SG127840A1 - Aqueous cleaning composition for semiconductor copper processing - Google Patents

Aqueous cleaning composition for semiconductor copper processing

Info

Publication number
SG127840A1
SG127840A1 SG200603385A SG200603385A SG127840A1 SG 127840 A1 SG127840 A1 SG 127840A1 SG 200603385 A SG200603385 A SG 200603385A SG 200603385 A SG200603385 A SG 200603385A SG 127840 A1 SG127840 A1 SG 127840A1
Authority
SG
Singapore
Prior art keywords
cleaning composition
aqueous cleaning
wafers
copper
copper processing
Prior art date
Application number
SG200603385A
Other languages
English (en)
Inventor
Chen Chien Ching
Liu Wen Cheng
Shiue Jing-Chiuan
Teng Yan Huo
Original Assignee
Epoch Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epoch Material Co Ltd filed Critical Epoch Material Co Ltd
Publication of SG127840A1 publication Critical patent/SG127840A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
SG200603385A 2005-05-19 2006-05-19 Aqueous cleaning composition for semiconductor copper processing SG127840A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094116223A TWI282363B (en) 2005-05-19 2005-05-19 Aqueous cleaning composition for semiconductor copper processing

Publications (1)

Publication Number Publication Date
SG127840A1 true SG127840A1 (en) 2006-12-29

Family

ID=37388370

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603385A SG127840A1 (en) 2005-05-19 2006-05-19 Aqueous cleaning composition for semiconductor copper processing

Country Status (8)

Country Link
US (1) US8063006B2 (fr)
JP (1) JP4475538B2 (fr)
KR (1) KR101083474B1 (fr)
DE (1) DE102006023506B4 (fr)
FR (1) FR2885910B1 (fr)
IT (1) ITMI20060968A1 (fr)
SG (1) SG127840A1 (fr)
TW (1) TWI282363B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007096711A2 (fr) * 2005-12-12 2007-08-30 Vitech International, Inc. Compositions nettoyantes, non corrosives et polyvalentes, et leurs procedes d'utilisation
KR100729235B1 (ko) * 2006-06-01 2007-06-15 삼성전자주식회사 프로브 카드용 세정액 조성물 및 이를 이용한 프로브카드의 세정 방법
TWI437093B (zh) * 2007-08-03 2014-05-11 Epoch Material Co Ltd 半導體銅製程用水相清洗組合物
JP6066552B2 (ja) * 2011-12-06 2017-01-25 関東化學株式会社 電子デバイス用洗浄液組成物
US20140264151A1 (en) 2013-03-15 2014-09-18 Cabot Microelectronics Corporation Aqueous cleaning composition for post copper chemical mechanical planarization
JP6203525B2 (ja) 2013-04-19 2017-09-27 関東化學株式会社 洗浄液組成物
US10961624B2 (en) * 2019-04-02 2021-03-30 Gelest Technologies, Inc. Process for pulsed thin film deposition

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10171130A (ja) * 1996-12-10 1998-06-26 Fuji Film Oorin Kk フォトレジスト剥離液
EP1031884A2 (fr) * 1999-02-25 2000-08-30 Mitsubishi Gas Chemical Company, Inc. Agent pour le retrait d'un photoresist et procédé de fabrication de dispositifs semi-conducteurs utilisant ledit agent
US6372050B2 (en) * 1997-05-05 2002-04-16 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
JP2003292993A (ja) * 2002-04-03 2003-10-15 Tosoh Corp 洗浄剤
US20040029051A1 (en) * 2000-06-28 2004-02-12 Tatsuya Koita Stripping agent composition and method of stripping
US6825156B2 (en) * 2002-06-06 2004-11-30 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US20050096237A1 (en) * 2003-10-30 2005-05-05 Nissan Chemical Industries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
JP2005336342A (ja) * 2004-05-27 2005-12-08 Tosoh Corp 洗浄用組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349925A (ja) * 1998-06-05 1999-12-21 Fujimi Inc エッジポリッシング用組成物
DE19947845A1 (de) * 1999-10-05 2001-04-12 Basf Ag Verfahren zum Entfernen von COS aus einem Kohlenwasserstoff-Fluidstrom und Waschflüssikgkeit zur Verwendung in derartigen Verfahren
MY143399A (en) * 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
DE10210729A1 (de) * 2002-03-12 2003-10-02 Basf Ag Verfahren zum Entsäuern eines Fluidstroms und Waschflüssigkeit zur Verwendung in einem derartigen Verfahren
JP2004101849A (ja) * 2002-09-09 2004-04-02 Mitsubishi Gas Chem Co Inc 洗浄剤組成物
US6803353B2 (en) * 2002-11-12 2004-10-12 Atofina Chemicals, Inc. Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
JP4359754B2 (ja) * 2003-07-03 2009-11-04 三菱瓦斯化学株式会社 基板の洗浄剤
DE10338563A1 (de) * 2003-08-22 2005-03-17 Basf Ag Verfahren zum Entsäuern eines Fluidstroms mittels Membraneinheiten aus inerten Gehäusen
US7247566B2 (en) * 2003-10-23 2007-07-24 Dupont Air Products Nanomaterials Llc CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
US7700533B2 (en) * 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10171130A (ja) * 1996-12-10 1998-06-26 Fuji Film Oorin Kk フォトレジスト剥離液
US6372050B2 (en) * 1997-05-05 2002-04-16 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
EP1031884A2 (fr) * 1999-02-25 2000-08-30 Mitsubishi Gas Chemical Company, Inc. Agent pour le retrait d'un photoresist et procédé de fabrication de dispositifs semi-conducteurs utilisant ledit agent
US20040029051A1 (en) * 2000-06-28 2004-02-12 Tatsuya Koita Stripping agent composition and method of stripping
JP2003292993A (ja) * 2002-04-03 2003-10-15 Tosoh Corp 洗浄剤
US6825156B2 (en) * 2002-06-06 2004-11-30 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US20050096237A1 (en) * 2003-10-30 2005-05-05 Nissan Chemical Industries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
JP2005336342A (ja) * 2004-05-27 2005-12-08 Tosoh Corp 洗浄用組成物

Also Published As

Publication number Publication date
JP4475538B2 (ja) 2010-06-09
KR101083474B1 (ko) 2011-11-16
JP2007002227A (ja) 2007-01-11
DE102006023506B4 (de) 2015-06-18
TW200641121A (en) 2006-12-01
US20070066508A1 (en) 2007-03-22
ITMI20060968A1 (it) 2006-11-20
TWI282363B (en) 2007-06-11
FR2885910A1 (fr) 2006-11-24
KR20060120443A (ko) 2006-11-27
FR2885910B1 (fr) 2012-02-03
DE102006023506A1 (de) 2007-01-11
US8063006B2 (en) 2011-11-22

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