SG84568A1 - Flip chip bump bonding - Google Patents

Flip chip bump bonding

Info

Publication number
SG84568A1
SG84568A1 SG200000865A SG200000865A SG84568A1 SG 84568 A1 SG84568 A1 SG 84568A1 SG 200000865 A SG200000865 A SG 200000865A SG 200000865 A SG200000865 A SG 200000865A SG 84568 A1 SG84568 A1 SG 84568A1
Authority
SG
Singapore
Prior art keywords
photoresist
ubm
capping layer
chip
solder
Prior art date
Application number
SG200000865A
Other languages
English (en)
Inventor
Degani Yinon
Paul Kossives Dean
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of SG84568A1 publication Critical patent/SG84568A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
SG200000865A 1999-02-23 2000-02-17 Flip chip bump bonding SG84568A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/256,443 US6232212B1 (en) 1999-02-23 1999-02-23 Flip chip bump bonding

Publications (1)

Publication Number Publication Date
SG84568A1 true SG84568A1 (en) 2001-11-20

Family

ID=22972258

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000865A SG84568A1 (en) 1999-02-23 2000-02-17 Flip chip bump bonding

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EP1032030A2 (de) 2000-08-30
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