TR200002520T2 - Glass fiber reinforced laminates, electronic circuit boards and methods for weaving a fabric. - Google Patents

Glass fiber reinforced laminates, electronic circuit boards and methods for weaving a fabric.

Info

Publication number
TR200002520T2
TR200002520T2 TR2000/02520T TR200002520T TR200002520T2 TR 200002520 T2 TR200002520 T2 TR 200002520T2 TR 2000/02520 T TR2000/02520 T TR 2000/02520T TR 200002520 T TR200002520 T TR 200002520T TR 200002520 T2 TR200002520 T2 TR 200002520T2
Authority
TR
Turkey
Prior art keywords
fabric
electronic circuit
circuit boards
inch2
approx
Prior art date
Application number
TR2000/02520T
Other languages
Turkish (tr)
Inventor
E. Novich Bruce
Wu Xiang
Original Assignee
Ppg Industries Ohio, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Industries Ohio, Inc. filed Critical Ppg Industries Ohio, Inc.
Publication of TR200002520T2 publication Critical patent/TR200002520T2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Abstract

Mevcut bulus, polimerik matris malzemesi ile uyumlu olan bir kaplamaya sahip E-cam elyaflar içeren bir ipligin bir güçlendirici dokuma kumasina sahip baskili elektronik devre kartlari için güçlendirilmis laminatlar saglar. Iplik 2 milimetre çapinda bir dahili hava püskürtme bölmesine ve yaklasik 274 metre/dakika (yaklasik 300) yard/dakika) iplik besleme hizinda ve yaklasik 310 kiloPaskal (yaklasik 45 Pound/inç2) ölçüsünde bir hava basincinda 20 santimetre uzunlugguna sahip olan bir supap çikis borusuna sahip bir igne hava püskürtme supap birimi kullanarak ölçülen agirlikça yüzde yaklasik 0.01 ila yaklasik 0.6 araliginda bir yanma kaybina ve yaklasik bir gram kuvvet/gram kütle'den daha büyük bir Hava Püskürtme Tasima Çekme Kuvvetine sahiptir. Laminat kumasin dolum dogrultusunda yaklasik 3x10 üzeri7 kilogram/metre kare'den (yaklasik 42.7 kpsi) daha büyük bir bükülme mukavemetine sahiptir. Alternatif olarak, laminat 288 C sicaklikta z-dogrultusunda yaklasik %4.5 ten daha DEVAMI VAR.The present invention provides reinforced laminates for printed electronic circuit boards with a reinforcing woven fabric of a yarn containing E-glass fibers with a coating compatible with the polymeric matrix material. The thread is a 2 millimeter diameter internal air spray chamber and a valve outlet pipe with a length of 20 centimeters at an air pressure of about 274 meters / minute (approx. 45 pounds / inch2) of yarn feed rate and an approximate 310 kiloPascals (approx. 45 Pounds / inch2). has a combustion loss in the range of about 0.01 to about 0.6 percent by weight, and an Air Spray Transport Pulling Force greater than about one gram force / gram mass, measured using a needle with an air injection valve unit. Laminate fabric has a bending strength greater than about 3x10 over 7 kilograms / square meter (about 42.7 kpsi) in the direction of filling. Alternatively, the laminate has more than 4.5% CONTINUE at z-direction at 288 C temperature.

TR2000/02520T 1998-03-03 1999-02-25 Glass fiber reinforced laminates, electronic circuit boards and methods for weaving a fabric. TR200002520T2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13

Publications (1)

Publication Number Publication Date
TR200002520T2 true TR200002520T2 (en) 2001-01-22

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2000/02520T TR200002520T2 (en) 1998-03-03 1999-02-25 Glass fiber reinforced laminates, electronic circuit boards and methods for weaving a fabric.

Country Status (16)

