SG11201908383VA - Heat resistant release sheet and method for manufacturing same - Google Patents

Heat resistant release sheet and method for manufacturing same

Info

Publication number
SG11201908383VA
SG11201908383VA SG11201908383VA SG11201908383VA SG 11201908383V A SG11201908383V A SG 11201908383VA SG 11201908383V A SG11201908383V A SG 11201908383VA SG 11201908383V A SG11201908383V A SG 11201908383VA
Authority
SG
Singapore
Prior art keywords
ptfe
heat resistant
release sheet
resistant release
layer
Prior art date
Application number
Inventor
Kurato Akiba
Yuta Kuroki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG11201908383VA publication Critical patent/SG11201908383VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B29K2027/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paper (AREA)

Abstract

A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is 10 less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature. 20
SG11201908383V 2017-03-30 2018-03-27 Heat resistant release sheet and method for manufacturing same SG11201908383VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017068007 2017-03-30
PCT/JP2018/012600 WO2018181403A1 (en) 2017-03-30 2018-03-27 Heat resistant release sheet and method for manufacturing same

Publications (1)

Publication Number Publication Date
SG11201908383VA true SG11201908383VA (en) 2019-10-30

Family

ID=63677603

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201908383V SG11201908383VA (en) 2017-03-30 2018-03-27 Heat resistant release sheet and method for manufacturing same
SG10201912661XA SG10201912661XA (en) 2017-03-30 2018-03-27 Heat resistant release sheet and method for manufacturing same

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201912661XA SG10201912661XA (en) 2017-03-30 2018-03-27 Heat resistant release sheet and method for manufacturing same

Country Status (8)

Country Link
US (1) US11123967B2 (en)
JP (2) JP6470442B2 (en)
KR (1) KR102544023B1 (en)
CN (2) CN113635641A (en)
PH (1) PH12019502085A1 (en)
SG (2) SG11201908383VA (en)
TW (2) TWI788093B (en)
WO (1) WO2018181403A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201908383VA (en) * 2017-03-30 2019-10-30 Nitto Denko Corp Heat resistant release sheet and method for manufacturing same
WO2020045338A1 (en) * 2018-08-30 2020-03-05 三井化学東セロ株式会社 Release film
EP3862160A4 (en) * 2018-10-04 2022-08-10 Nitto Denko Corporation Heat-resistant release sheet and thermocompression bonding method
JP7408286B2 (en) * 2019-03-11 2024-01-05 三井化学東セロ株式会社 Release film and electronic device manufacturing method
JP7393874B2 (en) * 2019-03-29 2023-12-07 三井化学東セロ株式会社 Release film and electronic device manufacturing method
WO2021166560A1 (en) * 2020-02-19 2021-08-26 三井化学東セロ株式会社 Release film and electronic device manufacturing method
JP2021181222A (en) * 2020-05-14 2021-11-25 日東電工株式会社 Heat-resistant buffer sheet, and heating-pressurizing method
WO2022029916A1 (en) * 2020-08-05 2022-02-10 株式会社新川 Mounting device and mounting method

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JPS61141532A (en) 1984-12-14 1986-06-28 Shin Etsu Chem Co Ltd Manufacture of laminated film
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JPS62162542A (en) * 1986-01-13 1987-07-18 宇部興産株式会社 Polyinide film with fluoroplastic layer
US4801506A (en) 1986-01-13 1989-01-31 Ube Industries, Ltd. Polyimide film having fluorocarbon resin layer
JPS62223236A (en) * 1986-03-26 1987-10-01 Toray Ind Inc Production of polyimide laminate
US5238748A (en) * 1989-02-23 1993-08-24 Chemfab Corporation Polyimide and fluoropolymer containing films and laminates
JPH0711028A (en) * 1993-06-29 1995-01-13 Shiga Pref Gov Formation of fluororesin coating film
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JPH08276547A (en) * 1995-04-06 1996-10-22 Kanegafuchi Chem Ind Co Ltd Modified polyimide/fluoroplastic laminated film
JP2000114319A (en) * 1998-09-30 2000-04-21 Hitachi Chem Co Ltd Manufacture of semiconductor device
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JP4684502B2 (en) * 2001-09-27 2011-05-18 日東電工株式会社 Conductive connection method and release sheet used therefor
JP2003285396A (en) * 2002-03-28 2003-10-07 Mitsubishi Plastics Ind Ltd Base material film for producing electrode film and/or electrolyte film and method for producing joined body of electrode film and electrolyte film
JP3791458B2 (en) * 2002-05-23 2006-06-28 旭硝子株式会社 Release film
KR200382573Y1 (en) * 2005-01-18 2005-04-22 유한회사 한국 타코닉 Release sheet used in OLB and TAB process
JP2008127471A (en) * 2006-11-21 2008-06-05 Du Pont Toray Co Ltd Polyimide film and coverlay and copper-clad laminate using the same
WO2010023907A1 (en) * 2008-08-28 2010-03-04 三井化学株式会社 Mold release film for manufacturing semiconductor resin package and semiconductor resin package manufacturing method using same
WO2014178151A1 (en) * 2013-04-30 2014-11-06 住友ベークライト株式会社 Release film and method for using release film
JP6357474B2 (en) * 2013-07-09 2018-07-11 日東電工株式会社 Adhesive sheet and use thereof
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Also Published As

Publication number Publication date
TW202208141A (en) 2022-03-01
TWI788093B (en) 2022-12-21
KR20190135499A (en) 2019-12-06
TWI762611B (en) 2022-05-01
CN113635641A (en) 2021-11-12
SG10201912661XA (en) 2020-03-30
PH12019502085A1 (en) 2020-03-09
KR102544023B1 (en) 2023-06-16
JP6470442B2 (en) 2019-02-13
US11123967B2 (en) 2021-09-21
TW201840411A (en) 2018-11-16
WO2018181403A1 (en) 2018-10-04
JP2018184008A (en) 2018-11-22
JP6470461B2 (en) 2019-02-13
CN110520296A (en) 2019-11-29
US20200101703A1 (en) 2020-04-02
JP2018171917A (en) 2018-11-08

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