SG11202003001VA - Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module - Google Patents
Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion moduleInfo
- Publication number
- SG11202003001VA SG11202003001VA SG11202003001VA SG11202003001VA SG11202003001VA SG 11202003001V A SG11202003001V A SG 11202003001VA SG 11202003001V A SG11202003001V A SG 11202003001VA SG 11202003001V A SG11202003001V A SG 11202003001VA SG 11202003001V A SG11202003001V A SG 11202003001VA
- Authority
- SG
- Singapore
- Prior art keywords
- conversion module
- thermoelectric conversion
- binder
- manufacturing
- module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017205096 | 2017-10-24 | ||
| PCT/JP2018/039507 WO2019082932A1 (en) | 2017-10-24 | 2018-10-24 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202003001VA true SG11202003001VA (en) | 2020-05-28 |
Family
ID=66247847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202003001VA SG11202003001VA (en) | 2017-10-24 | 2018-10-24 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11575076B2 (en) |
| EP (1) | EP3703140B1 (en) |
| JP (1) | JP7302478B2 (en) |
| KR (1) | KR20200070222A (en) |
| CN (1) | CN111247647A (en) |
| SG (1) | SG11202003001VA (en) |
| TW (1) | TW201933636A (en) |
| WO (1) | WO2019082932A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7315377B2 (en) * | 2018-10-05 | 2023-07-26 | 株式会社Kelk | thermoelectric module |
| EP4027397A4 (en) | 2019-09-05 | 2023-09-20 | Proterial, Ltd. | Method for manufacturing thermoelectric conversion module |
| KR20210081617A (en) * | 2019-12-24 | 2021-07-02 | 엘지이노텍 주식회사 | Thermo electric element |
| KR20210088980A (en) | 2020-01-07 | 2021-07-15 | 엘지이노텍 주식회사 | Thermo electric element |
| US11825745B2 (en) * | 2020-05-08 | 2023-11-21 | Micropower Global Limited | Thermoelectric element and method of making the same |
| KR20220037668A (en) * | 2020-09-18 | 2022-03-25 | 엘지이노텍 주식회사 | Thermo electric element |
| JP7248091B2 (en) * | 2021-02-03 | 2023-03-29 | 三菱マテリアル株式会社 | Thermoelectric conversion module and method for manufacturing thermoelectric conversion module |
| KR20230011131A (en) * | 2021-07-13 | 2023-01-20 | 현대자동차주식회사 | Thermoelectric module, and vehicle comprising the same |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293906A (en) | 1996-04-25 | 1997-11-11 | Osaka Gas Co Ltd | Thermoelectric converter |
| JP2004273489A (en) * | 2003-03-05 | 2004-09-30 | Atsushi Suzuki | Thermoelectric conversion module and its manufacturing method |
| JP4914705B2 (en) * | 2006-12-08 | 2012-04-11 | ハリマ化成株式会社 | Method for forming a fine copper-based wiring pattern |
| JP5427462B2 (en) * | 2008-07-02 | 2014-02-26 | 沖電気防災株式会社 | Thermoelectric conversion module |
| JP5011225B2 (en) | 2008-07-09 | 2012-08-29 | ニホンハンダ株式会社 | Metal member bonding agent, metal member bonded body manufacturing method, metal member bonded body, and electric circuit connecting bump manufacturing method |
| JP2010108958A (en) * | 2008-10-28 | 2010-05-13 | Kyocera Corp | Thermoelectric module, and method of manufacturing the same |
| US20130087180A1 (en) * | 2011-10-10 | 2013-04-11 | Perpetua Power Source Technologies, Inc. | Wearable thermoelectric generator system |
| WO2013059239A1 (en) * | 2011-10-20 | 2013-04-25 | Sheetak, Inc. | Improved thermoelectric energy converters and manufacturing method thereof |
| CN103311423B (en) * | 2012-02-17 | 2017-06-30 | 雅马哈株式会社 | The manufacture method of thermoelectric conversion component and thermoelectric conversion component |
| WO2015019871A1 (en) * | 2013-08-09 | 2015-02-12 | リンテック株式会社 | Thermoelectric conversion material and production method therefor |
| WO2017043545A1 (en) * | 2015-09-07 | 2017-03-16 | 日立化成株式会社 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device |
| EP3702072A1 (en) * | 2015-09-07 | 2020-09-02 | Hitachi Chemical Company, Ltd. | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
| JP2017059698A (en) * | 2015-09-17 | 2017-03-23 | 古河機械金属株式会社 | Manufacturing method for thermoelectric transducer |
| JP6721317B2 (en) | 2015-11-18 | 2020-07-15 | 日東電工株式会社 | Method of manufacturing semiconductor device |
| JP6458759B2 (en) * | 2016-03-31 | 2019-01-30 | 日立金属株式会社 | Stress relaxation structure and thermoelectric conversion module |
-
2018
- 2018-10-24 CN CN201880068703.4A patent/CN111247647A/en active Pending
- 2018-10-24 SG SG11202003001VA patent/SG11202003001VA/en unknown
- 2018-10-24 EP EP18870513.1A patent/EP3703140B1/en active Active
- 2018-10-24 US US16/758,166 patent/US11575076B2/en active Active
- 2018-10-24 KR KR1020207006565A patent/KR20200070222A/en not_active Application Discontinuation
- 2018-10-24 TW TW107137590A patent/TW201933636A/en unknown
- 2018-10-24 JP JP2019551205A patent/JP7302478B2/en active Active
- 2018-10-24 WO PCT/JP2018/039507 patent/WO2019082932A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN111247647A (en) | 2020-06-05 |
| EP3703140A4 (en) | 2021-08-04 |
| US20200295248A1 (en) | 2020-09-17 |
| EP3703140B1 (en) | 2023-11-22 |
| TW201933636A (en) | 2019-08-16 |
| KR20200070222A (en) | 2020-06-17 |
| JP7302478B2 (en) | 2023-07-04 |
| JPWO2019082932A1 (en) | 2020-11-12 |
| EP3703140A1 (en) | 2020-09-02 |
| US11575076B2 (en) | 2023-02-07 |
| WO2019082932A1 (en) | 2019-05-02 |
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