Country Link
EP (1) EP1060144A1 (en)
JP (1) JP2002505216A (en)
KR (1) KR20010041518A (en)
CN (1) CN1291963A (en)
AU (1) AU2788999A (en)
BR (1) BR9908520A (en)
CA (1) CA2320746A1 (en)
HU (1) HUP0101382A3 (en)
ID (1) ID26528A (en)
IL (1) IL137977A0 (en)
MX (2) MXPA00008517A (en)
NO (1) NO20004272L (en)
PL (1) PL342654A1 (en)
TR (1) TR200002520T2 (en)
TW (1) TW436422B (en)
WO (1) WO1999044959A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA01003660A (en) * 1999-07-30 2001-07-01 Impregnated glass fiber torones and products that include them
MXPA02001093A (en) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Impregnated glass fiber strands and products including the same.
WO2001009226A1 (en) * 1999-07-30 2001-02-08 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001249257A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068755A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (en) * 2006-11-13 2012-10-17 信越石英株式会社 Composite fabric and printed wiring board
DE102009045892A1 (en) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Polyarylene ether ketone film
KR101890915B1 (en) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 Polyarylene sulfide resin composition and formed article
CN103788583B (en) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 A kind of artificial synthesis stone of high-temperature resistant and antistatic and manufacturing process thereof
FR3020361B1 (en) * 2014-04-28 2016-05-06 Saint Gobain METHOD FOR MANUFACTURING THIN GLASS
US20180305252A1 (en) * 2015-11-02 2018-10-25 Central Glass Company, Limited Electromagnetic shielding metal-coated glass fiber filler, method for manufacturing electromagnetic shielding metal-coated glass fiber filler, and electromagnetic shielding resin article
CN105517322B (en) * 2015-11-30 2018-08-14 卢美珍 The fabric of printed circuit board covers the laminate structure of metal
CN105517321B (en) * 2015-11-30 2018-06-19 燕山大学里仁学院 The metal-clad board structure of electronic element packaging body
CN105517324B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad board structure of printed circuit board
CN105517325B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad structure of printed circuit board
CN105517323B (en) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 The laminated plate of the load conductor pattern of printed circuit board
CN105517332B (en) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 A kind of bonding sheet and preparation method thereof for Multi-layer force fit
JP7395476B2 (en) * 2017-08-07 2023-12-11 ゾルテック コーポレイション Filler sized with polyvinyl alcohol to strengthen plastics
CN110981223B (en) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 High-temperature-resistant glass fiber and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (en) * 1988-08-04 1990-02-08 Teldix Gmbh PCB
JPH0818853B2 (en) * 1989-11-15 1996-02-28 日東紡績株式会社 Glass cloth manufacturing method
JP3520604B2 (en) * 1995-05-23 2004-04-19 日立化成工業株式会社 Composite laminate
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
MXPA00008554A (en) 2001-03-01
JP2002505216A (en) 2002-02-19
CN1291963A (en) 2001-04-18
WO1999044959A1 (en) 1999-09-10
AU2788999A (en) 1999-09-20
IL137977A0 (en) 2001-10-31
MXPA00008517A (en) 2001-03-01
NO20004272D0 (en) 2000-08-25
CA2320746A1 (en) 1999-09-10
ID26528A (en) 2001-01-11
HUP0101382A2 (en) 2001-08-28
BR9908520A (en) 2000-10-24
EP1060144A1 (en) 2000-12-20
TW436422B (en) 2001-05-28
HUP0101382A3 (en) 2002-10-28
NO20004272L (en) 2000-11-01
PL342654A1 (en) 2001-07-02
KR20010041518A (en) 2001-05-25

Similar Documents

Publication Publication Date Title
TR200002520T2 (en) Glass fiber reinforced laminates, electronic circuit boards and methods for weaving a fabric.
Mouritz et al. A mechanistic approach to the properties of stitched laminates
CN201495357U (en) Radiation-resistant fabric
ATE296851T1 (en) COMPOSITE THREAD AND FIBER REINFORCED COMPOSITE MATERIALS MADE THEREFROM
Hu et al. Mechanical properties of composite materials made of 3D stitched woven-knitted preforms
Solaimurugan et al. Influence of in-plane fibre orientation on mode I interlaminar fracture toughness of stitched glass/polyester composites
TW200730692A (en) Carbon fibre bundle, pre-preg article and carbon fibre reinforced composite material
Zweben The flexural strength of aramid fiber composites
Roy et al. Effects of moisture on the mechanical properties of glass fibre reinforced vinylester resin composites
Owen Fatigue of carbon-fiber-reinforced plastics
CN206085840U (en) High performance knitting
KR20130003146A (en) A concrete composite having fiber for containment building of nuclear power plant
US20240043320A1 (en) Reinforcing glass fiber, chopped strand, fiber sheet, and rod
CN202329422U (en) Novel bulletproof structure
CN201428038Y (en) Tri-axial tricot fabric
Alford et al. Fibre toughening of MDF cement
Abounaim Process development for the manufacturing of flat knitted innovative 3D spacer fabrics for high performance composite applications
CN103465487B (en) A kind of manufacture method of weighing machine conveyer belt
CN110144728B (en) Polyimide fiber eyelet fabric
CN111172764B (en) Method for preparing Kevlar nanofiber/carbon nanotube composite reinforced fiber
Singletary et al. 3-D orthogonal woven soft body armor
CN220724463U (en) High-temperature-resistant glass fiber yarn
Gao et al. Experimental and Numerical Simulation of the Tensile Behaviour of a Biaxial Warp-knitted Composite
EP3841237A1 (en) Hybrid reinforcement fabric
CN114103156A (en) Production system and method for high-elasticity-modulus high-strength glass fiber laminated board