SI2880662T1 - Postopek za metaliziranje skoznjih kontaktnih mest - Google Patents

Postopek za metaliziranje skoznjih kontaktnih mest

Info

Publication number
SI2880662T1
SI2880662T1 SI201330765T SI201330765T SI2880662T1 SI 2880662 T1 SI2880662 T1 SI 2880662T1 SI 201330765 T SI201330765 T SI 201330765T SI 201330765 T SI201330765 T SI 201330765T SI 2880662 T1 SI2880662 T1 SI 2880662T1
Authority
SI
Slovenia
Prior art keywords
metalizing
plated
holes
metalizing plated
Prior art date
Application number
SI201330765T
Other languages
English (en)
Inventor
Alfred Thimm
Klaus Herrmann
Original Assignee
Ceramtec Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Gmbh filed Critical Ceramtec Gmbh
Publication of SI2880662T1 publication Critical patent/SI2880662T1/sl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
  • Civil Engineering (AREA)
SI201330765T 2012-07-30 2013-07-26 Postopek za metaliziranje skoznjih kontaktnih mest SI2880662T1 (sl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012213346 2012-07-30
EP13744488.1A EP2880662B1 (de) 2012-07-30 2013-07-26 Verfahren zur metallisierung von durchkontaktierungen
PCT/EP2013/065815 WO2014019956A1 (de) 2012-07-30 2013-07-26 Verfahren zur metallisierung von durchkontaktierungen

Publications (1)

Publication Number Publication Date
SI2880662T1 true SI2880662T1 (sl) 2017-10-30

Family

ID=48914253

Family Applications (1)

Application Number Title Priority Date Filing Date
SI201330765T SI2880662T1 (sl) 2012-07-30 2013-07-26 Postopek za metaliziranje skoznjih kontaktnih mest

Country Status (12)

Country Link
US (1) US10165681B2 (sl)
EP (1) EP2880662B1 (sl)
JP (2) JP2015528216A (sl)
KR (1) KR102100638B1 (sl)
CN (1) CN104508757B (sl)
DE (1) DE102013214664A1 (sl)
DK (1) DK2880662T3 (sl)
ES (1) ES2639292T3 (sl)
PH (1) PH12015500193B1 (sl)
SI (1) SI2880662T1 (sl)
TW (1) TWI587769B (sl)
WO (1) WO2014019956A1 (sl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI772655B (zh) * 2019-06-25 2022-08-01 凱鍶科技股份有限公司 抗氧化導電銅漿及其製造方法與應用

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830651A (en) * 1970-05-25 1974-08-20 Owens Illinois Inc Fine line electronic micro-circuitry printing pastes
DE2310062A1 (de) * 1973-02-28 1974-08-29 Siemens Ag Dickschichtschaltung auf keramiksubstrat mit durchkontaktierungen zwischen den leiterzuegen auf beiden seiten des substrates
WO1991019590A1 (en) * 1990-06-21 1991-12-26 Nippon Steel Welding Products & Engineering Co., Ltd. Method of manufacturing tube filled with powder and granular material
JP3037493B2 (ja) * 1992-01-13 2000-04-24 イビデン株式会社 スルーホールを有するセラミックス基板の製造方法
JPH0888453A (ja) * 1994-09-16 1996-04-02 Toshiba Corp セラミック回路基板およびセラミック回路基板の製造方法
JP3754748B2 (ja) * 1995-05-19 2006-03-15 ニッコー株式会社 スルーホール充填用導体ペースト、セラミック回路基板及びパッケージ基板
JPH1012045A (ja) * 1996-06-25 1998-01-16 Sumitomo Metal Mining Co Ltd 低温焼成用導電ペースト
JP3739600B2 (ja) * 1999-07-06 2006-01-25 太陽インキ製造株式会社 液状熱硬化性樹脂組成物及びそれを用いたプリント配線板の永久穴埋め方法
JP2002043740A (ja) * 2000-07-24 2002-02-08 Matsushita Electric Works Ltd セラミック基板のスルーホールへの金属充填方法
JP4753469B2 (ja) * 2000-12-26 2011-08-24 京セラ株式会社 配線基板並びにその製造方法
JP3734731B2 (ja) * 2001-09-06 2006-01-11 株式会社ノリタケカンパニーリミテド セラミック電子部品及びその製造方法
US6989110B2 (en) * 2003-06-13 2006-01-24 Murata Manufacturing Co., Ltd. Electroconductive paste and method of producing the same
JP2009289587A (ja) * 2008-05-29 2009-12-10 Kyoto Elex Kk 導電性ペースト組成物
WO2010100893A1 (ja) * 2009-03-06 2010-09-10 東洋アルミニウム株式会社 導電性ペースト組成物およびそれを用いて形成された導電性膜
WO2011001908A1 (ja) * 2009-07-01 2011-01-06 積水化学工業株式会社 導電性ペースト用バインダー樹脂、導電性ペースト及び太陽電池素子
KR101225497B1 (ko) * 2009-11-05 2013-01-23 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
TWI393517B (zh) * 2010-05-04 2013-04-11 Elite Material Co Ltd Method for manufacturing metal substrate
TWI423750B (zh) * 2010-09-24 2014-01-11 Kuang Hong Prec Co Ltd 非導電性載體形成電路結構之製造方法
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
JP5693940B2 (ja) * 2010-12-13 2015-04-01 株式会社トクヤマ セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法

Also Published As

Publication number Publication date
US10165681B2 (en) 2018-12-25
KR20150039217A (ko) 2015-04-09
ES2639292T3 (es) 2017-10-26
KR102100638B1 (ko) 2020-04-14
DE102013214664A1 (de) 2014-01-30
EP2880662B1 (de) 2017-06-28
TW201424500A (zh) 2014-06-16
JP2018164116A (ja) 2018-10-18
DK2880662T3 (en) 2017-10-16
EP2880662A1 (de) 2015-06-10
CN104508757B (zh) 2016-10-19
CN104508757A (zh) 2015-04-08
PH12015500193A1 (en) 2015-04-06
US20150282318A1 (en) 2015-10-01
PH12015500193B1 (en) 2015-04-06
TWI587769B (zh) 2017-06-11
JP2015528216A (ja) 2015-09-24
WO2014019956A1 (de) 2014-02-06

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