘劑 硬化的收縮應力變小，薄膜承載總體之變形也變小。又，分割後的軟I 焊抗蝕劑尺寸，係複雜地牽連著絕緣薄膜、軟焊抗蝕劑等物性值，未鲁 必要使1邊之尺寸作為5mm以下。 於本發之電子零件安裝用薄膜承載膠帶10中，對軟焊抗钱劑層2〇 分割及/或晝分的各劃區形區形狀及相對大小並無特別限制，但較好使 塗覆軟焊抗钱劑的區域盡量均勻地分割。由於均勻化產生在各個畫區 的應力，其薄膜承載全體之變形會變的更小。亦即，較好使各個劃區 之面積均等，同時作成各個劃區形態大致相同。本發明之電子零件安 IP030054/SF-969f 12 200407248 裝用薄膜承載膠帶，係以所_之軟焊抗_之_區—邊長度為 2〜10 mm程度，較好作成2·5〜7 5mm之程度為理想。 本發明之電子零件安裝用薄膜承讎帶中，軟焊抗侧層係以分 割及/或畫分形成之薄膜承載，並不限定於如上述的csp或bga等者， 亦可適用-般的TAB膠帶。例如如第5⑻及5細所示，可適用於在 形成贏以上配線圖型(除端子部分)之㈣，形成軟焊抗細層的電子 零件安裝用薄縣娜帶。第5 _麵軸在有裝置孔絕緣薄膜u · 表面的配線圖型15，以12分割軟焊抗鋪層所形成之例。又，記載於· 第5⑻圖的配線圖型乃為一例，並不是限定在本發明的配線圖型者。又 第5(b)圖表不二分割軟焊抗钱劑廣2〇之例，於第剛圖中，在絕緣薄 膜11表面形成配線圖型，在第5圖(b)則省略了配線圖型。例如第5⑻、 5(b)圖所示，除連接端子部分外，在配線圖型之3〇%以上區域，於形成 軟焊抗钱劑層的電子零件安裝用薄膜承載膠帶有用。 又如第6⑻、6(b)圖所示，分割為如上述劃區之間的距離㈣，雖可> 適宜設定為不傳達應產生於鄰接劃區内部的應力，但通技定為> m〜5〇麵，理想為20/zm〜3mm範圍内之值。如上述由於設定劃區間的 距離，各劃區内部之應力不傳達至鄰接的劃區，又保護在各劃區間的 配線圖型亦不會特別產生問題。又各個劃區，希望能形成其形狀為近 似者。並由於劃區的形狀為近似，而為了使各個劃區產生的内部應力 均勻化，致薄膜承載全體之變形變小。 如上述所分割或畫分的軟焊抗钱劑層厚度(h〇)，係與先前之軟焊抗 IP030054/SF-969f 13 200407248 蝕谢層厚度同樣，硬化後的丨度通常係在配線圖型上面3〜50#ιη、 理想為在5-40#m範ΙίΜ 又於本發嗎之電+零件安裝用薄膜承載膠 帶，如第6(a)圖所·!，忱焊抗蝕麵層20乃作分割或畫分，在鄰接的劃 區之間具有如丨砘未形成軟焊抗蝕劑層部分，但不傳逹產生在各個畫 區的内部庾//於鄰接的金I區即可，例如第6(b)國所示，至少劃區的軟焊 抗杜劑 20亦可以一部分舆鄰接的軟焊抗鈾麵層劃區可連結成畫分《 在儿狀況，畫區舆畫區之間的軟焊抗蝕層厚度(M)，為軟焊抗蝕割層通 常厚度(ho)之1/2以下，ω亦可為0 ◎ 欲形成如此割區的軟焊抗杜劑層20,對先前之屏蔽以對應劃區形 成遮蔽塗覆樹脂即可。又在近來開始採用的黏貼型式之軟焊抗蝕劑 時，係形成間隊予以贴住軟焊抗钱劑即可。再者，使用感光性樹脂的 軟焊抗蝕劑時，係塗覆樹廳後，如以分割及/或畫分軟焊抗蝕劑層予曝 光。又割區間至少一部分連結之該經劃分的軟焊抗儀麵層，可藉由調 整塗覆軟焊抗杜塗覆液之際所使用屏蔽遮罩之線寬來形成β 作成如上述爆成軟焊抗蝕麵層後，予以電鍍處理從軟焊抗蝕谢層 20露出的端子部分(引腳、接合塊、其他)16之表面·電鍍處理有鍍鍚、 鍍鎳、鏢-全之多層電鍍、鎳-叙-金之多層電鍍、鍍烊、鍚為等電鍍。 又，在分割的軟焊抗钱劑層間的配線國型表面上形成上述電鍍層β 又，在電鍍處理，也可在形成軟焊抗《劑層之前實行。 以如上述製造的本發明之電子零件安裝用薄膜承載膠帶，可依據 通常的方法使用。例如使用黏接割等將電子零件(未國示)配置於分割所 nTO30054/SF-969f 200407248 形成的軟焊抗蝕劑層上，由於在形成於此電子零件的凸出電極與連端 子16之間形成電氣連接，可以安裝電子零件。此形成電氣連接，可使 用例如金線的導電性金屬線等。又，於本發明之電子零件安裝用薄膜 承載膠帶中，雖欲安裝的電子零件與承載膠帶具有大致相等的佔有面 積，但本發明並不限定於如此的薄膜承載膠帶者。 形成於本發明電子零件安裝用薄膜承載膠帶的連接端子16，係介 由配線圖型15連接於軟焊珠。 如上述本發明之電子零件安裝用薄膜承载膠帶，因分割或劃分軟《 焊抗蝕劑層，故可以減低軟烊抗姓劑硬化之際的硬化收縮所引起之薄 膜承載之彎曲變形。 於本發明之電子零件安裝用薄膜承載帶的薄膜承載之變形，如以 下加以測定。如第4(a)圖所示，形成有使用定位孔移動的薄膜承載膠帶 之疋位孔部分作基準點，於所製造薄膜承載膠帶的一個薄膜承載測定 對第3圖所示測定點1〜5基準點的高度。從以如此獲得的值考慮此薄 膜承載膠帶變形為如第4圖所示，由計算求得欲測定的薄膜承載(單元）< 的①'(⑦'）、②X④〇之值。求得①、⑤'=(①+⑦）/②，同樣求得 ②，=④，+④)/②。 然後，於本發明的單元彎曲，係①l③或②，一⑦值之中大者為在本 發明的彎曲變形。 依據如上述由於分割或晝分軟焊抗蝕劑層，薄膜承載的彎曲變 形，會變成具有未分割或畫分的軟焊抗餘劑層之薄膜承載彎曲變形之 IP030054/SF-969f 15 200407248 50%以下。 如上述本發明之電子零件安裝用薄膜承載膠帶，係由於分割或畫 分軟焊抗钮劑層來形成，減低薄膜承載之彎論變形，獲得高可靠性的 電子零件安裝用薄膜承載膠帶。 【產業上之利用可能性】 本發明之電子零件安裝用薄膜承載膠帶，因分割或畫分軟焊抗飯 劑層為複數個，故軟焊抗蝕劑油墨硬化之際分散伴隨收縮的應力。因 此本發明之電子零件安裝用薄膜承載膠帶，乃顯著的減低由軟焊抗蝕馨 劑層硬化收縮的薄膜承載之彎曲變形，確實地提高了電子零件的安裝 精度。 特別是本發明之電子零件安裝用薄膜承載膠帶，作為csp、c〇F、 BGA等有用性特別高。 實施例 其次對本發明之電子零件安裝用薄膜承載膠帶，以實施例加以顯 不，並與容易產生彎曲，於連接端子以外之配線圖型全面形成軟焊抗H 蝕劑時比較來說明，但本發明並不由該等所限定者。 實施例1 對平均厚度5〇_、寬48 mm的聚醯亞胺薄膜(日本宇部興業㈤ 公司製，商品名··猶畢麗克斯S)，由衝孔穿設了為了配置定位孔及軟 焊珠的軟焊孔。此聚醯亞胺薄膜，如第丨圖所示，其—邊以可形成一 排17mm之薄膜承载穿設了軟焊珠孔。 IP030054/SF-969f 16 200407248 接著在此聚醯亞胺薄膜貼上平均厚度25/zm的電解銅箔，塗覆感 光性樹脂在此電解銅落上，予以曝光、顯像。由這樣顯像感光性樹脂 所成之圖型作為遮蔽材，由於選擇性蝕刻該電解鋼箔而形成由銅所構 成之配線圖型。 由於在以如此形成的配線圖型表面所塗覆之軟焊抗蝕劑油墨加熱 硬化，形成軟焊抗钱劑層(硬化後平均厚度：l〇/m)。依此所形成的軟 焊抗姓劑層，由於形成屏蔽遮罩，如第1圖所示予以4分割，在各割 區之間存在有200/zm寬未塗覆軟焊抗钱劑的部分(劃區部分）。 形成為4分割的軟焊抗蝕劑層後，由軟焊抗餘劑層未被覆的連接 ^子及軟焊抗餘劑層之劃區部，锻錄後作艘金處理，再按照常法對薄 膜承載膠帶全體實行取彎。 將在所獲得之電子零件安裝用薄膜承載膠帶靠近長度方向中心部 分的薄膜承载，隨意地選擇6排12個，對該等之薄膜承載測定彎曲變 形0 結果示於表1。又，於表1記載上層、下層係如第i圖所示配置之鲁 際為了區別此薄膜承載膠帶在上側的薄膜承載與在下側的薄膜承載 者’與本發明之電子零件安裝用薄膜承載膠帶製程的膠帶之朝向無關 係0 表1 第一塊 第二塊 第三塊 第四塊 第五塊 第六塊 平均值 上 層 0.35mm -0.005mm 0*015mm 0.023mm 0.150mm 0»071mm 0.035mm IP030054/SF-969f 17 200407248 下 層 0.012mm (K051mm -〇〇19mm -0.016mm 0.017mmThe mounting size of the ball grid array is slightly the same as the mounting size of the electronic parts, and it is made of two or more horizontally arranged tapes made of long-length insulating film. [Prior art] In order to mount electronic components such as integrated circuits in electronic equipment, a film carrier tape for mounting electronic components is used. This film carrier tape for electronic parts installation is a wiring pattern made of conductive metal on the surface of a long-length insulating film. Most of the film carrier tapes for electronic part installation are based on this wiring except for the terminal part. The pattern surface parameters are manufactured by soldering resistance. As a resin for forming a solder resist layer in such a film-bearing knee strap for electronic component mounting, a thermosetting resin such as epoxy resin is used. No large bending was seen in the film-carrying tape for mounting electronic parts without a solder resist layer. However, when a material is to be formed, the layer has a property called micro-hardening shrinkage. The hardening and shrinkage of the thermosetting resin forming such a solder-resistant anti-adhesive layer causes lateral and longitudinal bending deformation of the film carrying tape for mounting electronic parts. The horizontal and vertical bending deformation of such a long-length film-carrying tape occurs, for example, IP030054 / SF-969f 5 200407248 If the film can be carried under heating between most rollers, it can be bent in the direction opposite to the deformation. Correct the method such as heating the film-carrying tape (the side is reversely bent). This method of bending is effective for the method of bending the film-bearing tape that forms a wiring pattern in the transverse direction of the tape made of the insulating film. However, in the recent mounting technology of electronic components, most electronic components such as cof (film-on-chip bonding), CSP (chip size package), or BGA (ball grid array) are used to carry the film with approximately the same area. Film carrying. And because such a film has a small occupation area, it can be carried on a film with two or four t films. In such CSP, coF, grade, etc., in order to form a soldering resistance layer in each film bearing, each of the film bearing bending pairs of the “Weng” soldering resistant butterfly layer has a plurality of ramie _ material tilt reverse bending Alas, _ will bend in the boundary part of the horizontally mixed film bearing, and it is impossible to effectively reverse the bending of each of the film bearing parts that are deformed by bending. Therefore, if csp and BGA form a plurality of film-carrying electronic parts on the adhesive tape in the transverse direction of the tape, in fact, it is Lin Lin's method of flexing the bending deformation of each film bearing.