SG11201913093VA - Workpiece holding jig and electroplating apparatus - Google Patents

Workpiece holding jig and electroplating apparatus

Info

Publication number
SG11201913093VA
SG11201913093VA SG11201913093VA SG11201913093VA SG11201913093VA SG 11201913093V A SG11201913093V A SG 11201913093VA SG 11201913093V A SG11201913093V A SG 11201913093VA SG 11201913093V A SG11201913093V A SG 11201913093VA SG 11201913093V A SG11201913093V A SG 11201913093VA
Authority
SG
Singapore
Prior art keywords
holding jig
workpiece holding
electroplating apparatus
electroplating
workpiece
Prior art date
Application number
SG11201913093VA
Inventor
Kazuyoshi Nishimoto
Shinji Tachibana
Masahiro Murakoshi
Tomoji Okuda
Original Assignee
C Uyemura & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura & Co Ltd filed Critical C Uyemura & Co Ltd
Publication of SG11201913093VA publication Critical patent/SG11201913093VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
    • B65G49/0436—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
    • B65G49/0436—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath
    • B65G49/0472—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath along a non continuous circuit
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
SG11201913093VA 2017-07-25 2018-05-23 Workpiece holding jig and electroplating apparatus SG11201913093VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017143712A JP6893142B2 (en) 2017-07-25 2017-07-25 Work holding jig and electroplating equipment
PCT/JP2018/019842 WO2019021607A1 (en) 2017-07-25 2018-05-23 Work holding jig and electroplating apparatus

Publications (1)

Publication Number Publication Date
SG11201913093VA true SG11201913093VA (en) 2020-01-30

Family

ID=65040453

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201913093VA SG11201913093VA (en) 2017-07-25 2018-05-23 Workpiece holding jig and electroplating apparatus

Country Status (8)

Country Link
US (1) US20200149180A1 (en)
JP (1) JP6893142B2 (en)
KR (1) KR20200034964A (en)
CN (2) CN110959051A (en)
MY (1) MY201111A (en)
SG (1) SG11201913093VA (en)
TW (1) TWI759504B (en)
WO (1) WO2019021607A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7122235B2 (en) * 2018-11-26 2022-08-19 上村工業株式会社 holding jig
JP7132135B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7132136B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7132134B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7264780B2 (en) * 2019-09-10 2023-04-25 株式会社荏原製作所 Substrate holder, substrate plating device with same, and electrical contact
JP7421302B2 (en) 2019-10-07 2024-01-24 上村工業株式会社 Holding jig
JP7242516B2 (en) * 2019-12-13 2023-03-20 株式会社荏原製作所 substrate holder
KR20230027215A (en) * 2021-01-08 2023-02-27 가부시키가이샤 에바라 세이사꾸쇼 Substrate holder, plating device, plating method and storage medium
JP7194305B1 (en) * 2022-07-01 2022-12-21 株式会社荏原製作所 Substrate holder, plating equipment, and plating method
CN116897226B (en) * 2022-08-09 2024-03-22 株式会社荏原制作所 Plating apparatus and plating method

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784677B2 (en) 1991-03-06 1995-09-13 株式会社荏原製作所 Jig for semiconductor wafer plating
JP2704796B2 (en) 1991-04-22 1998-01-26 株式会社東芝 Jig for plating semiconductor wafers
JP2657342B2 (en) 1992-02-07 1997-09-24 株式会社荏原製作所 Semiconductor wafer sealing jig
JP2617848B2 (en) 1992-02-07 1997-06-04 株式会社荏原製作所 Jig for plating semiconductor wafers
US5660699A (en) * 1995-02-20 1997-08-26 Kao Corporation Electroplating apparatus
JPH11140694A (en) 1997-11-10 1999-05-25 Ebara Corp Jig for plating wafer
JP3847434B2 (en) 1997-12-15 2006-11-22 株式会社荏原製作所 Semiconductor wafer plating jig
JP2002327296A (en) * 2001-04-27 2002-11-15 Ins Japan Kk Horizontally movable plating equipment, and other horizontally moving method
JP2003226997A (en) * 2002-02-06 2003-08-15 Sony Corp Semi-conductor wafer plating tool
JP3778281B2 (en) * 2002-03-26 2006-05-24 株式会社荏原製作所 Substrate holder and plating apparatus
JP3588777B2 (en) * 2002-04-12 2004-11-17 株式会社山本鍍金試験器 Cathode cartridge for electroplating tester
TWI316097B (en) * 2002-06-21 2009-10-21 Ebara Corp Substrate holder and plating apparatus
US7727366B2 (en) * 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
JP2005220414A (en) * 2004-02-06 2005-08-18 Ebara Corp Plating apparatus
JP2008174818A (en) * 2007-01-22 2008-07-31 Dainippon Screen Mfg Co Ltd Substrate holding device and plating apparatus
US9512538B2 (en) * 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
JP5898540B2 (en) 2012-03-22 2016-04-06 アルメックスＰｅ株式会社 Work holding jig and surface treatment apparatus
US20170096744A1 (en) * 2014-03-27 2017-04-06 Jcu Corporation Packing for substrate plating jig and substrate plating jig using the same
JP6517574B2 (en) 2015-02-23 2019-05-22 京セラ株式会社 Electrolytic plating system
JP6411928B2 (en) 2015-03-24 2018-10-24 京セラ株式会社 Electrolytic plating equipment
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly

Also Published As

Publication number Publication date
MY201111A (en) 2024-02-06
CN110959051A (en) 2020-04-03
CN115449887A (en) 2022-12-09
US20200149180A1 (en) 2020-05-14
TW201908041A (en) 2019-03-01
TWI759504B (en) 2022-04-01
KR20200034964A (en) 2020-04-01
WO2019021607A1 (en) 2019-01-31
JP2019026863A (en) 2019-02-21
JP6893142B2 (en) 2021-06-23

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