CN105517324B - The metal-clad board structure of printed circuit board - Google Patents
The metal-clad board structure of printed circuit board Download PDFInfo
- Publication number
- CN105517324B CN105517324B CN201510862532.0A CN201510862532A CN105517324B CN 105517324 B CN105517324 B CN 105517324B CN 201510862532 A CN201510862532 A CN 201510862532A CN 105517324 B CN105517324 B CN 105517324B
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- Prior art keywords
- metal
- fabric
- coat
- printed circuit
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/263—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acids; Salts or esters thereof
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/55—Epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
Abstract
The invention discloses a kind of metal-clad board structures of printed circuit board, including：Fabric is located at the most middle part of the printed circuit board；The fabric is to be constituted immersed with the fabric of resin combination, and the fabric has double-layer cavity structure comprising upper fabric surface and lower fabric surface, with 2~3 μm of gap between two fabric surfaces, filled with helium in gap；The upper fabric surface is by the sub- surface composition of polylith, between every piece of sublist face, retains the gap for having 2~3 μm；The lower fabric surface gradually increases and decreases along a predetermined direction density.The present invention is with high intensity, the selectivity of raising conductor installation, the advantageous effect concentrated heat dissipation and facilitate coating with certain elasticity.
Description
Technical field
The present invention relates to printed-board technology fields.It is more particularly related to which a kind of printed circuit board covers
Metal layer board structure.
Background technology
Printed circuit board (PCB circuit board), also known as printed circuit board are the suppliers of electronic component electrical connection.It
Development have more than 100 years history；Its design is mainly layout design；Major advantage using circuit board is to subtract significantly
Few mistake connected up and assemble, improves the gentle productive labor rate of Automated water.
In recent years, as the printed circuit board used in a large amount of electronic equipments such as intelligent hand, tablet computer, printed circuit board
It is formed by the way that conductive pattern is arranged on metal-clad board structure, wherein the important component metal-clad of printed circuit board
Board structure is typically to impregnate infiltration by resin combination to form prepreg in fabric substrate, by the prepreg upper layer of formation
Folded metal foil is fabricated, and in order to which printed circuit board upper conductor pattern is preferably bonded with metal-clad close structure, covers metal
Installation, thermal diffusivity, insulating properties and each sublayer of sublayer structure in the etching performance of laminar substrate structure, metal-clad substrate
The connection reliability of structure becomes particularly important.
Invention content
It is a still further object of the present invention to provide a kind of metal-clads of the printed circuit board with better insulation performance
Board structure, since fabric has double-layer cavity structure comprising upper fabric surface and lower fabric surface, two fabric tables
With 2~3 μm of gap between face, helium is filled in the gap, while both having ensured insulating properties, it may have certain bullet
Property, plating operation can be facilitated.
It is a still further object of the present invention to provide a kind of metal-clad board structure of the printed circuit board with high intensity,
Since upper fabric surface is by the sub- surface composition of polylith, between every piece of sublist face, the gap for there are 2~3 μm is retained so that the fabric
More resin combinations can be adsorbed in base, enhance its intensity.
In order to realize these purposes and other advantages according to the present invention, the present invention provides a kind of covering for printed circuit board
Metal layer board structure, including：
Fabric is located at the most middle part of the printed circuit board；
The fabric is the fabric composition immersed with resin combination, and the fabric has double-layer cavity knot
Structure comprising go up fabric surface and lower fabric surface, there is 2~3 μm of gap between two fabric surfaces, be filled in gap
Helium；
The upper fabric surface is by the sub- surface composition of polylith, between every piece of sublist face, retains the gap for having 2~3 μm；
The lower fabric surface gradually increases and decreases along a predetermined direction density.
Preferably, wherein the thickness of the upper fabric surface is 1.5~2 μm, and the thickness of lower fabric surface is 2.5~3
μm；
Wherein, second coat of metal is 3 μm close to the thickness of coating of upper fabric surface, close to the plating thickness of lower fabric surface
Degree is 2 μm.
Fabric is located at the most middle part of the printed circuit board；
Wherein, the fabric is the fabric composition immersed with resin combination, and the fabric has double-deck empty
Cavity configuration comprising go up fabric surface and lower fabric surface, there is 2~3 μm of gap between two fabric surfaces, filled out in gap
Filled with helium；
Wherein, the upper fabric surface is by the sub- surface composition of polylith, and between every piece of sublist face, retention has between 2~3 μm
Gap；The lower fabric surface gradually increases and decreases along a predetermined direction density.