说明书 Patent Document 1 Japanese Patent Application No. 2001_249499. [Summary of the Invention] The present invention aims to provide a film-bearing adhesive for electronic component security, which aims to form a plurality of thin linings in the transverse direction of the material, and the bending deformation of the film-bearing. The film-bearing tape for electronic parts installation of this month is a film-bearing tape for electronic parts mounting made of most wiring patterns made of conductive metal on the surface of a long insulating film IP030054 / SF-969f 6 200407248. It is characterized in that each of the wiring patterns' except for the connection terminal part, is independently covered by a soldering anti-repellent agent, and the soldering anti-remainder layer formed on the surface of each wiring pattern is divided and / or drawn. For a plurality. Also, the film-bearing tape for mounting electronic parts of the present invention is formed on the surface of a long-sized insulating film with a plurality of wiring patterns made of conductive metal, and at least two of the long-sized insulating film are arranged side by side. The film t-bearing tape for mounting electronic parts formed by a wiring pattern is characterized in that each wiring pattern is independently covered by a soldering anti-resistance agent layer except for the connection terminal portion, and is formed on each wiring pattern The surface solder resist layer is divided and / or divided into a plurality of days. The film-bearing tape for mounting electronic parts according to the present invention is coated with a solder resist separately. Since the hardened shrinkage stress of each of the divided solder resist layers is small, the deformation of the film-bearing tape may be reduced. φ [Embodiment] Next, a film carrier tape for mounting electronic parts according to the present invention will be specifically described with reference to the drawings. Fig. 1 shows an example of a flat shed for a film-bearing knee strap for mounting electronic parts according to the present invention, and Fig. 2 is a plan view of Fig. 1. As shown in FIG. 1 and FIG. 2, the film-carrying tape IP030054 / SF-969f 7 200407248 10 for mounting electronic parts of the present invention is formed with a large number of film-carrying insulating films 11 in a long size. This long-sized insulating film 11 is in contact with an acid during etching, and has chemical resistance that is not violated by such drugs, and heat resistance that does not deteriorate when heated during bonding. Examples of the material for forming the insulating film 11 include polyester, polyimide, and polyimide. In particular, it is desirable to use a film made of polyimide in the present invention. Compared with other resins, this polyimide has excellent heat resistance and excellent chemical resistance. Examples of this polyfluorene imine resin include a fully aromatic polyfluorene imine formed by pyromellitic dianhydride and an aromatic diamine, and a polyphenylene tetraimide dianhydride and an aromatic diamine. Synthesis of a fully aromatic polyfluorene imine with a biphenyllu skeleton. Particularly, in the present invention, it is desirable to use a wholly aromatic polyimide having a biphenyl skeleton (e.g., trade name: Ubilex S, manufactured by Ube Industries, Ltd.). The fully aromatic polyfluorene imide with a biphenyl skeleton has a lower water absorption rate than other fully aromatic polyfluorene imines. There is no particular limitation on the thickness of the insulating film that can be used in the present invention, but an insulating film with a thickness of less than 75 " m has a low form retention and is easily deformed. Therefore, the thickness (average thickness) of the insulating film used in the present invention is 75 / zm or less, ideally in the range of 50 to 12.5 / m._ It is highly useful in the manufacture of thin insulation film for thin film support. In the lateral edge portion of the long-sized insulating film 11, a plurality of positioning holes are formed for moving the insulating film 11 and performing positioning. In addition, the insulating film U can be further formed with positioning holes, device holes, soft bead holes for external terminals to be used for placing soft beads, and slits for connecting the disks to electronic parts. These can be formed by a punching process and a perforation process using laser light. A wiring pattern 15 is formed on the insulating film having the necessary through holes formed in this way. For example, it is IP030054 / SF-969f 8 200407248. A conductive metal foil is arranged on the surface of the insulating film 11 as described above, and the surface of the conductive metal foil is coated. The photosensitive resin is used to expose and develop the formed photosensitive resin layer using a desired pattern to form a pattern made of the photosensitive resin. The pattern can be used as a shielding material to selectively etch the conductivity A metal foil is used to form this wiring pattern 15. Examples of the conductive metal used herein include aluminum foil and copper foil. As such a conductive metal foil, a metal foil in the range of usually 3 to 35 / zm, preferably 9 to 25 / zm can be used. A core of a conductive metal may be provided on the surface of the insulating film, and a conductive metal may be deposited in the core. As the conductive metal foil used in the present invention, copper foil is preferably used. Among the copper foils that can be used here, although electrolytic copper foil and rolled copper foil are used, electrolytic copper foil is used in consideration of etching characteristics, workability, etc. ideal. In the film carrier tape for mounting electronic parts of the present invention, the film carrier 12 formed by the wiring pattern formed by the above-mentioned conductive metal is formed by a plurality of tapes