NO20004272L - Fiberglass-reinforced laminates, electronic circuit boards and fabric composition methods - Google Patents

Fiberglass-reinforced laminates, electronic circuit boards and fabric composition methods

Info

Publication number
NO20004272L
NO20004272L NO20004272A NO20004272A NO20004272L NO 20004272 L NO20004272 L NO 20004272L NO 20004272 A NO20004272 A NO 20004272A NO 20004272 A NO20004272 A NO 20004272A NO 20004272 L NO20004272 L NO 20004272L
Authority
NO
Norway
Prior art keywords
yarn
air jet
laminate
fabric
fiberglass
Prior art date
Application number
NO20004272A
Other languages
Norwegian (no)
Other versions
NO20004272D0 (en
Inventor
Bruce E Novich
Xiang Wu
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of NO20004272D0 publication Critical patent/NO20004272D0/en
Publication of NO20004272L publication Critical patent/NO20004272L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Abstract

Armerte laminater for trykte kretskort har en vevet armeringstekstil av et garn omfattende E-glassfibre med et belegg som er kompatibelt med polymermatriksmaterialet. Gamet har et tap ved brenning i området rundt 0,01 til rundt 0,6 vekt% og en luftstråletransporttrekkraft lik større enn 100.000 g kraft pr. g masse garn ved bruk av en nåleluftstråledyseenhet med et indre luftstrålekammer med en diameter på 2 mm og et dyseutløpsrør med en lengde på 20 cm ved en garnmatehastighet på 274 m/min, og et lufttrykk rundt 310 kPa manometertrykk. Laminatet har en bøyestyrke i ryllretning for tekstilen som er sterrre enn rundt 3 x l O7 kg/m2. Garnbelegget kan omfatte polyester og en polymer valgt fra vinylpyrrolidonpolymerer, vinylalkoholpolymerer, stivelser og blandinger derav. Alternativt har laminatet en termisk ekspansjonskoeffisient i Z-retning på mindre enn rundt 4,5% ved en temperatur på 288°C.Reinforced printed circuit board laminates have a woven reinforcing fabric of a yarn comprising E-glass fibers with a coating compatible with the polymer matrix material. The game has a loss of firing in the range of about 0.01 to about 0.6% by weight and an air jet transport traction equal to greater than 100,000g of force per kilogram. g mass of yarn using a needle air jet nozzle unit with an internal air jet chamber of 2 mm diameter and a nozzle outlet tube of 20 cm length at a yarn feed rate of 274 m / min, and an air pressure of about 310 kPa gauge pressure. The laminate has a bending strength in rolling direction for the fabric which is larger than about 3 x 1 O7 kg / m2. The yarn coating may comprise polyester and a polymer selected from vinyl pyrrolidone polymers, vinyl alcohol polymers, starches and mixtures thereof. Alternatively, the laminate has a Z-thermal expansion coefficient of less than about 4.5% at a temperature of 288 ° C.

NO20004272A 1998-03-03 2000-08-25 Fiberglass-reinforced laminates, electronic circuit boards and fabric composition methods NO20004272L (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13
PCT/US1999/004086 WO1999044959A1 (en) 1998-03-03 1999-02-25 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

Publications (2)

Publication Number Publication Date
NO20004272D0 NO20004272D0 (en) 2000-08-25
NO20004272L true NO20004272L (en) 2000-11-01

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20004272A NO20004272L (en) 1998-03-03 2000-08-25 Fiberglass-reinforced laminates, electronic circuit boards and fabric composition methods

Country Status (16)

Country Link
EP (1) EP1060144A1 (en)
JP (1) JP2002505216A (en)
KR (1) KR20010041518A (en)
CN (1) CN1291963A (en)
AU (1) AU2788999A (en)
BR (1) BR9908520A (en)
CA (1) CA2320746A1 (en)
HU (1) HUP0101382A3 (en)
ID (1) ID26528A (en)
IL (1) IL137977A0 (en)
MX (2) MXPA00008517A (en)
NO (1) NO20004272L (en)
PL (1) PL342654A1 (en)
TR (1) TR200002520T2 (en)
TW (1) TW436422B (en)
WO (1) WO1999044959A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA01003660A (en) * 1999-07-30 2001-07-01 Impregnated glass fiber torones and products that include them
MXPA02001093A (en) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Impregnated glass fiber strands and products including the same.
WO2001009226A1 (en) * 1999-07-30 2001-02-08 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001249257A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068755A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (en) * 2006-11-13 2012-10-17 信越石英株式会社 Composite fabric and printed wiring board
DE102009045892A1 (en) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Polyarylene ether ketone film
KR101890915B1 (en) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 Polyarylene sulfide resin composition and formed article
CN103788583B (en) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 A kind of artificial synthesis stone of high-temperature resistant and antistatic and manufacturing process thereof
FR3020361B1 (en) * 2014-04-28 2016-05-06 Saint Gobain METHOD FOR MANUFACTURING THIN GLASS
US20180305252A1 (en) * 2015-11-02 2018-10-25 Central Glass Company, Limited Electromagnetic shielding metal-coated glass fiber filler, method for manufacturing electromagnetic shielding metal-coated glass fiber filler, and electromagnetic shielding resin article
CN105517322B (en) * 2015-11-30 2018-08-14 卢美珍 The fabric of printed circuit board covers the laminate structure of metal
CN105517321B (en) * 2015-11-30 2018-06-19 燕山大学里仁学院 The metal-clad board structure of electronic element packaging body
CN105517324B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad board structure of printed circuit board
CN105517325B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad structure of printed circuit board
CN105517323B (en) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 The laminated plate of the load conductor pattern of printed circuit board
CN105517332B (en) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 A kind of bonding sheet and preparation method thereof for Multi-layer force fit
JP7395476B2 (en) * 2017-08-07 2023-12-11 ゾルテック コーポレイション Filler sized with polyvinyl alcohol to strengthen plastics
CN110981223B (en) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 High-temperature-resistant glass fiber and preparation method thereof

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Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (en) * 1988-08-04 1990-02-08 Teldix Gmbh PCB
JPH0818853B2 (en) * 1989-11-15 1996-02-28 日東紡績株式会社 Glass cloth manufacturing method
JP3520604B2 (en) * 1995-05-23 2004-04-19 日立化成工業株式会社 Composite laminate
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
MXPA00008554A (en) 2001-03-01
TR200002520T2 (en) 2001-01-22
JP2002505216A (en) 2002-02-19
CN1291963A (en) 2001-04-18
WO1999044959A1 (en) 1999-09-10
AU2788999A (en) 1999-09-20
IL137977A0 (en) 2001-10-31
MXPA00008517A (en) 2001-03-01
NO20004272D0 (en) 2000-08-25
CA2320746A1 (en) 1999-09-10
ID26528A (en) 2001-01-11
HUP0101382A2 (en) 2001-08-28
BR9908520A (en) 2000-10-24
EP1060144A1 (en) 2000-12-20
TW436422B (en) 2001-05-28
HUP0101382A3 (en) 2002-10-28
PL342654A1 (en) 2001-07-02
KR20010041518A (en) 2001-05-25

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application