SG144725A1 - Apparatus for mounting component - Google Patents

Apparatus for mounting component

Info

Publication number
SG144725A1
SG144725A1 SG200405891-3A SG2004058913A SG144725A1 SG 144725 A1 SG144725 A1 SG 144725A1 SG 2004058913 A SG2004058913 A SG 2004058913A SG 144725 A1 SG144725 A1 SG 144725A1
Authority
SG
Singapore
Prior art keywords
component
placement
station
head
transfer
Prior art date
Application number
SG200405891-3A
Other languages
English (en)
Inventor
Yasuharu Ueno
Shozo Minamitani
Shinji Kanayama
Takashi Shimizu
Satoshi Sida
Shunji Onobori
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG144725A1 publication Critical patent/SG144725A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
SG200405891-3A 2000-03-23 2001-03-23 Apparatus for mounting component SG144725A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000082263A JP4480840B2 (ja) 2000-03-23 2000-03-23 部品実装装置、及び部品実装方法

Publications (1)

Publication Number Publication Date
SG144725A1 true SG144725A1 (en) 2008-08-28

Family

ID=18599093

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405891-3A SG144725A1 (en) 2000-03-23 2001-03-23 Apparatus for mounting component

Country Status (6)

Country Link
US (2) US7020953B2 (ja)
EP (2) EP1269812B1 (ja)
JP (1) JP4480840B2 (ja)
DE (2) DE60112416T2 (ja)
SG (1) SG144725A1 (ja)
WO (1) WO2001072097A2 (ja)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060395A (ja) * 2001-08-10 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装装置
US20030086089A1 (en) * 2001-11-02 2003-05-08 Mike Carlomagno System and method for rapid alignment and accurate placement of electronic components on a printed circuit board
EP1559302A1 (en) * 2002-11-08 2005-08-03 Assembléon N.V. Method for moving at least two elements of a placement machine as well as such a placement machine
TW200419640A (en) * 2003-02-25 2004-10-01 Matsushita Electric Ind Co Ltd Electronic component placement machine and electronic component placement method
US7754832B2 (en) * 2003-02-28 2010-07-13 The Regents Of The University Of California Block copolyolefins possessing a tapered structure
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP3876920B2 (ja) * 2003-08-20 2007-02-07 株式会社村田製作所 部品装着装置及び部品装着方法
JP4390503B2 (ja) 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
JP4516354B2 (ja) * 2004-05-17 2010-08-04 パナソニック株式会社 部品供給方法
EP1694107A1 (de) * 2005-02-17 2006-08-23 KLARER, Christoph Vorrichtung und Verfahren zur Aufnahme und Übergabe eines elektronischen Bauteils
JP4555118B2 (ja) 2005-02-22 2010-09-29 パナソニック株式会社 部品装着装置及び部品保持部材の判別方法
JP2006268090A (ja) * 2005-03-22 2006-10-05 Fujitsu Ltd Ｒｆｉｄタグ
US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
JP4912900B2 (ja) * 2006-02-03 2012-04-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
NL1032810C2 (nl) * 2006-11-03 2008-05-06 Assembleon Bv Werkwijze voor het plaatsen van een component op een substraat alsmede een dergelijke inrichting.
JP4765942B2 (ja) * 2007-01-10 2011-09-07 株式会社デンソー 監視装置と監視方法、および制御装置と制御方法
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
JP2009111312A (ja) * 2007-11-01 2009-05-21 Trinc:Kk チップマウンター
US8215005B2 (en) * 2007-12-03 2012-07-10 Panasonic Corporation Chip mounting system
CN101600336A (zh) * 2008-06-04 2009-12-09 鸿富锦精密工业（深圳）有限公司 散热器安装治具
KR20100033200A (ko) * 2008-09-19 2010-03-29 삼성전자주식회사 반도체 패키지 제조 장치 및 방법
JP4788759B2 (ja) * 2008-11-20 2011-10-05 パナソニック株式会社 部品実装装置
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
KR101710631B1 (ko) * 2010-12-23 2017-03-08 삼성전자주식회사 손 떨림 보정 모듈을 구비하는 디지털 영상 촬영 장치 및 이의 제어 방법
KR20120096727A (ko) * 2011-02-23 2012-08-31 삼성테크윈 주식회사 베어 다이를 픽업 및 실장하기 위한 장치 및 방법
JP5691001B2 (ja) * 2011-11-08 2015-04-01 パナソニックＩｐマネジメント株式会社 反転ヘッド
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
US9788470B2 (en) * 2012-10-29 2017-10-10 Fuji Machine Mfg. Co., Ltd. Component supply device
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
US9015928B2 (en) * 2013-07-25 2015-04-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus
EP3057392B1 (en) * 2013-10-11 2020-07-08 FUJI Corporation Suction nozzle and component mounting apparatus
JP6115617B2 (ja) * 2015-11-16 2017-04-19 Tdk株式会社 実装装置
KR102180449B1 (ko) * 2016-05-13 2020-11-19 에이에스엠엘 네델란즈 비.브이. 구성요소 스태킹 및/또는 픽-앤드-플레이스 공정을 위한 다수 미니어처 픽업 요소들
US11164765B2 (en) 2016-07-13 2021-11-02 Universal Instruments Corporation Modular die handling system
CN106228913B (zh) * 2016-08-24 2022-12-30 京东方科技集团股份有限公司 转印设备及其转印方法
CN107514555B (zh) * 2017-08-08 2020-06-19 浙江美科电器有限公司 Led灯条制造装置
CN107543059B (zh) * 2017-08-08 2019-04-12 浙江美科电器有限公司 高效率灯带生产装置
CN107366849B (zh) * 2017-08-08 2019-06-11 浙江美科电器有限公司 灯条生产设备
CN109773474B (zh) * 2017-11-13 2021-07-13 宁波舜宇光电信息有限公司 光学组件的组装设备及组装方法
US20220059406A1 (en) * 2020-08-21 2022-02-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
CN112261865B (zh) * 2020-10-13 2023-06-20 常州铭赛机器人科技股份有限公司 表面贴装设备及表面贴装方法
CN114521103B (zh) * 2022-03-26 2024-01-26 宁波诚兴道电子科技有限公司 一种pcba线路板自动贴片设备及工艺
CN114828445B (zh) * 2022-05-24 2023-09-15 苏州创阈星智能科技有限公司 一种安装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0256944A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置
WO1997038567A1 (en) * 1996-03-27 1997-10-16 Philips Electronics N.V. Method of placing a component on a substrate and component placement machine for carrying out the method
WO1999043192A1 (de) * 1998-02-17 1999-08-26 Datacon Semiconductor Equipment Gmbh Einrichtung zum positionieren von auf einer folie angeordneten elktronischen schaltungen