formed in the transverse direction of the tape formed by the insulating film. The adhesive tape is arranged in the form of two film carriers 12 arranged side by side. In the film-bearing tape for mounting electronic parts of the present invention, as described above, the film-bearing tapes are each formed in the transverse direction of the tape independently. For example, in an insulating film 11 with an effective width of 35 mm, for example, two 14 mm film carriers can be formed side by side in the lateral direction, and in an insulating film 11 with an effective width of 70 mm, for example, four 14 mm film carriers can be formed side by side in the lateral direction. In the case of csp or BGA, the film carrier formed on the film carrier tape 10 for mounting electronic parts is provided on the side of the wiring pattern 15 on which the insulating film n is formed, except for the terminal portion 16 for connection with the electronic parts. On the surface of the formed wiring pattern, IP030054 / SF-969f 9 200407248 was coated with a solder anti-money ink to form a solder anti-money agent layer 20. The resin forming the coated solder resist silver agent layer 20 is usually a coating solution in which a thermosetting resin is dissolved or dispersed in an organic solvent. After the solder solder resist ink is applied, a soft solder resist is formed by heating.余 剂 层 20。 The remaining agent layer 20. Then 'when this solder resist ink is hardened to form a solder resist anti-rust agent layer 20, the resin system forming the solder resist layer is slightly hardened and shrunk, so when the solder resist ink is coated, Part of the soldering anti-agent 20 is inwardly deformed. There are also types of film-supporting tapes for mounting electronic parts that do not require a solder resist layer. $ When the plurality of film carriers 12 are formed side by side in the direction of the adhesive bandwidth, the tape is reversely bent, and only the tape between the film carriers 12 is twisted, and the portion of the film carrier 12 that undergoes bending deformation is hardly reversely bent. . Therefore, with regard to each film carrier 12, almost no bending deformation is corrected. Therefore, when the plurality of film carriers 12 are arranged in the width direction of the adhesive tape as described above, each of the film carriers 12 can be effectively prevented from being deformed by bending. The cause of the bending deformation is the difference between the expansion coefficient of the insulating tape and the conductive metal and other materials, or the hardening and shrinkage of the soft solder resist as described above, and the constant internal stress caused by the hardening and shrinkage is high, and the like. In its own shape, the internal stress of the hard-to-solder layer is externalized as the bending deformation carried by the film. Then, when the formation surface of the solder resist layer 20 becomes larger, the work area resistance layer _ layer W __ will be associated with each other, and Gu Yi will become a large internal stress. However, in the case of a solder resist layer 20 that generates such a large internal stress, in part, the internal stress is not so great. IP030054 / SF-969f 10 200407248 The whole body formed by the application of the precursor coating on the day of the present day_The solidified solder joint is resistant to money! The layer 20 'knife and thief painting is divided into several parts and coated, as much as possible The ageing or division of the zone is less stressful. It is suppressed to the extent that it is inferior to the self-adhesiveness of the insulating film of the soldering anti-money layer 20 part of this zone. It is suppressed to the zone The bending deformation of the formation portion of the soldering anti-rheological agent layer 20 is minimized. That is, the film-carrying tape 10 for mounting electronic parts of the present invention is as described above! As shown in Fig.3, the solder resist layer 20 is divided into a plurality of divisions such as a zone, b zone, c zone 20C, and D zone 20d. Ink is formed. t The resin used to form the solder resist layer 20 in the present invention is a hardening resin. For example, epoxy resin, urethane-based epoxy resin, resin, polyimide resin precursor, etc. are preferably used. Thermosetting grease. This thermosetting resin can be dissolved or dispersed in a solvent, using a mesh sieve, the degree is usually adjusted from 1G to 1s, within the range of Lixian Mohs. The area where the soldering resistance layer 20 is formed in the second step is an area combining the A zone application, the B zone 20b, the C zone center, and the D zone 20d. However, in the prior art, these areas are -Body-painted green ship _. When this coating is applied and hardened, Fan Mu calls the “hardening shrinkage while the resin is hardening. As shown in FIG. 4, each film is carried 12 to generate a soft soldering anti-money agent layer 20 inward. Bending deformation. In the electronic component mounting film carrier tape of the present invention, the areas where the solder resistance side should be coated as described above are divided into multiple coating solder resistances, that is, in FIG. 3 and FIG. 3, 'should be coated The area of face resistance _ is to merge her 2 heart zone and IP030054 / SF-969f 200407248 D zone 2Gd, but the example shown in Figure 1 and Figure 3 is to divide this area into 4 divisions. The solder resist is independently applied and hardened to form a solder resist side layer 20 divided into four divisions. In addition, the vertical and horizontal size of the bearing is 5 or less, and it is mostly a bending condition that does not cause a problem. Viewing the invention, the vertical and horizontal size of the surface bearing is 5mm. The anti-side is ideal. In this way, due to the division of the soldering resistance auxiliary layer, although the hardening shrinkage stress caused by the soldering resistance is generated in each zone, the stress is small, because of the inherent stress