SG11201911669SA - Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method - Google Patents

Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method

Info

Publication number
SG11201911669SA
SG11201911669SA SG11201911669SA SG11201911669SA SG11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA
Authority
SG
Singapore
Prior art keywords
semiconductor
defect detection
manufacturing
wafer
die bonder
Prior art date
Application number
SG11201911669SA
Inventor
Haruka TAI
Nobuhiro Nagamoto
Yoshikazu Shimokawa
Yoji Shimizu
Atsumasa Kambayashi
Original Assignee
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc filed Critical Canon Machinery Inc
Publication of SG11201911669SA publication Critical patent/SG11201911669SA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)
SG11201911669SA 2017-06-07 2018-06-01 Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method SG11201911669SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017112870 2017-06-07
PCT/JP2018/021298 WO2018225664A1 (en) 2017-06-07 2018-06-01 Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method

Publications (1)

Publication Number Publication Date
SG11201911669SA true SG11201911669SA (en) 2020-01-30

Family

ID=64566693

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201911669SA SG11201911669SA (en) 2017-06-07 2018-06-01 Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method

Country Status (4)

Country Link
JP (1) JP6595130B2 (en)
CN (1) CN110741464B (en)
SG (1) SG11201911669SA (en)
WO (1) WO2018225664A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110534462A (en) * 2019-09-06 2019-12-03 武汉新芯集成电路制造有限公司 The air blister defect detection method and system of wafer bonding technique
JP7206234B2 (en) * 2020-03-30 2023-01-17 日本碍子株式会社 Inspection method and inspection apparatus for columnar honeycomb structure made of ceramics
CN112711230B (en) * 2020-12-08 2022-12-13 占朗智能科技(上海)有限公司 Inspection process of automatic inspection equipment for workpiece production quality

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3898401B2 (en) * 1999-11-29 2007-03-28 株式会社日立ハイテクインスツルメンツ Parts supply device
JP2007107945A (en) * 2005-10-12 2007-04-26 Olympus Corp Inspection device of substrate
JP2007115870A (en) * 2005-10-20 2007-05-10 Shin Etsu Handotai Co Ltd Wafer crack inspecting apparatus, crack inspecting method and wafer manufacturing method
JP4631002B2 (en) * 2006-06-29 2011-02-16 独立行政法人産業技術総合研究所 Method for detecting defects and apparatus therefor
TWI428686B (en) * 2006-12-05 2014-03-01 Hoya Corp Photomask inspecting apparatus, photomask inspecting method, method of producing a photomask for use in manufacturing a liquid crystal device and pattern transferring method
JP4389982B2 (en) * 2007-08-09 2009-12-24 オムロン株式会社 Substrate visual inspection device
JP2009074825A (en) * 2007-09-19 2009-04-09 Seiko Epson Corp Defect inspection method and defect inspection device
JP5943742B2 (en) * 2012-07-04 2016-07-05 三菱電機株式会社 Semiconductor test jig and semiconductor test method using the same

Also Published As

Publication number Publication date
CN110741464A (en) 2020-01-31
JP6595130B2 (en) 2019-10-23
WO2018225664A1 (en) 2018-12-13
CN110741464B (en) 2021-03-19
JPWO2018225664A1 (en) 2019-06-27

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