Preferably, wherein the thickness of the upper fabric surface is 1.5~2 μm, and the thickness of lower fabric surface is 2.5~3
μm。
Preferably, wherein first coat of metal, to contain copper 35~40%, gold 20~25%, the conjunction that remaining is lead
Gold, and the thickness of first coat of metal is 5~6 μm；
Second coat of metal, to contain copper 40~50%, silver 5~25%, the alloy that remaining is tin；
Wherein, second coat of metal is located at most inner side, and first coat of metal is located at outermost；
Wherein, second coat of metal is 3 μm close to the thickness of coating of the upper fabric surface, close to the lower fabric surface
Thickness of coating be 2 μm.
Preferably, wherein further include the third coat of metal, for containing copper 45~55%, gold 5~10%, remaining be
The alloy of lead, and the thickness of the third coat of metal is 6~8 μm, the third coat of metal is covered in second metal
On coating surface.
Preferably, wherein first coat of metal, for containing copper 36~38%, tin 21~23%, remaining be lead
Alloy, and the thickness of first coat of metal be 5~6 μm.
Preferably, wherein first coat of metal, for containing copper 37%, tin 22%, the alloy that remaining is lead,
And the thickness of first coat of metal is 6 μm.
Preferably, wherein second coat of metal, for containing copper 42~48%, silver 10~20%, remaining be tin
Alloy.
Preferably, wherein second coat of metal, to contain copper 45%, silver 15%, the alloy that remaining is tin.
Preferably, wherein the third coat of metal, for containing copper 48~52%, gold 6~8%, remaining be lead
Alloy, and the thickness of the third coat of metal is 6~8 μm, the third coat of metal is covered in second coat of metal
On surface.
Preferably, wherein the third coat of metal, for containing copper 50%, gold 7%, the alloy that remaining is lead, and
The thickness of the third coat of metal is 6 μm, and the third coat of metal is covered on second metal coating surface.
The present invention includes at least following advantageous effect：
1, its surface of metal layer of the metal-clad board structure setting of printed circuit board provided by the invention is sprayed
Tin, avoiding copper face from being easy oxidation causes to be not easy upper tin, and the metal-clad that circuit board is improved by layer on surface of metal spray tin is folded
The solderability of plate；
2, the metal-clad board structure of printed circuit board provided by the invention, since fabric has double-layer cavity knot
Structure improves the insulation performance between the metallic plate of the fabric both sides；
3, the metal-clad board structure of printed circuit board provided by the invention, due in fabric both sides in both sides shape
At different thickness of coating, to facilitate the semiconductor original paper of selection installation different performance；
4, the metal-clad board structure of printed circuit board provided by the invention, since fabric includes upper fabric surface
It is filled with helium in gap with 2~3 μm of gap between two fabric surfaces with lower fabric surface, is ensureing insulating properties
While, it may have certain elasticity can facilitate plating operation；
5, the metal-clad board structure of printed circuit board provided by the invention, since fabric is immersed with resin group
The fabric for closing object is constituted, and containing the epoxy resin with naphthalene type skeleton in the resin combination, printed circuit board can be improved
Heat resistance；
6, the metal-clad board structure of printed circuit board provided by the invention, since upper fabric surface is by polylith sublist face
It forming, between every piece of sublist face, retains the gap for having 2~3 μm so that fabric can adsorb more resin combinations,
Enhance its intensity.
Description of the drawings
Fig. 1 is that the structure of the cross section of the metal-clad board structure of printed circuit board in one embodiment of the present of invention is shown
It is intended to；
Fig. 2 is the knot of the lower fabric surface of the metal-clad board structure of printed circuit board in one embodiment of the present of invention
Structure schematic diagram；
Fig. 3 is the knot of the upper fabric surface of the metal-clad board structure of printed circuit board in one embodiment of the present of invention
Structure schematic diagram.
Specific implementation mode
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art with reference to specification text
Word can be implemented according to this.
It is specific to wrap if Fig. 1, Fig. 2 and Fig. 3 show the metal-clad board structure of printed circuit board provided by the invention
It includes：
Fabric 1 is located at the most middle part of the printed circuit board；
Wherein, the fabric 1 is the fabric composition immersed with resin combination, and the fabric 1 has bilayer
Cavity structure comprising fabric surface 100 and lower fabric surface 110 are gone up, there is 2~3 μm of gap between two fabric surfaces,
Helium is filled in gap；So that while ensureing insulating properties, it may have certain elasticity can facilitate plating operation.
Wherein, the upper fabric surface 100 is made of polylith sublist face 101, and between every piece of sublist face 101, retention has 2~
3 μm of gap；The lower fabric surface 110 gradually increases and decreases along a predetermined direction density, can adsorb more resin groups in this way
Object is closed, enhances its intensity, and if gap is too big, it is also not all right, absorption resin combination can be caused to lead to fabric too much
It is too hard, the elasticity of fabric is reduced, influences the plating operation of the coat of metal, therefore the inventors discovered that, this numerical value model
It encloses just.