between it and the insulation and the wiring pattern formed on it. The balance can be restrained by the effect that the thin load_deformation is at a minimum of $, and it is also effective when a thin film bearing 12 is formed in the wide direction. Although such a solder resist layer 20 depends on the size of the film, the physical properties of the insulating film, the solder resist, and other materials, it is ideal to divide it into 2 to 16, and it is more ideal to divide it into 2 to 8. . Due to the division of the solder resist layer 20, the shrinkage stress hardened by the solder resist in each zone becomes smaller, and the overall deformation of the film load is also reduced. In addition, the size of the solder resist after the division is complicated because of physical properties such as an insulating film and a solder resist. It is not necessary to set the size of one side to 5 mm or less. In the film-bearing tape 10 for mounting electronic parts of the present invention, the shape and relative size of each of the divided areas of the solder resist layer 20 division and / or day division are not particularly limited, but it is preferable to make the coating The area of the soldering anti-money agent is divided as evenly as possible. Due to the uniformity of the stress generated in each painting area, the deformation of the film bearing the whole will become smaller. That is, it is preferable to make the area of each division equal, and to make the shape of each division approximately the same. The electronic part of the present invention is IP030054 / SF-969f 12 200407248. The film carrier tape for mounting is based on the soft soldering resistance of the _zone_side—the length of the side is about 2 ~ 10 mm, preferably 2.5 · 7 ~ 5 5mm. The degree is ideal. In the film carrier tape for mounting electronic parts of the present invention, the solder-resistant side layer is carried by a film formed by dividing and / or drawing, and is not limited to the above-mentioned csp or bga, etc., and can also be applied to- TAB tape. For example, as shown in Nos. 5 and 5, it can be applied to the thinner tapes used for mounting electronic parts for forming solderable anti-thin layers when the wiring patterns (except the terminal part) are formed. The fifth example is the wiring pattern 15 on the surface of the insulating film u · with the device hole, which is formed by 12 divisions of a solder resist layer. The wiring pattern shown in Fig. 5 is an example, and is not limited to the wiring pattern of the present invention. In the fifth (b) diagram, the soldering anti-money agent is divided into two types. In the first figure, a wiring pattern is formed on the surface of the insulating film 11. In the fifth figure (b), the wiring pattern is omitted. . For example, as shown in Figs. 5 (5) and 5 (b), in addition to the connection terminal portion, it is useful for a film-bearing tape for mounting electronic parts on which a solder resist layer is formed in an area of 30% or more of the wiring pattern. As shown in Figs. 6 (6) and 6 (b), it is divided into the distances between the divisions as described above. Although it can be suitably set to not convey the stress that should be generated inside the adjacent divisions, the general technique is set to be> m ~ 50 face, ideally in the range of 20 / zm ~ 3mm. As mentioned above, due to the setting of the distance between the divisions, the internal stress of each division is not transmitted to the adjacent divisions, and the wiring pattern in each division does not cause any special problems. In addition, it is hoped that each of the divisions can be shaped similarly. And because the shape of the zoning is approximate, in order to make the internal stress generated by each zoning uniform, the deformation of the entire film bearing is reduced. The thickness (h0) of the solder resist layer divided or drawn as described above is the same as the thickness of the previous solder resist IP030054 / SF-969f 13 200407248. The thickness of the hardened layer is usually in the wiring diagram. 3 ~ 50 # ιη above the model, ideally 5-40 # m 范 ΙίΜ and the film + tape for tape mounting of the parts, as shown in Figure 6 (a). Weld the corrosion resistant surface layer 20 is used for division or drawing, and there is no solder resist layer between adjacent divisions, but it is not transmitted in the interior of each painting area. Yes, for example, as shown in country 6 (b), at least the zoned soldering anti-dusting agent 20 may also be part of the adjacent zone of the soldered uranium anti-urethane surface. The thickness (M) of the solder resist layer between the zones is less than 1/2 of the thickness (ho) of the solder resist cut layer, and ω can also be 0. ◎ The solder resist layer to be formed in such a cut zone 20. It is sufficient to form a masking coating resin for the previous shield with corresponding divisions. In the case of a soldering resist of the pasting type which has recently been used, it is only necessary to form a team to stick the soldering resist. Furthermore, when a solder resist of a photosensitive resin is used, the solder resist layer is divided and / or divided into layers to be exposed after coating the tree hall. At least a part of the divided solder resist surface layer connected to the cutting section can be formed by adjusting the line width of the shielding mask used in the application of the solder resist coating liquid to form β as the above-mentioned burst soft After the resist surface layer is soldered, a plating process is performed on the surface of the terminal portions (leads, bonding blocks, and other) 16 exposed from the solder resist layer 20. The plating process includes multi-layer plating of hafnium plating, nickel plating, and dart-all. , Nickel-Sydney-gold multi-layer electroplating, rhenium plating, rhenium plating, etc. The above-mentioned plating layer β is formed on the wiring-shaped surface between the divided solder resist layers, and the plating treatment may be performed before the solder