SG11201907123PA - Improved probe card for high-frequency applications - Google Patents

Improved probe card for high-frequency applications

Info

Publication number
SG11201907123PA
SG11201907123PA SG11201907123PA SG11201907123PA SG11201907123PA SG 11201907123P A SG11201907123P A SG 11201907123PA SG 11201907123P A SG11201907123P A SG 11201907123PA SG 11201907123P A SG11201907123P A SG 11201907123PA SG 11201907123P A SG11201907123P A SG 11201907123PA
Authority
SG
Singapore
Prior art keywords
end portion
international
flexible membrane
contact
probe card
Prior art date
Application number
SG11201907123PA
Inventor
Riccardo Vettori
Stefano Felici
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201907123PA publication Critical patent/SG11201907123PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

H26 20 25r 24A 22b Fl F2 26 25B 30 32 25A FIG. 2A 33 25B 25 1-1 co co 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 23 August 2018 (23.08.2018) WIP0 I PCT omit IIl °nolo Immo oimIE (10) International Publication Number WO 2018/149838 Al (51) International Patent Classification: G01R 1/073 (2006.01) G01R 31/28 (2006.01) G01R 1/067 (2006.01) (21) International Application Number: PCT/EP2018/053593 (22) International Filing Date: 13 February 2018 (13.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 102017000017061 15 February 2017 (15.02.2017) IT (71) Applicant: TECHNOPROBE S.P.A. [IT/IT]; Via Cava- lieri di Vittorio Veneto, 2, 23870 Cernusco Lombardone (Lecco) (IT). (72) Inventors: VETTORI, Riccardo; c/o TECHNOPROBE S.p.A., Via Cavalieri di Vittorio Veneto, 2, 23870 Cer- nusco Lombardone (Lecco) (IT). FELICI, Stefano; c/o TECHNOPROBE S.p.A., Via Cavalieri di Vittorio Veneto, 2, 23870 Cernusco Lombardone (Lecco) (IT). (74) Agent: FERRARI, Barbara; BOTTI & FERRARI S.r.l., Via Cappellini, 11, 20124 Milano (IT). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (54) Title: IMPROVED PROBE CARD FOR HIGH-FREQUENCY APPLICATIONS (57) : A probe card (20) for a testing apparatus of electronic devices comprises a testing head (21), which houses a plurality of contact elements (22) extending along a longitudinal axis (H-H) between a first end portion (24A) and a second end portion (24B), a support plate (23), onto which the first end portion (24A) is adapted to abut, and a flexible membrane (25) which comprises a first face (F1) and a second and opposite face (F2). Conveniently, the first portion (25A) of the flexible membrane (25) is arranged on at least one support (28) and comprises a plurality of strips (27) extending between a proximal end (27A) and a distal end (27B), the probe card (20) further including a plurality of micro contact probes (30) comprising a body (30C) extending along the longitudinal axis (H-H) between a first end portion (30A) and a second end portion (30B), the second end portion (24B) of each contact element (22) abutting onto the first face (F1) of the flexible membrane (25) at the distal end (27B) of a respective strip (27), and the first end portion (30A) [Continued on next page] WO 2018/149838 Al MIDEDIMOMOIDEIREEMOMMIEHMIIOMMOVOIMIE SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3)) of each micro contact probe (30) abutting onto the second face (F2) of the flexible membrane (25) at a respective contact element (22), the flexible membrane (25) being electrically connected to the support plate (23) through a second portion thereof (25B), the second end portion (30B) of the micro contact probes (30) being apt to contact the contact pads (32) of a device to be tested, wherein the at least one support (28) is provided with a plurality of guide holes (28h) for the housing of the plurality of micro contact probes (30).
SG11201907123PA 2017-02-15 2018-02-13 Improved probe card for high-frequency applications SG11201907123PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102017000017061A IT201700017061A1 (en) 2017-02-15 2017-02-15 Improved measurement card for high frequency applications
PCT/EP2018/053593 WO2018149838A1 (en) 2017-02-15 2018-02-13 Improved probe card for high-frequency applications

Publications (1)

Publication Number Publication Date
SG11201907123PA true SG11201907123PA (en) 2019-09-27

Family

ID=59297241

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201907123PA SG11201907123PA (en) 2017-02-15 2018-02-13 Improved probe card for high-frequency applications

Country Status (10)

Country Link
US (1) US11029336B2 (en)
EP (1) EP3583430B1 (en)
JP (1) JP7104054B2 (en)
KR (1) KR102515947B1 (en)
CN (1) CN110312940B (en)
IT (1) IT201700017061A1 (en)
PH (1) PH12019501890A1 (en)
SG (1) SG11201907123PA (en)
TW (1) TWI717585B (en)
WO (1) WO2018149838A1 (en)

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Also Published As

Publication number Publication date
WO2018149838A1 (en) 2018-08-23
IT201700017061A1 (en) 2018-08-15
TWI717585B (en) 2021-02-01
JP7104054B2 (en) 2022-07-20
CN110312940A (en) 2019-10-08
KR20190117015A (en) 2019-10-15
EP3583430B1 (en) 2021-01-20
JP2020507769A (en) 2020-03-12
KR102515947B1 (en) 2023-03-29
EP3583430A1 (en) 2019-12-25
CN110312940B (en) 2021-11-12
PH12019501890A1 (en) 2019-10-21
TW201840987A (en) 2018-11-16
US11029336B2 (en) 2021-06-08
US20190361051A1 (en) 2019-11-28

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