Wherein, the lower fabric surface 110 gradually increases and decreases along a predetermined direction density.It is such effect be can select by
More conductor materials are mounted on the larger side of density, can concentrate on this side in this way and handle heat dissipation.It improves and dissipates
The efficiency of heat, increases the service life of the metal-clad board structure of printed circuit board.
In wherein a kind of embodiment, for fabric, be not particularly limited, as long as with warp thread as such as plain weave and
The material that the substantially orthogonal mode of weft yarn is made into can use such as material made of inorfil, such as glass cloth or the like
Material, or the material made of organic fiber, such as aromatic polyamides cloth or the like material, the thickness of fabric is preferred
210~300 μm.
In wherein a kind of embodiment, the thickness of the upper fabric surface is 1.5~2 μm, and the thickness of lower fabric surface is
2.5~3 μm.Keep the thickness of fabric different, so as to according to the semiconductor element of installation different performance, in the fabric base
The both sides of layer form different thickness of coating.For example, the established angle of semiconductor original paper may be by different metal or alloy material
It is manufactured, then different mounting surfaces can be selected according to its different alloy material.
In another embodiment, further include：
First coat of metal 4, for containing copper 35~40%, gold 20~25%, the alloy that remaining is lead, and described first
The thickness of the coat of metal is 5~6 μm；
Second coat of metal 2, to contain copper 40~50%, silver 5~25%, the alloy that remaining is tin；
Wherein, second coat of metal 2 is located at most inner side, and first coat of metal 4 is located at outermost；
Wherein, second coat of metal 2 is 3 μm close to the thickness of coating of the upper fabric surface 100, close to the lower fabric
The thickness of coating on surface 110 is 2 μm.Different thickness of coating is formed in the both sides of fabric 1, to facilitate selection installation different
The semiconductor original paper of performance.For example, the established angle of semiconductor original paper may be made of different metal or alloy material, then
Different mounting surfaces can be selected according to its different alloy material.
Further include the third coat of metal 3 in wherein a kind of embodiment, for containing copper 45~55%, gold 5~10%,
Remaining is the alloy of lead, and the thickness of the third coat of metal 3 is 6~8 μm, and the third coat of metal 3 is covered in described
On second coat of metal, 2 surface.
In wherein a kind of embodiment, first coat of metal 4, for containing copper 36~38%, tin 21~23%, its
The remaining alloy for lead, and the thickness of first coat of metal 4 is 5~6 μm.
In wherein a kind of embodiment, second coat of metal 2, for containing copper 42~48%, silver 10~20%, its
The remaining alloy for tin.
In wherein a kind of embodiment, first coat of metal 4, for containing copper 37%, tin 22%, remaining be lead
Alloy, and the thickness of first coat of metal 4 is 6 μm.
In wherein a kind of embodiment, second coat of metal 2, for containing copper 45%, silver 15%, remaining be tin
Alloy.
In wherein a kind of embodiment, the third coat of metal 3, for containing copper 48~52%, gold 6~8%, remaining
For the alloy of lead, and the thickness of the third coat of metal 3 is 6~8 μm, and the third coat of metal 3 is covered in described second
On the surface of the coat of metal 2.
In wherein a kind of embodiment, the third coat of metal 3, for containing copper 50%, gold 7%, remaining be lead
Alloy, and the thickness of the third coat of metal 3 is 6 μm, the third coat of metal 3 is covered in second coat of metal 2
Surface on.
In another embodiment, the resin combination is epoxy resin and acrylic rubber with naphthalene type skeleton.
Also, this mode is a kind of explanation of preferred embodiments, and however, it is not limited to this.It in carrying out the present invention, can be according to making
The performance of user's demand fabric is different and selects different state sample implementations.
Wherein, the epoxy resin with naphthalene type skeleton can be a kind of or a variety of, can be with naphthalene type skeleton
Epoxy resin with without naphthalene type skeleton epoxy resin composition, or individually with naphthalene type skeleton epoxy
The combination of resin, still, wherein must it is at least one be the epoxy resin with naphthalene type skeleton, to improve printed circuit board
The heat resistance of metal-clad board structure, such as printed circuit board are mounted on the heat resistance in electronic product, or in circuit board
The upper heat resistance for carrying out scolding tin increases the service life of printed circuit board and uses sensitivity.