resist layer is formed. The film carrier tape for mounting electronic parts of the present invention manufactured as described above can be used in accordance with a usual method. For example, an electronic component (not shown in the country) is placed on the solder resist layer formed by the division nTO30054 / SF-969f 200407248 by using a bonding cut or the like. An electrical connection is formed between them, and electronic parts can be mounted. This makes an electrical connection, and a conductive metal wire such as a gold wire can be used. Furthermore, in the film carrier tape for mounting electronic parts of the present invention, although the electronic parts to be mounted and the carrier tape have approximately the same occupied area, the present invention is not limited to such a film carrier tape. The connection terminals 16 formed on the film-bearing tape for mounting electronic parts of the present invention are connected to the solder beads via a wiring pattern 15. As described above, the film-bearing tape for mounting electronic parts of the present invention can reduce the bending deformation of the thin-film bearing caused by the hardening shrinkage when the soft anti-resistant is hardened because the soft solder resist layer is divided or divided. The deformation of the film carrier of the film carrier tape for mounting electronic parts of the present invention is measured as follows. As shown in Fig. 4 (a), the positioning hole portion of the film-carrying tape moved using the positioning hole is formed as a reference point, and one of the film-carrying measurement of the produced film-carrying tape is performed to the measurement points 1 to 3 shown in Fig. 3 5 the height of the reference point. From the values obtained in this way, it is considered that the film-bearing tape is deformed into the values of ① '(⑦') and ②X④〇 of the film load (unit) < Find ①, ⑤ '= (① + ⑦) / ②, and similarly find ②, = ④, + ④) / ②. Then, when the unit of the present invention is bent, it is ①l③ or ②. The larger one of the values is the bending deformation of the present invention. According to the above, due to the split or daytime soldering resist layer, the bending deformation of the thin film bearing will become the IP030054 / SF-969f 15 200407248 50 of the thin film bearing bending deformation of the unsplit or divided solder resist layer. %the following. As described above, the film-bearing tape for mounting electronic parts of the present invention is formed by dividing or drawing a layer of solder resist, which reduces the flexural deformation of the film-bearing, and obtains a highly reliable film-bearing tape for mounting electronic parts. [Industrial Applicability] Since the film-bearing tape for mounting electronic parts of the present invention is divided or divided into a plurality of solder resist layers, the stress accompanying shrinkage is dispersed when the solder resist ink hardens. Therefore, the film-carrying tape for mounting electronic parts of the present invention significantly reduces the bending deformation of the film carried by the hardening and shrinking of the solder resist layer, and reliably improves the mounting accuracy of the electronic parts. In particular, the film carrying tape for mounting electronic parts of the present invention is particularly useful as csp, coF, BGA, and the like. EXAMPLES Next, the film carrying tape for mounting electronic parts of the present invention will be shown in the examples, and compared with the case where it is easy to bend and the solder pattern anti-H etchant is fully formed on the wiring pattern other than the connection terminal. The invention is not limited by these. Example 1 A polyimide film with an average thickness of 50 mm and a width of 48 mm (manufactured by Ube Japan Industrial Co., Ltd., trade name · Jubilex S) was punched through to provide positioning holes and Solder holes for solder beads. As shown in FIG. 丨, this polyimide film is provided with a solder bead hole on its side with a film capable of forming a row of 17 mm. IP030054 / SF-969f 16 200407248 Next, an electrolytic copper foil with an average thickness of 25 / zm was pasted on this polyimide film, and a photosensitive resin was coated on the electrolytic copper, and exposed and developed. The pattern formed by developing the photosensitive resin as described above is used as a shielding material, and the electrolytic steel foil is selectively etched to form a wiring pattern composed of copper. The solder resist ink coated on the surface of the wiring pattern pattern thus formed is heated and hardened to form a solder resist layer (average thickness after hardening: 10 / m). As a result, the solder resist layer formed as a result of the shielding mask is divided into four as shown in Fig. 1. There is a 200 / zm wide uncoated solder resist layer between the cutting areas. (Zoned section). After being formed into a four-part solder resist layer, the area where the solder resist resist layer is not covered and the zoned part of the solder resist resist layer are treated with gold after forging. Bend the entire film carrier tape. The obtained film support tape for mounting electronic parts on the film near the central portion in the longitudinal direction was arbitrarily selected, and 12 of 6 rows were arbitrarily selected. The bending deformation of these film supports was measured. The results are shown in Table 1. In addition, in Table 1, it is described that the upper layer and the lower layer are arranged as shown in Fig. I in order to distinguish the film carrying tape on the upper side from the film carrying tape on the lower side of the film carrying tape and the film carrying tape for mounting electronic parts of the present invention. The orientation of the process tape is not relevant. 0 Table 1 The first, second, third, fourth, fifth, and sixth sixth blocks average 0.35mm -0.005mm 0 * 015mm 0.023mm 0.150mm 0 »071mm 0.035mm IP030054 / SF-969f 17 200407248 lower layer 0.012mm (K051mm -〇〇19mm -0.016mm 0.017mm

