SI1846949T1 - Toplotno in električno prevodna naprava - Google Patents
Toplotno in električno prevodna napravaInfo
- Publication number
- SI1846949T1 SI1846949T1 SI200632288T SI200632288T SI1846949T1 SI 1846949 T1 SI1846949 T1 SI 1846949T1 SI 200632288 T SI200632288 T SI 200632288T SI 200632288 T SI200632288 T SI 200632288T SI 1846949 T1 SI1846949 T1 SI 1846949T1
- Authority
- SI
- Slovenia
- Prior art keywords
- thermally
- electrically conductive
- conductive apparatus
- electrically
- conductive
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64171105P | 2005-01-05 | 2005-01-05 | |
PCT/CA2006/000011 WO2006072176A1 (en) | 2005-01-05 | 2006-01-05 | Thermally and electrically conductive apparatus |
EP06701369.8A EP1846949B1 (en) | 2005-01-05 | 2006-01-05 | Thermally and electrically conductive apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SI1846949T1 true SI1846949T1 (sl) | 2018-11-30 |
Family
ID=36647392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI200632288T SI1846949T1 (sl) | 2005-01-05 | 2006-01-05 | Toplotno in električno prevodna naprava |
Country Status (11)
Country | Link |
---|---|
US (1) | US9111822B2 (sl) |
EP (2) | EP3413345A1 (sl) |
CA (1) | CA2606687C (sl) |
DK (1) | DK1846949T3 (sl) |
ES (1) | ES2690540T3 (sl) |
HU (1) | HUE042450T2 (sl) |
PL (1) | PL1846949T3 (sl) |
PT (1) | PT1846949T (sl) |
SI (1) | SI1846949T1 (sl) |
TR (1) | TR201815693T4 (sl) |
WO (1) | WO2006072176A1 (sl) |
Families Citing this family (51)
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US8013538B2 (en) | 2007-01-26 | 2011-09-06 | Integrated Illumination Systems, Inc. | TRI-light |
DE112008001425T5 (de) * | 2007-05-25 | 2010-04-15 | Molex Inc., Lisle | Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet |
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US9609720B2 (en) | 2011-07-26 | 2017-03-28 | Hunter Industries, Inc. | Systems and methods for providing power and data to lighting devices |
US8710770B2 (en) | 2011-07-26 | 2014-04-29 | Hunter Industries, Inc. | Systems and methods for providing power and data to lighting devices |
US10874003B2 (en) | 2011-07-26 | 2020-12-22 | Hunter Industries, Inc. | Systems and methods for providing power and data to devices |
US9521725B2 (en) | 2011-07-26 | 2016-12-13 | Hunter Industries, Inc. | Systems and methods for providing power and data to lighting devices |
US11917740B2 (en) | 2011-07-26 | 2024-02-27 | Hunter Industries, Inc. | Systems and methods for providing power and data to devices |
US20150237700A1 (en) | 2011-07-26 | 2015-08-20 | Hunter Industries, Inc. | Systems and methods to control color and brightness of lighting devices |
US9390998B2 (en) * | 2012-02-17 | 2016-07-12 | Invensas Corporation | Heat spreading substrate |
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US8894437B2 (en) | 2012-07-19 | 2014-11-25 | Integrated Illumination Systems, Inc. | Systems and methods for connector enabling vertical removal |
US9379578B2 (en) | 2012-11-19 | 2016-06-28 | Integrated Illumination Systems, Inc. | Systems and methods for multi-state power management |
US9420665B2 (en) | 2012-12-28 | 2016-08-16 | Integration Illumination Systems, Inc. | Systems and methods for continuous adjustment of reference signal to control chip |
US9485814B2 (en) | 2013-01-04 | 2016-11-01 | Integrated Illumination Systems, Inc. | Systems and methods for a hysteresis based driver using a LED as a voltage reference |
KR102034337B1 (ko) | 2013-01-14 | 2019-10-18 | 젠썸 인코포레이티드 | 전기 디바이스의 열전 기반 열 관리 |
KR102117141B1 (ko) * | 2013-01-30 | 2020-05-29 | 젠썸 인코포레이티드 | 열전-기반 열 관리 시스템 |
US9258878B2 (en) * | 2013-02-13 | 2016-02-09 | Gerald Ho Kim | Isolation of thermal ground for multiple heat-generating devices on a substrate |
CN205669800U (zh) * | 2013-06-26 | 2016-11-02 | 皇家飞利浦有限公司 | 模块化热耗散组装件以及包括该组装件的照明器和筒灯 |
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KR101592649B1 (ko) | 2013-12-24 | 2016-02-12 | 현대자동차주식회사 | 헤드램프용 레이저 광학계 |
CN110233308A (zh) | 2014-09-12 | 2019-09-13 | 詹思姆公司 | 石墨热电和/或电阻热管理***和方法 |
FR3034171B1 (fr) * | 2015-03-23 | 2021-03-19 | Valeo Vision | Support de led avec surface de reception et connexion electrique par pontage |
US10918030B2 (en) | 2015-05-26 | 2021-02-16 | Hunter Industries, Inc. | Decoder systems and methods for irrigation control |
US10228711B2 (en) | 2015-05-26 | 2019-03-12 | Hunter Industries, Inc. | Decoder systems and methods for irrigation control |
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US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
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CN112705423B (zh) * | 2021-01-18 | 2021-11-12 | 济南法诺商贸有限公司 | 一种智能芯片制造设备及制造方法 |
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-
2006
- 2006-01-05 CA CA2606687A patent/CA2606687C/en active Active
- 2006-01-05 PT PT06701369T patent/PT1846949T/pt unknown
- 2006-01-05 DK DK06701369.8T patent/DK1846949T3/en active
- 2006-01-05 HU HUE06701369A patent/HUE042450T2/hu unknown
- 2006-01-05 PL PL06701369T patent/PL1846949T3/pl unknown
- 2006-01-05 US US10/567,179 patent/US9111822B2/en active Active
- 2006-01-05 SI SI200632288T patent/SI1846949T1/sl unknown
- 2006-01-05 EP EP18178980.1A patent/EP3413345A1/en active Pending
- 2006-01-05 ES ES06701369.8T patent/ES2690540T3/es active Active
- 2006-01-05 TR TR2018/15693T patent/TR201815693T4/tr unknown
- 2006-01-05 EP EP06701369.8A patent/EP1846949B1/en active Active
- 2006-01-05 WO PCT/CA2006/000011 patent/WO2006072176A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP3413345A1 (en) | 2018-12-12 |
CA2606687C (en) | 2015-08-11 |
HUE042450T2 (hu) | 2019-06-28 |
PL1846949T3 (pl) | 2019-01-31 |
EP1846949B1 (en) | 2018-08-22 |
EP1846949A4 (en) | 2012-11-14 |
WO2006072176A1 (en) | 2006-07-13 |
US9111822B2 (en) | 2015-08-18 |
DK1846949T3 (en) | 2018-10-15 |
ES2690540T3 (es) | 2018-11-21 |
EP1846949A1 (en) | 2007-10-24 |
PT1846949T (pt) | 2018-11-29 |
TR201815693T4 (tr) | 2018-11-21 |
US20080239675A1 (en) | 2008-10-02 |
CA2606687A1 (en) | 2006-07-13 |
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