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
US5342460A (en) * 1989-06-13 1994-08-30 Matsushita Electric Industrial Co., Ltd. Outer lead bonding apparatus
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
JP3159266B2 (ja) * 1991-02-14 2001-04-23 三洋電機株式会社 作業装置
DE69300850T2 (de) * 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JPH07153784A (ja) 1993-11-29 1995-06-16 Sony Corp ベアチップのプリント基板への実装方法及びフリップチップボンダー
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP3132353B2 (ja) * 1995-08-24 2001-02-05 松下電器産業株式会社 チップの搭載装置および搭載方法
JP3402876B2 (ja) * 1995-10-04 2003-05-06 ヤマハ発動機株式会社 表面実装機
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法
JP2001060795A (ja) * 1999-08-20 2001-03-06 Matsushita Electric Ind Co Ltd 電子部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0256944A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置
WO1997038567A1 (en) * 1996-03-27 1997-10-16 Philips Electronics N.V. Method of placing a component on a substrate and component placement machine for carrying out the method
WO1999043192A1 (de) * 1998-02-17 1999-08-26 Datacon Semiconductor Equipment Gmbh Einrichtung zum positionieren von auf einer folie angeordneten elktronischen schaltungen

Also Published As

Publication number Publication date
DE60143548D1 (de) 2011-01-05
WO2001072097A2 (en) 2001-09-27
US20050283972A1 (en) 2005-12-29
EP1553815A3 (en) 2007-11-21
JP2001274596A (ja) 2001-10-05
JP4480840B2 (ja) 2010-06-16
US7827677B2 (en) 2010-11-09
EP1269812A2 (en) 2003-01-02
US7020953B2 (en) 2006-04-04
EP1553815A2 (en) 2005-07-13
DE60112416D1 (de) 2005-09-08
EP1269812B1 (en) 2005-08-03
WO2001072097A3 (en) 2002-06-06
EP1553815B1 (en) 2010-11-24
DE60112416T2 (de) 2006-06-01
US20040020043A1 (en) 2004-02-05

Similar Documents

Publication Publication Date Title
SG144725A1 (en) Apparatus for mounting component
TW327268B (en) Alignment apparatus and method for placing modules on a circuit board
MY122343A (en) A method and apparatus for the transport and tracking of an electronic component.
GB2367191A (en) A method and apparatus for interconnecting multiple devices on a circuit board
ATE291830T1 (de) Vorrichtung und verfahren zur herstellung elektronischer schaltungen
GB0006418D0 (en) Antenna connector
ATE404355T1 (de) Vorrichtung zur herstellung von tabletten
EP1239719A3 (en) Method, apparatus, system, method and device for data creating, and program for mounting electronic component
WO2004017387A3 (en) Vision system
HK1045411A1 (zh) 電子裝置與所連的電池間通信的方法和裝置
MY143591A (en) Method and apparatus for the placement of electronic components, in particular semiconductor chips on a substrate
TW345520B (en) Method for mounting components and components mounting apparatus capable of shortening mounting tact time
MY137405A (en) Semiconductor apparatus with multiple delivery devices for components
WO2003049154A3 (en) Integrated circuit processing system
TW200502151A (en) Apparatus for transferring substrate in horizontal and vertical directions
TW200512856A (en) Component mounting apparatus and component mounting method
AU2002365778A1 (en) Electric circuit module and method for its assembly
EP1032251A3 (en) Electric-component mounting apparatus and electric-component mounting method
WO2003015154A1 (fr) Procede et support de carte sonde
KR950030759A (ko) 전자부품실장장치 및 전자부품실장방법
SG63840A1 (en) Apparatus and method for mounting semiconductor hips on a substrate
EP1303174A3 (en) Method and apparatus for removing heat from a component
EP0655401A3 (de) Verfahren zum Umsetzen von plattenförmigen Gegenständen, insbes. Leiterplatten, und Vorrichtung zur Durchführung des Verfahrens.
MY141441A (en) Method and apparatus for the placement of electronic components, in particular semiconductor chips, on a substrate
AU3051000A (en) Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on printed circuit and implementing device