比較例I ;實％例1巾除未分割敕焊抗歸j層以外係同樣製造了電子零 件安裝用薄膜承載膠帶。 對獲得的電零件安裝用薄膜承載朦帶，與實施例同樣隨意地選擇 連續6排12瓣麻載，晰料薄齡載之彎曲變形。 結果記載於表2。Comparative Example I: Example 1 Except that the solder resist layer was not divided, a film carrier tape for electronic component mounting was also manufactured in the same manner. As for the obtained film-bearing matting tape for mounting electric parts, as in the embodiment, 6 consecutive rows of 12 petals were arbitrarily selected, and the bending deformation of the thin-film load was clearly defined. The results are described in Table 2.

比較上述表1與表2可明白看出，由於4分割之軟焊抗姓劑層， 薄膜承載之彎曲變形量之平均值可降低一半以下。Comparing Table 1 and Table 2 above, it can be clearly seen that the average value of the amount of bending deformation carried by the film can be reduced by less than half due to the 4-split solder resist layer.

【圖式簡單說明】 第1圖表示本發明電子零件安裝用薄膜承載膠帶之一例平視圖。 第2圖於第1圖的A-A剖面圖。 第3圖說明選出形成本發明電子零件安裝用薄膜承載膠帶的一個薄 膜承載說明圖。 第4圖於本發明中表示測定薄膜承載的彎曲變形方法圖。 第5圖表示除端子部以外，配線圖型之20%以上形成軟焊抗姓劑層 IP030054/SF-969f 18 200407248 之電子零件安裝用薄膜承載膠帶例圖。 第6圖表示軟焊抗餘劑層之劃區部剖面例圖。 【元件符號簡單說明】 10 電子零件安裝用薄膜承載膠帶 11 絕緣膠帶 12 薄膜承載 14 定位孔 15 配線圖形 16 端子部分(連接端子） 17 焊珠球 20 軟焊抗钱劑層 20a，20b，20c，20d A，B，C，D 劃區 W 劃區之間之距離 h0，hl 軟焊抗#劑層厚度 19 IP030054/SF-969f[Brief Description of the Drawings] FIG. 1 is a plan view showing an example of a film carrying tape for mounting electronic parts according to the present invention. Fig. 2 is a sectional view taken along the line A-A in Fig. 1. Fig. 3 is an explanatory diagram of a film supporting member selected to form the film supporting tape for mounting electronic parts of the present invention. Fig. 4 is a diagram showing a method for measuring the bending deformation carried by a film in the present invention. Fig. 5 shows an example of a film-bearing tape for mounting electronic components, in which a solder resist layer is formed in 20% or more of the wiring pattern except for the terminal portion. IP030054 / SF-969f 18 200407248. Fig. 6 is a cross-sectional view showing an example of a partitioned portion of a solder resist layer. [Simple description of component symbols] 10 Film carrying tape for electronic component installation 11 Insulating tape 12 Film carrying 14 Positioning hole 15 Wiring pattern 16 Terminal part (connection terminal) 17 Bead ball 20 Soldering anti-money layer 20a, 20b, 20c, 20d A, B, C, D zone W distance between zone h0, hl solder resistance # agent layer thickness 19 IP030054 / SF-969f