Wherein, do not have unsaturated bond as such as double bond, three keys, carbon in the ingredient of acrylic rubber between carbon atom
It is bonded by singly-bound between atom, avoids that there is unsaturated bond to be easy to aoxidize and make the metal-clad base of printed circuit board
Harden structure follows the string and becomes fragile, and influences the respective performances of printed circuit board.
As described above, according to the present invention, since fabric has double-layer cavity structure, the fabric two is improved
Insulation performance between the metallic plate of side；Fabric includes upper fabric surface and lower fabric surface, is had between two fabric surfaces
There is 2~3 μm of gap, helium is filled in gap, while ensureing insulating properties, it may have certain elasticity can facilitate plating
Layer operation；Since fabric is the fabric composition immersed with resin combination, containing in the resin combination has naphthalene type
The heat resistance of printed circuit board can be improved in the epoxy resin of skeleton；Due to forming different platings on both sides in fabric both sides
Layer thickness, to facilitate the semiconductor original paper of selection installation different performance.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (8)
1. a kind of metal-clad board structure of printed circuit board, which is characterized in that including：
Fabric is located at the most middle part of the printed circuit board；
Wherein, the fabric is the fabric composition immersed with resin combination, and the fabric has double-layer cavity knot
Structure comprising go up fabric surface and lower fabric surface, there is 2~3 μm of gap between two fabric surfaces, be filled in gap
Helium；
Wherein, the upper fabric surface is by the sub- surface composition of polylith, between every piece of sublist face, retains the gap for having 2~3 μm；Institute
Lower fabric surface is stated along a predetermined direction density gradually to increase and decrease.
2. the metal-clad board structure of printed circuit board as described in claim 1, which is characterized in that the upper fabric surface
Thickness be 1.5~2 μm, the thickness of lower fabric surface is 2.5~3 μm.
3. the metal-clad board structure of printed circuit board as described in claim 1, which is characterized in that further include：
First coat of metal, to contain copper 35~40%, gold 20~25%, the alloy that remaining is lead, and first metal
The thickness of coating is 5~6 μm；
Second coat of metal, to contain copper 40~50%, silver 5~25%, the alloy that remaining is tin；
Wherein, second coat of metal is located at most inner side, and first coat of metal is located at outermost；
Wherein, second coat of metal is 3 μm close to the thickness of coating of the upper fabric surface, close to the plating of the lower fabric surface
Layer thickness is 2 μm.
4. the metal-clad board structure of printed circuit board as claimed in claim 3, which is characterized in that further include third metal
Coating, to be 6 containing copper 45~55%, gold 5~10%, the alloy that remaining is lead, and the thickness of the third coat of metal
~8 μm, the third coat of metal is covered on second metal coating surface.
5. the metal-clad board structure of printed circuit board as claimed in claim 3, which is characterized in that second metal-plated
Layer, to contain copper 42~48%, silver 10~20%, the alloy that remaining is tin.
6. the metal-clad board structure of printed circuit board as claimed in claim 3, which is characterized in that second metal-plated
Layer, to contain copper 45%, silver 15%, the alloy that remaining is tin.
7. the metal-clad board structure of printed circuit board as claimed in claim 4, which is characterized in that the third metal-plated
Layer, to be 6~8 μ containing copper 48~52%, gold 6~8%, the alloy that remaining is lead, and the thickness of the third coat of metal
M, the third coat of metal are covered on second metal coating surface.
8. the metal-clad board structure of printed circuit board as claimed in claim 7, which is characterized in that the third metal-plated
Layer, to be 6 μm containing copper 50%, gold 7%, the alloy that remaining is lead, and the thickness of the third coat of metal, the third
The coat of metal is covered on second metal coating surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862532.0A CN105517324B (en) | 2015-11-30 | 2015-11-30 | The metal-clad board structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862532.0A CN105517324B (en) | 2015-11-30 | 2015-11-30 | The metal-clad board structure of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517324A CN105517324A (en) | 2016-04-20 |
| CN105517324B true CN105517324B (en) | 2018-07-24 |
Family
ID=55724847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510862532.0A Active CN105517324B (en) | 2015-11-30 | 2015-11-30 | The metal-clad board structure of printed circuit board |
Country Status (1)
| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
-
2015
- 2015-11-30 CN CN201510862532.0A patent/CN105517324B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517324A (en) | 2016-04-20 |
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Effective date of registration: 20200622 Address after: 230000 Small and Micro Enterprise Venture Base No.2 Weisi Road, Xiatang Town, Changfeng County, Hefei City, Anhui Province Patentee after: Anhui Hemei Material Technology Co., Ltd Address before: 536000, 8 floor, Ledu building, North West Bay Road, Beihai, the Guangxi Zhuang Autonomous Region Patentee before: Lu Meizhen |