Claims (1)

I» I»200407248 拾、申請專利範圍： 、一種電子零件安裝用薄膜承載膠帶，係在長尺寸絕緣薄膜表面形成 由導電性金屬所成之多數配線圖型，其特微為 該各配線圖型除連接端子部分以外，各獨立地由軟焊抗钱劑層 所被覆，且形成在各個配線圖型表面的軟焊抗钱劑層係分割及/或 晝分為複數個。 2、 一種電子零件安裝用薄膜承載帶，係在長尺寸絕緣薄膜表面形成由 導電性金屬所成之多數配線圖型，且該配線圖型至少在該長尺寸之$ 絕緣薄膜橫向併設2個所成，其特徵為： 該各個配線圖型除連接端子部分以外，各獨立地由軟抗蝕劑層 所被覆’且形成在各個配線圖型表面的軟焊抗姓劑層係分割及/或 刀為卖^個0 3、 如申請專利範圍第1或£項之電子零件安裝用薄膜承载膠帶，其特 徵為在該各個配線圖型表面，分割及/或畫分軟焊抗姓劑層為2〜16 ^ 個所形成者。 S 4、 如申請專利範圍第1或2項之電子零件安裝用薄膜承載膠帶，其特 徵為於該薄縣射，分贼畫麵轉抗#繼，無分割或所 晝分的軟焊抗蝕劑層區鄰接的軟焊抗蝕劑層劃區之間隙在2〇v in〜50 /zm範圍内。 5如中請專利範11第1或2項之電子零件安裝用薄膜承載膠帶，其特 徵為該長尺寸之絕緣薄膜厚度為75//in以下。 IP030054/SF-969f 20 200407248 、如申請專利範圍第i或2項之電子零件安裝用薄膜承載膠帶，其特 戳為該i個薄膜承載之佔有面積與安裝於該薄膜承載膠帶的電子 零件之面積為大致相同。 7、如申請專利範圍第i或2項之電子零件安裝用薄膜承载膠帶，其特 徵為與安裝該薄膜承載之電子零件形成配線圖型的絕緣薄嫉表面 相反側的絕緣薄膜面，為了與該薄膜承载之外部電氣接觸而形成可 配置之金屬球。 8如申請專利範圍第1或2項之電子零件安裝用薄臈承載膠帶，其特I 徵為塗佈在該配線圖型表面的軟焊抗钱劑層於硬化後在配線圖型 上的劃區部分以外之平均厚度在3〜5_範圍内。 9如申請專利範圍第1或2項之電子零件安裝用薄臈承載谬帶’其特 徵為在除了連接端子部分以外之配線圖型區域部之施以上形成 有該軟焊抗餘劑層者。 IP030054/SF-969f 21I »I» 200407248 The scope of patent application: A film carrier tape for electronic component installation, which forms most wiring patterns made of conductive metal on the surface of long-size insulating films, and its special features are the wiring patterns Except for the connection terminal portion, each is independently covered by a soldering anti-money agent layer, and the soldering anti-money agent layer formed on the surface of each wiring pattern is divided and / or divided into a plurality of days. 2. A film carrier tape for mounting electronic parts, which is formed on the surface of a long-sized insulating film by a plurality of wiring patterns made of a conductive metal, and the wiring pattern is at least 2 pieces of the long-sized insulating film in the horizontal direction. It is characterized in that each wiring pattern is separately covered by a soft resist layer except for the connection terminal portion, and the solder resist layer on the surface of each wiring pattern is divided and / or a knife is Sell ^ 0 3. If the thin film carrier tape for electronic component mounting according to item 1 or £ of the patent application scope, it is characterized in that the surface of each wiring pattern is divided and / or divided into a solder resist layer of 2 ~ 16 ^ formers. S 4. If the thin film carrier tape for electronic component installation is applied for item 1 or 2 of the scope of patent application, it is characterized by shooting in the thin county, turning the screen of the thief into ##, no split or daytime soldering resist The gaps between the solder resist layered areas adjacent to the layer areas are in the range of 20 volts to 50 / zm. 5 As described in Patent Application No. 1 or 2 of the film carrying tape for mounting electronic parts, the long insulation film thickness is 75 // in or less. IP030054 / SF-969f 20 200407248, such as the application of the patent application scope item i or 2 of the film carrier tape for electronic component installation, the special stamp is the area occupied by the i film carrier and the area of the electronic parts installed on the film carrier tape Are roughly the same. 7. The film-bearing tape for mounting electronic parts, such as the item i or 2 of the scope of patent application, is characterized by an insulating film surface on the opposite side of the insulating thin surface forming a wiring pattern with the electronic part on which the film-bearing is mounted. External electrical contact carried by the film forms a configurable metal ball. 8 If the thin tape carrier tape for electronic component mounting according to item 1 or 2 of the patent application scope, the characteristic is the marking of the soldering anti-money agent layer coated on the surface of the wiring pattern after hardening on the wiring pattern. The average thickness outside the zone is in the range of 3 to 5 mm. 9 If the thin-film load-bearing tape for mounting electronic parts according to item 1 or 2 of the application scope is patented, it is characterized in that the solder resist layer is formed on the wiring pattern area portion other than the connection terminal portion. IP030054 / SF-969f 21
TW092131060A 2002-11-07 2003-11-06 Film carrier tape for mounting electronic parts TWI284106B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002324445A JP3914135B2 (en) 2002-11-07 2002-11-07 Film carrier tape for mounting electronic components

Publications (2)

Publication Number Publication Date
TW200407248A true TW200407248A (en) 2004-05-16
TWI284106B TWI284106B (en) 2007-07-21

Family

ID=32310448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131060A TWI284106B (en) 2002-11-07 2003-11-06 Film carrier tape for mounting electronic parts

Country Status (6)

Country Link
US (1) US20060118457A1 (en)
JP (1) JP3914135B2 (en)
KR (1) KR100713509B1 (en)
CN (1) CN100377325C (en)
TW (1) TWI284106B (en)
WO (1) WO2004042814A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048272B2 (en) * 2008-09-25 2015-06-02 Illinois Tool Works Inc. Devices and method for handling microelectronics assemblies
TWI412818B (en) * 2009-09-15 2013-10-21 Chunghwa Picture Tubes Ltd Wiring structure for liquid crystal display panel
CN102543765B (en) * 2012-01-13 2014-12-10 迈普通信技术股份有限公司 Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board
CN105451458B (en) * 2014-08-19 2018-10-30 宁波舜宇光电信息有限公司 A kind of method and PCB substrate semi-finished product of control Rigid Flex micro-deformation
CN105552048A (en) * 2016-01-28 2016-05-04 珠海格力节能环保制冷技术研究中心有限公司 Heat-conducting bonding pad and package structure of QFP chip with heat-conducting bonding pad
CN105611722A (en) * 2016-03-21 2016-05-25 安捷利电子科技（苏州）有限公司 Printed circuit board of MEMS product
CN109714896B (en) * 2018-11-23 2021-03-19 广州广合科技股份有限公司 Method for improving local deformation of inner sleeve plate of large spliced board of multilayer printed circuit

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216573A (en) * 1984-04-12 1985-10-30 Seiko Epson Corp Manufacture of flexible printed circuit board
JPH0529395A (en) * 1991-07-22 1993-02-05 Mitsui Mining & Smelting Co Ltd Manufacture of tab tape
JP2737545B2 (en) * 1992-06-17 1998-04-08 日立電線株式会社 Film carrier tape for semiconductor device and method of manufacturing the same
JP3339387B2 (en) * 1997-11-07 2002-10-28 日立電線株式会社 Method for manufacturing TAB tape
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
JPH11307594A (en) * 1998-04-23 1999-11-05 Mitsui Mining & Smelting Co Ltd Film carrier tape for electronic component mounting and semiconductor device
CN1146030C (en) * 1998-07-28 2004-04-14 精工爱普生株式会社 Semiconductor device and manufacturing method thereof, semiconductor module, circuit board and electronic equipment
JP3457547B2 (en) * 1998-09-09 2003-10-20 松下電器産業株式会社 Semiconductor device, method of manufacturing the same, and film carrier
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP3827497B2 (en) * 1999-11-29 2006-09-27 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
JP2002190674A (en) * 2000-12-21 2002-07-05 Sony Chem Corp Method for manufacturing multilayer flexible circuit board
JP4701563B2 (en) * 2001-08-23 2011-06-15 日本テキサス・インスツルメンツ株式会社 Semiconductor chip mounting substrate and semiconductor device using the same

Also Published As

Publication number Publication date
KR20050053790A (en) 2005-06-08
JP2004158725A (en) 2004-06-03
CN1708841A (en) 2005-12-14
TWI284106B (en) 2007-07-21
US20060118457A1 (en) 2006-06-08
CN100377325C (en) 2008-03-26
JP3914135B2 (en) 2007-05-16
KR100713509B1 (en) 2007-04-30
WO2004042814A1 (en) 2004-05-21

Similar Documents

Publication Publication Date Title
US20170265300A1 (en) Double-sided printed circuit board and method for manufacturing same
EP1895820B1 (en) Wired circuit board and production method thereof
KR100614864B1 (en) Printed wiring board and semiconductor device
US6992372B2 (en) Film carrier tape for mounting electronic devices thereon
JP2005191408A (en) Coil conductor, method for manufacturing the same, and electronic component using the same
US11682519B2 (en) Inductor component and method for manufacturing the same
US20080063838A1 (en) Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape
US20180332714A1 (en) Printed circuit board and method of fabricating the same
CN1329979C (en) Film carrier tape for electronic part and its producing method
TW200407248A (en) Film carrier tape for mounting electronic parts
US20070023877A1 (en) Chip on flex tape with dimension retention pattern
JPS60216573A (en) Manufacture of flexible printed circuit board
US20130153275A1 (en) Printed circuit board and method for manufacturing the same
KR102310015B1 (en) Electrode circuit for mobile antenna using metal mold and method for manufacturing the same
EP1665378A1 (en) Chip on flex tape with dimension retention pattern
JP5184578B2 (en) Printed wiring board
JP2826650B2 (en) Lead frame for semiconductor device
JP2002093861A (en) Bimetal tab and double-coated csp, bga tape, and method for manufacturing them
JP2009071066A (en) Chip on film (cof) wiring substrate and manufacturing method of the same
JPH0964108A (en) Tape carrier for tab
TW202326956A (en) Redistribution substrate and method of manufacturing same
JPH1117331A (en) Manufacture of flexible circuit board
JPH05251510A (en) Tab tape carrier and its production
JPS6265394A (en) Flexible circuit board
JPH0618220B2 (en) Chip on board

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees