TWI542889B - A detection unit, a circuit board detection device, and a detection unit manufacturing method - Google Patents

A detection unit, a circuit board detection device, and a detection unit manufacturing method Download PDF

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Publication number
TWI542889B
TWI542889B TW101117174A TW101117174A TWI542889B TW I542889 B TWI542889 B TW I542889B TW 101117174 A TW101117174 A TW 101117174A TW 101117174 A TW101117174 A TW 101117174A TW I542889 B TWI542889 B TW I542889B
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Taiwan
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detecting unit
insertion hole
probe
circuit board
holding portion
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TW101117174A
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Chinese (zh)
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TW201312138A (en
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Seiichi Hori
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Hioki Electric Works
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Priority claimed from JP2011124702A external-priority patent/JP2012251873A/en
Priority claimed from JP2011134795A external-priority patent/JP2013002976A/en
Priority claimed from JP2011135253A external-priority patent/JP2013003002A/en
Application filed by Hioki Electric Works filed Critical Hioki Electric Works
Publication of TW201312138A publication Critical patent/TW201312138A/en
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Publication of TWI542889B publication Critical patent/TWI542889B/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

偵測單元、電路基板檢測裝置以及偵測單元製造方法 Detection unit, circuit board detecting device and detecting unit manufacturing method

本發明係關於偵測單元、具有此偵測單元的電路基板檢測裝置以及製造此偵測單元的偵測單元製造方法，上述偵測單元係由插通至一對支持部的插通孔的探針接腳所構成，具有複數的探針及保持各探針的保持部。 The present invention relates to a detecting unit, a circuit board detecting device having the detecting unit, and a detecting unit manufacturing method for manufacturing the detecting unit, wherein the detecting unit is probed by an insertion hole inserted into a pair of supporting portions The needle pin is formed by a plurality of probes and a holding portion for holding each probe.

用於電路基板檢測等的偵測單元，已知在專利第2000-292439號公開公報中揭示的偵測單元(垂直動作型探針卡)。此偵測單元的構成包括中央部具有座屈部的複數探針、經由非等向性導電體接觸各探針的連接部之配線圖案所形成的基板、以及具有分別形成複數貫通孔的上側支持基板及下側支持基板之探針支持構件。此偵測單元中，各探針在貫通上側支持基板的貫通孔及下側支持基板的貫通孔的狀態下以接合劑固定至上側支持基板。此偵測單元中，配合偵測對象基板的導體圖案的排列，規定探針的排列，各導體圖案可以使各探針偵測一次。 A detecting unit (vertical motion type probe card) disclosed in Japanese Laid-Open Patent Publication No. 2000-292439 is known as a detecting unit for detecting a circuit board or the like. The detection unit includes a plurality of probes having a seating portion at a central portion, a substrate formed by a wiring pattern of a connection portion that contacts the probes via an anisotropic conductor, and an upper support having a plurality of through holes respectively formed A probe supporting member for the substrate and the lower supporting substrate. In the detecting unit, each probe is fixed to the upper supporting substrate with a bonding agent in a state of penetrating through holes of the upper supporting substrate and through holes of the lower supporting substrate. In the detecting unit, the arrangement of the conductor patterns of the detection target substrate is defined, and the arrangement of the probes is specified, and each of the conductor patterns can detect each probe once.

[先行專利文件] [Prior patent documents]

[專利文件1]專利第2000-292439號公開公報(第3頁，第1圖) [Patent Document 1] Patent Publication No. 2000-292439 (Page 3, Figure 1)

然而，上述偵測單元中有以下的課題。即，此偵測單元係在中央部有座屈部的探針以複數的構件(上述例中，上側支持基板及下側支持基板)支持可座屈之複雜構造。又，由於此偵測單元的構造係用以輸出入信號的電極(上述例中，在非等向性導電體中的探針的對向部位)與探針的連接部在偵測時接觸，在非偵測時接觸背離，其電氣接點恐怕發生接觸不良等的故障。另一方面，隨著電路基板的高密度化，往導體圖案微細化及狹間距化進展。為了對應於此，要求偵測單元的小型化。不過，由於習知的偵測單元係如上述的複雜構造，小型化有困難，對應電路基板高密度化變得困難。又，即使可以小型化，由於小型化必須高度加工技術，起因於此而偵測單元的製造成本高漲，再加上隨著小型化，恐怕容易發生上述接觸不良等的故障。 However, the above detection unit has the following problems. That is, the detecting unit is a probe having a seating portion at the center portion, and a plurality of members (the upper supporting substrate and the lower supporting substrate in the above example) support a complicated structure that can be flexed. Moreover, since the detecting unit is configured to contact an electrode for inputting and outputting signals (in the above example, the opposite portion of the probe in the anisotropic conductor) and the probe connecting portion are detected, When the contact is not detected, the electrical contact may be in contact with a fault such as poor contact. On the other hand, as the density of the circuit board is increased, the conductor pattern is made finer and narrower. In order to cope with this, the miniaturization of the detecting unit is required. However, since the conventional detecting unit is a complicated structure as described above, it is difficult to miniaturize, and it becomes difficult to increase the density of the circuit board. In addition, even if it is possible to miniaturize, it is necessary to have a high-processing technique for miniaturization. As a result, the manufacturing cost of the detecting unit is high, and with the miniaturization, it is likely that the above-mentioned contact failure or the like is likely to occur.

另一方面，上述的偵測單元中，由於各探針在貫通上側支持基板的貫通孔及下側支持基板的貫通孔的狀態下以接合劑固定至上側支持基板，交換探針之際，存在有探針拆卸作業及安裝作業煩瑣的問題點。 On the other hand, in the above-described detection unit, each probe is fixed to the upper support substrate with a bonding agent in a state of penetrating the through hole of the upper support substrate and the through hole of the lower support substrate, and the probe is exchanged. There are problems with the detachment of the probe and the troublesome installation work.

為了解決此問題點，發明者已開發第9圖所示的偵測單元102。此偵測單元102的構成包括探針本體120以金屬形成的探針接腳112、支持探針接腳112的第1支持部131以及第2支持部132。此偵測單元102，兼有與鄰接其他探針接腳112絕緣，在探針接腳112的中央部123形成絕緣層124，由於此絕緣層124，構成中央部123比第1支持部131的第1插通孔131a大徑。組裝此偵測單元102之 際，第2支持部132的第2插通孔132a及第1支持部131的第1插通孔131a內，插通探針接腳112，前端部121從第1支持部131突出，其次，電極板113相接至第2支持部132而固定。因此，探針接腳112由第1支持部131及第2支持部132保持。此時，形成比第1支持部131的第1插通孔131a大徑的中央部123端部，即在中央部123形成的絕緣層124端部相接至第1支持部131的第1插通孔131a緣部。藉此，限制探針接腳112從第1插通孔131a脫落。因此，此偵測單元102，由於可以省略使用接合劑固定探針接腳112的作業，變得可以容易進行探針接腳112的拆卸作業及安裝作業。 In order to solve this problem, the inventors have developed the detecting unit 102 shown in FIG. The detection unit 102 includes a probe pin 112 formed of a metal in the probe body 120, a first support portion 131 supporting the probe pin 112, and a second support portion 132. The detecting unit 102 is also insulated from the adjacent probe pins 112. The insulating layer 124 is formed in the central portion 123 of the probe pin 112. The insulating layer 124 constitutes the central portion 123 than the first supporting portion 131. The first insertion hole 131a has a large diameter. Assembling the detecting unit 102 In the second insertion hole 132a of the second support portion 132 and the first insertion hole 131a of the first support portion 131, the probe pin 112 is inserted, and the distal end portion 121 protrudes from the first support portion 131, and secondly, The electrode plate 113 is fixed to the second support portion 132. Therefore, the probe pin 112 is held by the first support portion 131 and the second support portion 132. At this time, the end portion of the central portion 123 having a larger diameter than the first insertion hole 131a of the first support portion 131, that is, the end portion of the insulating layer 124 formed at the central portion 123 is in contact with the first insertion portion of the first support portion 131. The edge of the through hole 131a. Thereby, the probe pin 112 is restricted from falling off from the first insertion hole 131a. Therefore, since the detecting unit 102 can omit the work of fixing the probe pin 112 by using the bonding agent, the detaching operation and the mounting work of the probe pin 112 can be easily performed.

然而，申請人開發的上述偵測單元102中，有以下應改善的課題。即，此偵測單元102中，只在中央部123形成絕緣層124。因此，探針接腳112的頂端部121係金屬形成的探針本體120表面(金屬面)露出的狀態。另一方面，對電路基板上的端子，以探針接腳112偵測時，端子、端上附著的焊錫被探針接腳112切削而發生金屬屑(切削屑)，此金屬屑會附著在探針接腳112的頂端部121。此時，此偵測單元102中，對應電路基板的高密度化，各探針接腳112的間隔規定得非常狹小。因此，鄰接的探針接腳112中金屬面露出的頂端部121之間，經由附著的金屬屑電氣連接，恐怕起因於此而發生短路、漏電。又，發明者發現，金屬面露出的探針接腳112頂端部121上附著的焊錫的切削屑(焊錫屑)容易黏著於頂端部121的金屬面上。此時， 隨著偵測之際中央部123的座屈，頂端部121對第1支持部131摺動時，黏著於頂端部121的焊錫屑被拉入第1插通孔131a內，此焊錫屑阻礙頂端部121的摺動，恐怕變得難以順利偵測。 However, the above-described detecting unit 102 developed by the applicant has the following problems to be improved. That is, in the detecting unit 102, the insulating layer 124 is formed only in the central portion 123. Therefore, the tip end portion 121 of the probe pin 112 is in a state in which the surface (metal surface) of the probe body 120 formed of metal is exposed. On the other hand, when the terminal on the circuit board is detected by the probe pin 112, the solder attached to the terminal and the end is cut by the probe pin 112 to generate metal chips (chips), and the metal chips are attached thereto. The tip end portion 121 of the probe pin 112. At this time, in the detecting unit 102, the density of the corresponding circuit board is increased, and the interval between the probe pins 112 is extremely narrow. Therefore, between the distal end portions 121 of the adjacent probe pins 112 where the metal faces are exposed, the metal chips are electrically connected to each other, and a short circuit or electric leakage may occur due to this. Moreover, the inventors have found that the chips (solder chips) of the solder adhering to the tip end portion 121 of the probe pin 112 exposed on the metal surface are likely to adhere to the metal surface of the distal end portion 121. at this time, When the distal end portion 121 is folded toward the first support portion 131 as the center portion 123 is flexed during detection, the solder scrap adhered to the distal end portion 121 is pulled into the first insertion hole 131a, and the solder debris blocks the tip. The folding of the part 121 may become difficult to detect smoothly.

本發明係鑑於上述課題，主要目的為提供偵測單元及電路基板檢測裝置，可以防止短路、漏電發生，以及實現順利的偵測。又，另一目的係提供一面抑制製造成本的高漲及故障的發生，一面可以實現小型化之偵測單元、電路基板檢測裝置以及偵測單元製造方法。 The present invention has been made in view of the above problems, and a main object thereof is to provide a detecting unit and a circuit board detecting device, which can prevent short circuit, electric leakage, and smooth detection. In addition, another object is to provide a detection unit, a circuit board detecting device, and a detecting unit manufacturing method that can reduce the manufacturing cost and the occurrence of a malfunction.

為了達成上述目的，申請專利範圍第1項所述的偵測單元包括：本體部，具有形成第1插通孔的板狀之第1支持部、以及對上述第1支持部對向配置且形成第2插通孔的板狀之第2支持部；以及探針接腳，在頂端部及基端部分別插通至上述第1插通孔及上述第2插通孔的狀態下，由上述本體部支持，位於上述第1支持部及上述第2支持部之間的中央部的構成在偵測時可彎曲，且以上述中央部的直徑比上述第1插通孔的直徑大的厚度，在上述中央部的周面形成第1絕緣層；上述探針接腳中上述頂端部的表面一部分，除去接觸偵測對象體部位之先決規定的頂端區域中，以上述頂端區域的直徑比上述第1插通孔的直徑小的厚度，形成第2絕緣層。 In order to achieve the above object, the detecting unit according to claim 1 includes: a main body portion having a plate-shaped first support portion forming a first insertion hole; and the first support portion being disposed opposite to each other and formed a plate-shaped second support portion of the second insertion hole; and a probe pin, wherein the tip end portion and the base end portion are respectively inserted into the first insertion hole and the second insertion hole, The main body portion supports a structure in which a central portion between the first support portion and the second support portion is bendable at the time of detection, and a diameter of the central portion is larger than a diameter of the first insertion hole. a first insulating layer is formed on a circumferential surface of the central portion; and a part of a surface of the distal end portion of the probe pin is removed from a distal end region of a predetermined portion of the probe target body, and the diameter of the distal end portion is greater than 1 The through hole has a small diameter and a second insulating layer is formed.

又，申請專利範圍第2項所述的偵測單元，係申請專利範圍第1項所述的偵測單元中，上述中央部的周面及上 述頂端區域中連續形成上述第2絕緣層，上述第1絕緣層在上述中央部形成的上述第2絕緣層的上部形成上層。 Further, the detecting unit according to the second aspect of the patent application is the detecting unit according to the first aspect of the patent application, the circumferential surface of the central portion and the upper portion The second insulating layer is continuously formed in the distal end region, and the first insulating layer is formed on the upper portion of the second insulating layer formed in the central portion.

又，申請專利範圍第3項所述的偵測單元，係申請專利範圍第1項所述的偵測單元中，上述探針接腳的上述頂端部形成一樣粗的圓柱狀，並規定上述頂端部的周面全區為上述頂端區域。 Further, in the detecting unit according to claim 3, in the detecting unit according to the first aspect of the invention, the tip end portion of the probe pin is formed in a substantially cylindrical shape, and the top end is defined. The entire area of the circumference of the part is the above-mentioned top area.

又，申請專利範圍第4項所述的偵測單元，係申請專利範圍第2項所述的偵測單元中，上述探針接腳的上述頂端部形成一樣粗的圓柱狀，並規定上述頂端部的周面全區為上述頂端區域。 Further, in the detecting unit according to claim 4, in the detecting unit according to the second aspect of the invention, the tip end portion of the probe pin is formed in a substantially cylindrical shape, and the top end is defined. The entire area of the circumference of the part is the above-mentioned top area.

又，申請專利範圍第5項所述的偵測單元，係申請專利範圍第1項所述的偵測單元中，上述探針接腳的構成係上述頂端部具有隨著往頂端變小的小徑部，並規定上述頂端部中除去上述小徑部的部分之周面為上述頂端區域。 Further, in the detecting unit according to claim 5, in the detecting unit according to the first aspect of the invention, the probe pin is configured such that the tip end portion has a small size toward the tip end. In the diameter portion, it is defined that a peripheral surface of a portion of the distal end portion from which the small-diameter portion is removed is the distal end region.

又，申請專利範圍第6項所述的偵測單元，係申請專利範圍第2項所述的偵測單元中，上述探針接腳的構成係上述頂端部具有隨著往頂端變小的小徑部，並規定上述頂端部中除去上述小徑部的部分之周面為上述頂端區域。 Further, in the detecting unit according to claim 2, in the detecting unit according to the second aspect of the invention, the probe pin is configured such that the tip end portion has a smaller size toward the tip end. In the diameter portion, it is defined that a peripheral surface of a portion of the distal end portion from which the small-diameter portion is removed is the distal end region.

又，申請專利範圍第7項所述的電路基板檢測裝置包括：申請專利範圍第1至6項中任一項所述的偵測單元；以及檢測部，經由接觸偵測對象體的電路基板之上述偵測單元的上述探針接腳，根據輸出入的電氣信號，實行對上述電路基板的電氣檢測。 The circuit board detecting device according to any one of claims 1 to 6, wherein the detecting unit is configured to contact the detecting circuit substrate of the object The probe pin of the detecting unit performs electrical detection on the circuit board based on an input electrical signal.

又，申請專利範圍第8項所述的偵測單元係包括複數 的探針以及保持各探針的保持部，上述保持部由具有插通孔的板狀體構成，上述探針係頂端部從上述保持部的一面突出，由插通至上述插通孔的線狀或棒狀之導電體所構成的同時，沿著上述插通孔的中心軸可移動且對其他的上述導電體絕緣的狀態下，經由充填上述插通孔的彈性材料，由上述保持部保持。 Moreover, the detecting unit described in item 8 of the patent application scope includes plural numbers a probe and a holding portion for holding each of the probes, wherein the holding portion is formed of a plate-like body having an insertion hole, and the probe end portion protrudes from one surface of the holding portion and is inserted into a line passing through the insertion hole And the rod-shaped conductor is formed by the holding portion while being movable along the central axis of the insertion hole and insulated from the other conductors via the elastic material filling the insertion hole. .

又，申請專利範圍第9項所述的偵測單元，係申請專利範圍第8項所述的偵測單元中，上述探針由被覆導線構成。 Further, in the detecting unit according to claim 9, the detecting unit according to claim 8 is characterized in that the probe is composed of a covered wire.

又，申請專利範圍第10項所述的偵測單元，係申請專利範圍第8項所述的偵測單元中，一個上述插通孔內插通複數的上述探針。 Further, in the detecting unit according to claim 10, in the detecting unit of claim 8, the plurality of the probes are inserted into one of the insertion holes.

又，申請專利範圍第11項所述的偵測單元，係申請專利範圍第9項所述的偵測單元中，一個上述插通孔內插通複數的上述探針。 Further, in the detecting unit according to claim 11, in the detecting unit of claim 9, the plurality of the probes are inserted into one of the insertion holes.

又，申請專利範圍第12項所述的偵測單元，係申請專利範圍第10項所述的偵測單元中，上述複數的探針在扭轉的狀態下，插通至上述的一個插通孔。 Further, in the detecting unit of claim 12, in the detecting unit of claim 10, the plurality of probes are inserted into the one of the insertion holes in a twisted state. .

又，申請專利範圍第13項所述的偵測單元，係申請專利範圍第11項所述的偵測單元中，上述複數的探針在扭轉的狀態下，插通至上述的一個插通孔。 Further, in the detecting unit of claim 11, in the detecting unit of claim 11, the plurality of probes are inserted into the one of the insertion holes in a twisted state. .

又，申請專利範圍第14項所述的電路基板檢測裝置包括：申請專利範圍第8至13項中任一項所述的偵測單元；以及檢測部，經由接觸偵測對象體的電路基板之上述偵測 單元的上述探針，根據輸出入的電氣信號，實行對上述電路基板的電氣檢測。 The circuit board detecting device according to any one of claims 8 to 13, wherein the detecting unit is configured to contact the circuit substrate of the object to be detected by contact Above detection The probe of the unit performs electrical detection on the circuit board based on the input electrical signal.

又，申請專利範圍第15項所述的偵測單元製造方法係製造包括複數的探針、以及保持上述各探針的保持部之偵測單元的偵測單元製造方法，在板狀體中形成插通孔，製作上述保持部，功能為上述探針的線狀或棒狀之導電體的頂端部從上述保持部的一面突出，插通上述導電體至上述插通孔，沿著上述插通孔的中心軸可移動且對其他上述導電體絕緣狀態下，經由彈性材料，充填上述彈性材料至上述插通孔，使上述保持部保持上述導電體，製造偵測單元。 Further, the detecting unit manufacturing method according to claim 15 is characterized in that the detecting unit manufacturing method includes a plurality of probes and a detecting unit that holds the holding portions of the probes, and is formed in the plate-like body. Inserting a through hole to form the holding portion, and a tip end portion of the linear or rod-shaped conductor of the probe protrudes from one surface of the holding portion, and the conductive body is inserted into the insertion hole, and the insertion portion is inserted along the insertion hole The central axis of the hole is movable and in the insulated state of the other conductors, the elastic material is filled into the insertion hole via an elastic material, and the holding portion holds the conductor to manufacture a detecting unit.

又，申請專利範圍第16項所述的偵測單元係包括複數的探針、以及保持上述各探針的保持部之偵測單元，上述保持部由具有插通孔的板狀體構成，上述探針的構成包括：導線，頂端部在插通至上述插通孔的絕緣狀態下，固定至上述保持部；以及頂端構件，形成柱狀、錐體狀、球狀及橢圓體狀中的任一形狀的同時，基端部電氣連接上述頂端部的端面的狀態下，從上述保持部的一面突出，具有固定至上述導線的導電性及彈性。 Further, the detecting unit according to claim 16 includes a plurality of probes and a detecting unit that holds the holding portions of the probes, wherein the holding portion is formed of a plate-like body having an insertion hole, and the The probe includes: a lead wire fixed to the holding portion in an insulated state in which the distal end portion is inserted into the insertion hole; and a distal end member formed in a columnar shape, a pyramid shape, a spherical shape, and an ellipsoidal shape At the same time as the shape, the base end portion is electrically connected to the end surface of the distal end portion, and protrudes from one surface of the holding portion to have electrical conductivity and elasticity fixed to the lead wire.

又，申請專利範圍第17項所述的偵測單元，係申請專利範圍第16項所述的偵測單元中，上述導線係上述端面與上述一面成為同一平面的狀態下固定至上述保持部。 The detecting unit according to claim 17, wherein the detecting unit is fixed to the holding unit in a state in which the end surface is flush with the one surface.

又，申請專利範圍第18項所述的偵測單元，係申請專利範圍第16項所述的偵測單元中，上述頂端構件係以具有導電性及彈性的高分子材料形成。 The detecting unit according to claim 18, wherein the distal end member is formed of a polymer material having electrical conductivity and elasticity.

又，申請專利範圍第19項所述的偵測單元，係申請專利範圍第17項所述的偵測單元中，上述頂端構件係以具有導電性及彈性的高分子材料形成。 Further, in the detecting unit according to claim 17, the detecting unit according to claim 17, wherein the tip member is formed of a polymer material having conductivity and elasticity.

又，申請專利範圍第20項所述的偵測單元，係申請專利範圍第16項所述的偵測單元中，上述頂端構件形成柱狀。 Further, in the detecting unit according to claim 20, in the detecting unit of claim 16, the top member is formed in a columnar shape.

又，申請專利範圍第21項所述的偵測單元，係申請專利範圍第17項所述的偵測單元中，上述頂端構件形成柱狀。 Further, in the detecting unit according to claim 17, the detecting unit according to claim 17, wherein the distal end member is formed in a columnar shape.

又，申請專利範圍第22項所述的偵測單元，係申請專利範圍第18項所述的偵測單元中，上述頂端構件形成柱狀。 Further, in the detecting unit according to claim 18, in the detecting unit of claim 18, the tip member is formed in a columnar shape.

又，申請專利範圍第23項所述的偵測單元，係申請專利範圍第19項所述的偵測單元中，上述頂端構件形成柱狀。 Further, in the detecting unit according to claim 23, in the detecting unit of claim 19, the tip member is formed in a columnar shape.

又，申請專利範圍第24項所述的電路基板檢測裝置包括：申請專利範圍第16至23項中任一項所述的偵測單元；以及檢測部，經由接觸偵測對象體的電路基板之上述偵測單元的上述探針，根據輸出入的電氣信號，實行對上述電路基板的電氣檢測。 The circuit board detecting device according to any one of claims 16 to 23, wherein the detecting unit is configured to detect the object substrate by contacting the object substrate The probe of the detecting unit performs electrical detection on the circuit board based on an input electrical signal.

又，申請專利範圍第25項所述的偵測單元製造方法係製造包括複數的探針、以及保持上述各探針的保持部之偵測單元的偵測單元製造方法，在板狀體中形成插通孔，製作上述保持部，構成上述探針的導線的頂端部插通至上述 插通孔，在絕緣狀態下，固定上述導線至上述保持部，形成柱狀、錐體狀、球狀及橢圓體狀中的任一形狀，並在構成上述探針的頂端構件的基端部電氣連接至上述頂端部的端面狀態下，上述頂端構件從上述保持部的一面突出，固定至上述導線，製造上述偵測單元。 Further, the detecting unit manufacturing method according to claim 25 is characterized in that the detecting unit manufacturing method includes a plurality of probes and a detecting unit that holds the holding portions of the probes, and is formed in the plate-like body. Inserting a through hole to form the holding portion, and inserting a distal end portion of the lead wire constituting the probe into the above Inserting a through hole and fixing the lead wire to the holding portion in an insulated state to form any one of a columnar shape, a pyramid shape, a spherical shape, and an ellipsoid shape, and forming a base end portion of the distal end member constituting the probe In a state in which the end surface of the distal end portion is electrically connected, the distal end member protrudes from one surface of the holding portion and is fixed to the lead wire to manufacture the detecting unit.

根據申請專利範圍第1項所述的偵測單元，探針接腳的頂端部，藉由在先端區域形成第2絕緣層，即使偵測之際產生的金屬屑附著於探針接腳的頂端部，也可以確實防止鄰接的探針接腳的頂端部之間經由此金屬屑電氣連接的狀況。因此，根據此偵測單元，可以確實防止起因於鄰接的探針接腳的頂端部間電氣連接而發生的短路、漏電。又，根據此偵測單元，頂端部的頂端區域形成第2絕緣層，因為不露出探針接腳的金屬面，即使偵測之際產生的焊錫切削屑(焊錫屑)附著於頂端部的頂端區域，也可以確實防止此焊錫屑黏著於頂端區域。因此，根據此偵測單元，可以確實防止黏著於頂端部的頂端區域的焊錫屑被拉入第1支持部的第1插通孔內而此焊錫屑在偵測之際阻礙頂端部的摺動之狀況，結果，可以實現順利的偵測。 According to the detecting unit of claim 1, the tip end portion of the probe pin forms a second insulating layer in the tip end region, and the metal scrap generated at the time of detection is attached to the top end of the probe pin. It is also possible to surely prevent the state in which the tip end portions of the adjacent probe pins are electrically connected via the metal chips. Therefore, according to the detecting unit, it is possible to surely prevent a short circuit or electric leakage which is caused by electrical connection between the distal end portions of the adjacent probe pins. Further, according to the detecting unit, the distal end portion of the distal end portion forms the second insulating layer, and since the metal surface of the probe pin is not exposed, solder chips (solder chips) generated during the detection are attached to the top end of the distal end portion. The area can also be surely prevented from sticking to the tip area. Therefore, according to the detecting unit, it is possible to surely prevent solder chips adhering to the distal end portion of the distal end portion from being drawn into the first insertion hole of the first support portion, and the solder scraps hinder the folding of the distal end portion at the time of detection. As a result, smooth detection can be achieved.

又，根據申請專利範圍第2項所述的偵測單元，在探針接腳的中央部的周面及頂端部的頂端區域連續形成第2絕緣層，中央部形成的第2絕緣層上部形成第1絕緣層作為上層。因此，根據此偵測單元，由於從中央部的周面到頂端部的頂端區域之間露出探針接腳表面(金屬面)的部分 不存在，可以更確實防止鄰接的探針接腳的頂端間經由金屬屑電氣連接的狀況，同時可以更確實防止焊錫屑黏著於頂端部的頂端區域而被拉入第1支持部的第1插通孔內的狀況。 Further, according to the detecting unit of the second aspect of the invention, the second insulating layer is continuously formed on the peripheral surface of the central portion of the probe pin and the distal end portion of the distal end portion, and the upper portion of the second insulating layer formed at the central portion is formed. The first insulating layer serves as an upper layer. Therefore, according to the detecting unit, the portion of the probe pin surface (metal surface) is exposed between the peripheral surface of the central portion and the distal end portion of the distal end portion. If it does not exist, it is possible to more reliably prevent the state in which the tips of the adjacent probe pins are electrically connected via the metal chips, and it is possible to more reliably prevent the solder chips from sticking to the tip end region of the tip end portion and being pulled into the first insertion portion of the first support portion. The condition inside the through hole.

又，根據申請專利範圍第3及4項所述的偵測單元，探針接腳的頂端部形成一樣粗的圓柱狀，規定頂端部的周面全區為頂端區域，藉由形成第2絕緣層，除去端面的頂端部表面所有部分以第2絕緣層覆蓋，可以成為不露出探針接腳金屬面的狀態。因此，根據此偵測單元，露出的金屬面可以抑制至最小限度。結果，可以更確實防止鄰接的探針接腳的頂端部之間經由金屬屑電氣連接的狀況，同時可以更確實防止焊錫屑黏著於頂端部的頂端區域而被拉入第1支持部的第1插通孔內的狀況。 Further, according to the detecting unit according to the third and fourth aspects of the patent application, the tip end portion of the probe pin is formed in a substantially cylindrical shape, and the entire peripheral surface of the tip end portion is defined as the tip end region, and the second insulating layer is formed. In the layer, all the portions on the surface of the distal end portion of the end surface are covered with the second insulating layer, and the metal surface of the probe pin is not exposed. Therefore, according to the detecting unit, the exposed metal surface can be suppressed to a minimum. As a result, it is possible to more reliably prevent the state in which the tip end portions of the adjacent probe pins are electrically connected via the metal chips, and it is possible to more reliably prevent the solder chips from sticking to the tip end portion of the distal end portion and being pulled into the first support portion. Insert the condition inside the hole.

又，根據申請專利範圍第5及6項所述的偵測單元，由於頂端部的構成係具有隨著往頂端變小的小徑部，例如作為偵測對象體的電路基板的端子形狀為半球狀、或電路基板表面與端子表面為同一平面時，對這些端子可以使頂端部(小徑部)確實接觸。 In the detection unit according to the fifth and sixth aspects of the invention, the configuration of the distal end portion has a small diameter portion that becomes smaller toward the distal end. For example, the terminal shape of the circuit substrate as the detection target body is a hemisphere. When the surface of the circuit board or the surface of the circuit board is flush with the surface of the terminal, the terminal portion (small diameter portion) can be surely contacted with these terminals.

又，根據申請專利範圍第7項所述的電路基板檢測裝置，由於具有上述偵測單元，可以實現與上述偵測單元具有的效果相同的效果。 According to the circuit board detecting device of the seventh aspect of the invention, since the detecting unit is provided, the same effect as that of the detecting unit can be achieved.

又，申請專利範圍第8項所述的偵測單元以及申請專利範圍第15項所述的偵測單元製造方法，係在板狀體中形成插通孔而製作保持部，功能為探針的線狀或棒狀的導電 體的頂端部從保持部的一面突出，插通導電體至插通孔，沿著插通孔的中心軸可移動，且為了經由彈性材料以保持部保持導電體，充填彈性材料至插通孔以製造偵測單元。即，此偵測單元係以1枚的板狀體構成的保持部、以及線狀或棒狀的導電體構成的探針所構成的。因此，根據此偵測單元及偵測單元製造方法，相較於接腳狀的探針以複數的構件支持可座屈的類型之習知偵測單元，由於偵測單元的構成要素種類少且構造單純，製造之際的工程可以單純化的結果，這部分可以充分降低製造成本。因此，根據此偵測單元及偵測單元製造方法，構造單純的部分，對應作為偵測對象體的高密度電路基板，偵測單元可以容易小型化的同時，可以充分降低此製造成本。又，根據此偵測單元及偵測單元製造方法，用以輸出入信號的電極與探針的接觸部之間的接觸以及背離與每次偵測重複的習知構造不同，由於這樣的每次偵測重複接觸以及背離的部分不存在，可以確實防止起因於此部分中的接觸不良之故障發生。 Further, the detecting unit according to claim 8 and the detecting unit manufacturing method according to claim 15 are characterized in that the insertion hole is formed in the plate-like body to form a holding portion, and the function is a probe. Linear or rod-shaped conductive The tip end portion of the body protrudes from one side of the holding portion, inserts the electric conductor to the insertion hole, is movable along the central axis of the insertion hole, and fills the elastic material to the insertion hole in order to hold the electric conductor with the holding portion via the elastic material To create a detection unit. In other words, the detecting unit is constituted by a holding portion made of one plate-like body and a probe made of a linear or rod-shaped conductor. Therefore, according to the detecting unit and the detecting unit manufacturing method, the conventional detecting unit of the type capable of flexing is supported by a plurality of members compared to the pin-shaped probe, and the detecting unit has few types of components and The construction is simple, and the engineering at the time of manufacture can be simplistic, and this part can sufficiently reduce the manufacturing cost. Therefore, according to the detection unit and the detection unit manufacturing method, a simple portion is constructed, and the detection unit can be easily miniaturized and the manufacturing cost can be sufficiently reduced, corresponding to the high-density circuit substrate as the detection target body. Moreover, according to the detecting unit and the detecting unit manufacturing method, the contact between the electrode for inputting and outputting signals and the contact portion of the probe is different from the conventional configuration for repeating each detection, because each such The detection of repeated contact and the absence of the portion of the deviation does not exist, and it is possible to surely prevent the failure of the contact failure caused by this part.

又，根據申請專利範圍第9項所述的偵測單元，由於以被覆導線構成探針，被覆線本身有絕緣性，各被覆導線之間確實絕緣的狀態下，可以使保持部保持各被覆導線。又，由於探針以被覆導線構成，可以直接連接此覆導線至電路基板檢測裝置的檢測部。即，作為探針的被覆導線可以原封不動地用作與檢測部等連接用的引線。因此，比較作為探針的導電體與採用別體的連接用引線的構成，作為探針的導電體與連接用的引線之間的連結不需要的部分， 可以更降低偵測單元的製造成本。 Further, according to the detecting unit of the ninth aspect of the invention, since the probe is formed by the covered wire, the covered wire itself is insulated, and the covered wires are insulated from each other, so that the holding portion can hold the covered wires. . Further, since the probe is formed of a covered wire, the covered wire can be directly connected to the detecting portion of the circuit board detecting device. In other words, the covered wire as the probe can be used as a lead for connection to a detecting portion or the like as it is. Therefore, the configuration of the conductor used as the probe and the connection lead using the other body is compared, and the portion between the conductor of the probe and the lead for connection is not required. The manufacturing cost of the detection unit can be further reduced.

又，根據申請專利範圍第10及11項所述的偵測單元，由於一個通孔內插通複數的探針，相較於一個通孔內插通一個探針的構成，可以縮短各探針之間的間隔(間距)。因此，根據此偵測單元，一面充分地降低製造成本，一面對應更高密度的電路基板可以更小型化偵測單元。 Moreover, according to the detecting unit according to the claims 10 and 11, the probes can be shortened by inserting a plurality of probes into one through hole and inserting a probe into one through hole. The spacing between them (pitch). Therefore, according to the detecting unit, the manufacturing cost can be sufficiently reduced, and the detecting unit can be further miniaturized corresponding to the circuit board of higher density.

又，根據申請專利範圍第12及13項所述的偵測單元，由於扭轉狀態的複數探針插通至一個插通孔，可以更縮短一個插通孔內插通複數的探針間的間隔(間距)。因此，根據此偵測單元，一面充分地降低製造成本，一面對應更高密度的電路基板可以更小型化偵測單元。 Moreover, according to the detecting unit according to the 12th and 13th claims of the patent application, since the plurality of probes in the twisted state are inserted into one of the insertion holes, the interval between the probes in which the plurality of insertion holes are inserted can be further shortened. (spacing). Therefore, according to the detecting unit, the manufacturing cost can be sufficiently reduced, and the detecting unit can be further miniaturized corresponding to the circuit board of higher density.

又，根據申請專利範圍第14項所述的電路基板檢測裝置，由於具有上述偵測單元，可以實現與上述偵測單元具有的效果相同的效果。 Further, according to the circuit board detecting device of the fourteenth aspect of the invention, since the detecting unit is provided, the same effect as that of the detecting unit can be achieved.

又，申請專利範圍第16項所述的偵測單元以及申請專利範圍第25項所述的偵測單元製造方法中，在板狀體中形成插通孔，製作保持部，構成探針的導線的頂端部插通至插通孔內，在絕緣狀態下固定導線至保持部，形成柱狀、錐體狀、球狀及橢圓體狀中的任一形狀，並在構成探針的頂端構件的基端部電氣連接至導線的端面狀態下，頂端構件從保持部的一面突出，固定至導線，製造偵測單元。即，此偵測單元係以1枚的板狀體構成的保持部、以及導線及頂端構件構成的探針所構成的。因此，根據此偵測單元及偵測單元製造方法，相較於接腳狀的探針以複數的構件支 持可座屈的類型之習知偵測單元，由於偵測單元的構成要素種類少且構造單純，製造之際的工程可以單純化的結果，這部分可以充分降低製造成本。因此，根據此偵測單元及偵測單元製造方法，構造單純的部分，對應作為偵測對象體的高密度電路基板，可以容易小型化偵測單元的同時，可以充分降低此製造成本。又，根據此偵測單元及偵測單元製造方法，用以輸出入信號的電極與探針的接觸部之間的接觸以及背離與每次偵測重複的習知構造不同，由於這樣的每次偵測重複接觸以及背離的部分不存在，可以確實防止起因於此部分中的接觸不良之故障發生。 Further, in the detecting unit according to claim 16 and the detecting unit manufacturing method according to claim 25, the insertion hole is formed in the plate-like body, and the holding portion is formed to constitute the wire of the probe. The tip end portion is inserted into the insertion hole, and the wire is fixed to the holding portion in an insulated state to form any one of a columnar shape, a pyramid shape, a spherical shape, and an ellipsoid shape, and is formed in the tip member of the probe. When the base end portion is electrically connected to the end surface of the wire, the tip member protrudes from one side of the holding portion and is fixed to the wire to manufacture the detecting unit. That is, the detecting unit is constituted by a holding portion composed of one plate-like body and a probe composed of a lead wire and a distal end member. Therefore, according to the detection unit and the detection unit manufacturing method, a plurality of components are supported compared to the pin-shaped probes. The conventional detection unit of the type that can be falsified has a small number of components and a simple structure, and the engineering at the time of manufacture can be simplistic, and this part can sufficiently reduce the manufacturing cost. Therefore, according to the detection unit and the detection unit manufacturing method, a simple portion is constructed, and the high-density circuit substrate as the detection target body can be easily miniaturized while the manufacturing unit can be sufficiently reduced. Moreover, according to the detecting unit and the detecting unit manufacturing method, the contact between the electrode for inputting and outputting signals and the contact portion of the probe is different from the conventional configuration for repeating each detection, because each such The detection of repeated contact and the absence of the portion of the deviation does not exist, and it is possible to surely prevent the failure of the contact failure caused by this part.

又，申請專利範圍第17項所述的偵測單元中，導線的端面與保持部的一面成為同一平面的狀態下固定導線至保持部。因此，根據此偵測單元，相同形狀(尺寸)的頂端構件固定至各導線的端面，藉此可以確實且容易地製造從保持部的一面開始的頂端構件的突出量(從一面到頂端構件的頂端部的長度)為相同的長度且一致高精度的偵測單元。 Further, in the detecting unit according to Item 17, the wire is fixed to the holding portion in a state in which the end surface of the wire and the one surface of the holding portion are flush with each other. Therefore, according to the detecting unit, the tip member of the same shape (size) is fixed to the end faces of the respective wires, whereby the protruding amount of the tip member from one side of the holding portion can be reliably and easily manufactured (from one side to the tip member) The length of the tip end is a detection unit of the same length and consistent with high precision.

又，根據申請專利範圍第18及19項所述的偵測單元，由於上述頂端構件係以具有導電性及彈性的高分子材料形成，因為對高分子材料加工容易，對應偵測對象體的形狀之所希望的形狀的頂端構件可以確實且容易形成的結果，可以確實且容易地製造適合作為偵測對象體的基板端子、導體圖案形狀之偵測單元。 Further, according to the detecting unit according to the eighteenth and twenty-ninth aspects of the patent application, since the tip member is formed of a polymer material having conductivity and elasticity, the shape of the object to be detected is correspondingly easy to process the polymer material. As a result of the fact that the tip member of the desired shape can be formed reliably and easily, it is possible to reliably and easily manufacture a substrate terminal and a conductor pattern shape detecting unit suitable as the object to be detected.

又，根據申請專利範圍第20及23項所述的偵測單元，由於頂端構件形成柱狀，不同於具有形成例如球狀、錐體 狀的頂端構件之構成，不拘於沿著中心軸方向(偵測方向)的變形量，與偵測對象體的接觸面積可以維持固定(或大致固定)。因此，與偵測對象體的接觸面積維持固定(或大致固定)的狀態下，可以沿著中心軸方向大彈性變形。因此，各頂端構件的頂端部與偵測對象體之間的距離即使各頂端構件大不同的情況，藉由使頂端構件大彈性變形，接觸面積一面維持固定(或大致固定)，一面也可以使各頂端構件的頂端部與偵測對象體之間確實接觸。 Further, according to the detecting unit of the claims 20 and 23, since the tip member is formed in a column shape, it is different from having a shape such as a sphere or a cone. The configuration of the distal end member is maintained at a fixed (or substantially fixed) contact area with respect to the detection target body regardless of the amount of deformation along the central axis direction (detection direction). Therefore, in a state in which the contact area with the object to be detected is maintained constant (or substantially fixed), it is elastically deformed in a large direction along the central axis direction. Therefore, even if the distance between the distal end portion and the detection target body of each of the distal end members is greatly different, the distal end member is elastically deformed greatly, and the contact area is maintained constant (or substantially fixed) while allowing the contact area to be fixed (or substantially fixed). The top end portion of each of the tip members is in positive contact with the object to be detected.

又，根據申請專利範圍第24項所述的電路基板檢測裝置，由於具有上述偵測單元，可以實現與上述偵測單元具有的效果相同的效果。 Further, according to the circuit board detecting device of claim 24, the detection unit is provided, and the same effect as that of the detecting unit can be achieved.

以下，第一實施例，係根據本發明的偵測單元及電路基板檢測裝置之實施例，參照圖面說明。 Hereinafter, the first embodiment is an embodiment of the detecting unit and the circuit board detecting device according to the present invention, with reference to the drawings.

首先，說明電路基板檢測裝置1的構成。第1圖所示的電路基板檢測裝置1的構成係可以實行有關作為偵測對象的一範例的電路基板100之電氣檢測。具體而言，電路基板檢測裝置1的構成，如同圖所示，包括偵測單元2、移動機構3、電路基板支持部4、檢測部5以及控制部6。 First, the configuration of the circuit board detecting device 1 will be described. The circuit board detecting device 1 shown in Fig. 1 can perform electrical detection of the circuit board 100 as an example of the object to be detected. Specifically, the configuration of the circuit board detecting device 1 includes a detecting unit 2, a moving mechanism 3, a circuit board supporting portion 4, a detecting portion 5, and a control portion 6, as shown in the drawing.

偵測單元2的構成，例如，第2圖所示，包括本體部11、探針接腳12及電極板13。 The configuration of the detecting unit 2 includes, for example, the main body portion 11, the probe pin 12, and the electrode plate 13 as shown in Fig. 2 .

本體部11的構成，例如，第2圖所示，包括第1支持部31、第2支持部32及連結部33。第1支持部31係由具 有非導電性材料的樹脂材料等形成板狀。又，第1支持部31中，如第3圖所示，形成複數的第1插通孔31a。此時，第1插通孔31a，可插通後述的探針接腳12的頂端部21，探針接腳12的中央部23的可插通限制大小，即第1插通孔31a的直徑D1形成比頂端部21的直徑D4大，且比中央部23的直徑D5小(參照第5圖)。 The configuration of the main body portion 11 includes, for example, the first support portion 31, the second support portion 32, and the coupling portion 33 as shown in Fig. 2 . The first support portion 31 is provided with A resin material or the like having a non-conductive material is formed into a plate shape. Further, in the first support portion 31, as shown in Fig. 3, a plurality of first insertion holes 31a are formed. At this time, the first insertion hole 31a can be inserted into the distal end portion 21 of the probe pin 12 to be described later, and the size of the insertion portion of the central portion 23 of the probe pin 12 can be restricted, that is, the diameter of the first insertion hole 31a. D1 is formed larger than the diameter D4 of the distal end portion 21 and smaller than the diameter D5 of the central portion 23 (see Fig. 5).

第2支持部132的構成，如第3圖所示，包括支持板41、42。支持板41由具有非導電性材料的樹脂材料等形成板狀。又，支持板41，對第1支持部31以平行(或大致平行)的狀態對向配置，如第2圖所示，以連結部33連接至第1支持部31。又，支持板41中，如第3圖所示，形成複數的插通孔41a。此時，插通孔41a，可插通探針接腳12的中央部23的大小，即插通孔41a的直徑D2形成比中央部23的直徑D5大(參照第5圖)。 The configuration of the second support portion 132 includes support plates 41 and 42 as shown in FIG. The support plate 41 is formed in a plate shape from a resin material or the like having a non-conductive material. Further, the support plate 41 is disposed to face the first support portion 31 in a parallel (or substantially parallel) state, and is connected to the first support portion 31 by a connection portion 33 as shown in FIG. 2 . Further, in the support plate 41, as shown in Fig. 3, a plurality of insertion holes 41a are formed. At this time, the insertion hole 41a can be inserted into the center portion 23 of the probe pin 12, that is, the diameter D2 of the insertion hole 41a is formed larger than the diameter D5 of the center portion 23 (see FIG. 5).

又，支持板41中，如第3圖所示，形成可***固定接腳43的***孔41c、41d。此時，***孔41c，如第5圖所示，組裝此偵測單元2之際，在第1插通孔31a、插通孔41a以及後述的插通孔42a內，插通探針接腳12時，在各插通孔31a、41a、42a的中心軸為同軸的狀態(第1狀態)，位置合併支持板41、42之際使用。又，***孔41d，如第6圖所示，在各插通孔41a、42a的中心軸偏移狀態(第2狀態)，定位支持板41、42，彎曲(彈性變形)各插通孔31a、41a、42a內插通的探針接腳12之際使用。 Further, in the support plate 41, as shown in Fig. 3, insertion holes 41c and 41d into which the fixing pins 43 can be inserted are formed. At this time, as shown in FIG. 5, when the detecting unit 2 is assembled, the insertion hole 41c is inserted into the first insertion hole 31a, the insertion hole 41a, and the insertion hole 42a to be described later. At 12 o'clock, the central axes of the insertion holes 31a, 41a, and 42a are coaxial (first state), and the position is merged between the support plates 41 and 42. Further, as shown in Fig. 6, the insertion hole 41d is in a state in which the central axes of the insertion holes 41a and 42a are shifted (second state), and the support plates 41 and 42 are positioned to bend (elastically deform) the respective insertion holes 31a. The probe pins 12 inserted in the 41a and 42a are used.

支持板42，如第3圖所示，由具有非導電性材料的樹 脂材料等形成板狀，對支持板41可滑動地配設於支持板41的上部。又，支持板42中，如第5圖所示，形成上述第1狀態中分別連通至支持板41的各插通孔41a之複數的插通孔42a。此時，形成插通孔42a，其直徑D3，例如與插通孔41a的直徑D2同徑。又，由插通孔41a、42a，構成第2插通孔32a(參照第3圖)。 Support plate 42, as shown in Figure 3, is made of a tree with a non-conductive material The grease material or the like is formed in a plate shape, and the support plate 41 is slidably disposed on the upper portion of the support plate 41. Further, as shown in FIG. 5, the support plate 42 is formed with a plurality of insertion holes 42a that communicate with the respective insertion holes 41a of the support plate 41 in the first state. At this time, the insertion hole 42a is formed, and its diameter D3 is, for example, the same diameter as the diameter D2 of the insertion hole 41a. Further, the second insertion holes 32a are formed by the insertion holes 41a and 42a (see FIG. 3).

又，支持板42中，如第3圖所示，形成可***固定接腳43的***孔42c、42d。此時，***孔42c在上述第1狀態中，在連通至支持板41的***孔41c的位置上形成(參照第5圖)，***孔42d在上述第2狀態中，在連通至支持板41的***孔41d的位置上形成(參照第6圖)。 Further, in the support plate 42, as shown in Fig. 3, insertion holes 42c and 42d into which the fixing pins 43 can be inserted are formed. At this time, the insertion hole 42c is formed at a position that communicates with the insertion hole 41c of the support plate 41 in the first state (see FIG. 5), and the insertion hole 42d communicates with the support plate 41 in the second state. The position of the insertion hole 41d is formed (refer to Fig. 6).

探針接腳12的構成，例如，包括由具有導電性的金屬材料(例如鈹銅合金、SKH(高速度工具鋼)及錳鋼等)形成可彈性變形的棒狀之探針本體20(參照第3、4圖)。又，探針接腳12(探針本體20)，如第4圖所示，頂端部21形成一樣粗的圓柱狀，基端部22的頂端形成尖銳狀。 The probe pin 12 is configured to include, for example, a conductive metal material (for example, beryllium copper alloy, SKH (high speed tool steel), manganese steel, or the like) to form an elastically deformable rod-shaped probe body 20 (refer to Figures 3 and 4). Further, as shown in Fig. 4, the probe pin 12 (probe body 20) has a tip end portion 21 formed in a substantially cylindrical shape, and a tip end portion of the base end portion 22 is formed in a sharp shape.

如第4圖所示，探針接腳12(探針本體20)的頂端部21中先決規定的區域(以下，此區域也稱作「頂端區域A」)以及探針接腳12的中央部23的周面，形成第2絕緣層25。此偵測單元2中，如同圖所示，頂端部21的表面21a(同圖所示的端面21b及周面21c)之中，除去偵測時接觸電路基板100端子101的頂端部21端面21b之全區域，即形成圓柱狀的頂端部21的周面21c全區域規定為頂端區域A。 As shown in FIG. 4, a predetermined region (hereinafter, this region is also referred to as "tip region A") and a central portion of the probe pin 12 in the distal end portion 21 of the probe pin 12 (probe body 20). The second insulating layer 25 is formed on the circumferential surface of 23. In the detecting unit 2, as shown in the figure, the end surface 21b of the distal end portion 21 of the terminal 101 of the circuit board 100 is removed from the surface 21a of the distal end portion 21 (the end surface 21b and the peripheral surface 21c shown in the same figure). The entire area, that is, the entire area of the peripheral surface 21c forming the cylindrical distal end portion 21 is defined as the distal end area A.

此時，第2絕緣層25係以頂端區域A中探針接腳12 的直徑(頂端部21的直徑D4)比第1插通孔31a的直徑D1小的厚度形成。又，第2絕緣層25，例如，在探針接腳12(探針本體20)的中央部23的周面以及頂端部21的頂端區域A，以具有絕緣性的塗佈材料(例如鐵氟龍(註冊商標)等的氟系樹脂、聚氨酯、聚酯以及聚酸亞胺等)塗佈形成。 At this time, the second insulating layer 25 is the probe pin 12 in the tip end region A. The diameter (diameter D4 of the distal end portion 21) is formed to be smaller than the diameter D1 of the first insertion hole 31a. Further, the second insulating layer 25 has an insulating coating material (for example, iron fluoride) on the circumferential surface of the central portion 23 of the probe pin 12 (probe body 20) and the distal end region A of the distal end portion 21, for example. A fluorine-based resin such as a dragon (registered trademark), a polyurethane, a polyester, a polyamicimide or the like is formed by coating.

又，如第4圖所示，在中央部23形成的第2絕緣層25的上部，重疊形成(堆疊)上層的第1絕緣層24。此時，第1絕緣層24，例如，經由塗佈上述的塗佈材料，係以中央部23的直徑D5比第1插通孔31a的直徑D1大的厚度形成。 Moreover, as shown in FIG. 4, the upper layer of the first insulating layer 24 is superposed (stacked) on the upper portion of the second insulating layer 25 formed in the central portion 23. At this time, the first insulating layer 24 is formed, for example, by applying the above-described coating material such that the diameter D5 of the central portion 23 is larger than the diameter D1 of the first insertion hole 31a.

又，探針接腳12，如第3圖所示，係以頂端部21插通至支持部31的第1插通孔31a，基端部22插通至第2支持部32的第2插通孔32a的狀態下由本體部11支持。 Further, as shown in FIG. 3, the probe pin 12 is inserted into the first insertion hole 31a of the support portion 31, and the base end portion 22 is inserted into the second insertion portion of the second support portion 32. The through hole 32a is supported by the body portion 11.

電極板13，如第3圖所示，由具有非導電性的樹脂材料等形成板狀，配設於本體部11的第2支持部32(支持板42)的上部，與本體部11共同固定於移動機構3的安裝板(未圖示)。又，電極板13中與各探針接腳12的各基端部22的接觸部位，如同圖所示，安上具有導電性的端子13a，各端子13a分別連接至用以電氣連接探針接腳12與檢測部5的纜線13b。 As shown in FIG. 3, the electrode plate 13 is formed in a plate shape by a non-conductive resin material or the like, and is disposed on the upper portion of the second support portion 32 (support plate 42) of the main body portion 11, and is fixed together with the main body portion 11. A mounting plate (not shown) of the moving mechanism 3. Further, in the electrode plate 13, the contact portion with each base end portion 22 of each probe pin 12 is provided with a conductive terminal 13a as shown in the drawing, and each terminal 13a is connected to an electrical connection probe. The leg 12 and the cable 13b of the detecting portion 5.

移動機構3，係以可固定偵測單元2而構成，依照控制部6的控制，對電路基板支持部4往接近方向及背離方向移動偵測單元2。電路基板支持部4的構成可保持電路基板100。檢測部5，依照控制部6的控制，根據經由偵測 單元2的探針接腳12輸入的電氣信號，對電路基板100實行斷線檢查、短路檢查等預先決定的電氣檢測。控制部6，藉由控制移動機構3，移動固定於移動機構3的偵測單元2。又，控制部6，控制檢測部5，實行對電路基板100的電氣檢測。 The moving mechanism 3 is configured by the fixed detecting unit 2, and moves the detecting unit 2 to the circuit board supporting portion 4 in the approaching direction and the deviation direction in accordance with the control of the control unit 6. The circuit board support portion 4 is configured to hold the circuit board 100. The detecting unit 5 is based on the detection by the control unit 6 The electrical signal input from the probe pin 12 of the unit 2 performs predetermined electrical detection such as disconnection inspection or short-circuit inspection on the circuit board 100. The control unit 6 moves the detection unit 2 fixed to the movement mechanism 3 by controlling the movement mechanism 3. Moreover, the control unit 6 controls the detecting unit 5 to perform electrical detection on the circuit board 100.

其次，有關偵測單元2的組裝，參照圖面說明。 Next, the assembly of the detecting unit 2 will be described with reference to the drawings.

首先，如第5圖所示，為了使第1支持部31的第1插通孔31a、支持板41的插通孔41a及支持板42的插通孔42a中的各中心軸成為同軸狀態(第1狀態)，滑動支持板42。此時，支持板41的***孔41c與支持板42的***孔42c之間連通。其次，***固定接腳43至***孔42c、41c內。因此，支持板41與支持板42之間維持第1狀態。 First, as shown in FIG. 5, in order to make the first insertion hole 31a of the first support portion 31, the insertion hole 41a of the support plate 41, and the center hole of the insertion hole 42a of the support plate 42 coaxial, In the first state), the support plate 42 is slid. At this time, the insertion hole 41c of the support plate 41 communicates with the insertion hole 42c of the support plate 42. Next, the fixing pins 43 are inserted into the insertion holes 42c, 41c. Therefore, the first state is maintained between the support plate 41 and the support plate 42.

接著，如第5圖所示，支持板42的插通孔42a、支持板41的插通孔41a以及第1支持部31的第1插通孔31a依序插通探針接腳12。此時，此偵測單元2中，由於探針接腳12的頂端部21的直徑D4比第1插通孔31a的直徑D1小，只有頂端部21(頂端部21的一部分)插通至第1插通孔31a，在第1支持部31下側突出。又，由於第1插通孔31a的直徑D1比探針接腳12的中央部23的直徑D5小，中央部23的端部，即在中央部23形成的第1絕緣層24的端部相接至第1支持部31中第1插通孔31a的緣部，藉此限制探針接腳12從第1插通孔31a脫落。 Next, as shown in FIG. 5, the insertion hole 42a of the support plate 42, the insertion hole 41a of the support plate 41, and the first insertion hole 31a of the first support portion 31 are sequentially inserted into the probe pin 12. At this time, in the detecting unit 2, since the diameter D4 of the distal end portion 21 of the probe pin 12 is smaller than the diameter D1 of the first insertion hole 31a, only the distal end portion 21 (a part of the distal end portion 21) is inserted to the first portion. The insertion hole 31a is protruded from the lower side of the first support portion 31. Further, since the diameter D1 of the first insertion hole 31a is smaller than the diameter D5 of the central portion 23 of the probe pin 12, the end portion of the central portion 23, that is, the end portion of the first insulating layer 24 formed at the central portion 23 is formed. The edge of the first insertion hole 31a in the first support portion 31 is connected to the first insertion hole 31a, thereby restricting the probe pin 12 from coming off the first insertion hole 31a.

其次，往各插通孔31a、41a、42a插通探針接腳12結束後，從***孔41c、42c抽出固定接腳43。接著，如第6 圖所示，滑動支持板42，直到成為各插通孔41a、42a的中心軸偏移的第2狀態為止。此時，由於支持板42的滑動，探針接腳12的基端部22側往滑動方向傾斜的結果，如同圖所示，使中央部23稍微彎曲(彈性變形)。又，由於往第2位置滑動，連通支持板41的***孔41d與支持板42的***孔42d。其次，***固定接腳43至***孔42d、41d。藉此，支持板41與支持板42維持在第2狀態，探針接腳12的中央部23維持在稍微彎曲的狀態。 Next, after the insertion pins 12a, 41a, and 42a are inserted into the probe pins 12, the fixing pins 43 are taken out from the insertion holes 41c and 42c. Then, as the sixth As shown in the figure, the slide support plate 42 is in a second state in which the central axes of the insertion holes 41a and 42a are shifted. At this time, as a result of the sliding of the support plate 42, the base end portion 22 side of the probe pin 12 is inclined in the sliding direction, and as shown in the figure, the central portion 23 is slightly curved (elastically deformed). Further, since it slides to the second position, the insertion hole 41d of the support plate 41 and the insertion hole 42d of the support plate 42 are communicated. Next, the fixing pin 43 is inserted into the insertion holes 42d, 41d. Thereby, the support plate 41 and the support plate 42 are maintained in the second state, and the central portion 23 of the probe pin 12 is maintained in a slightly curved state.

接著，在第2支持部32(支持板42)的上部配設電極板13，在移動機構3的安裝板(未圖示)，第2支持部32(本體部11)與電極板13一起停止扭轉。根據上述完成偵測單元2的組裝。 Next, the electrode plate 13 is disposed on the upper portion of the second support portion 32 (support plate 42), and the second support portion 32 (main portion 11) is stopped together with the electrode plate 13 in the mounting plate (not shown) of the moving mechanism 3. Reversed. The assembly of the detecting unit 2 is completed according to the above.

其次，有關使用電路基板檢測裝置1對電路基板100電氣檢測的實行方法，參照圖面說明。 Next, a method of performing electrical detection of the circuit board 100 by the circuit board detecting device 1 will be described with reference to the drawings.

首先，固定電路基板100至電路基板支持部4。其次，使電路基板檢測裝置1動作。此時，控制部6，藉由控制移動機構3，往接近電路基板100的方向，移動偵測單元2。接著，控制部6，從偵測單元2的各探針接腳12中的頂端部21端面21b接觸電路基板100的端子101之位置，只以既定距離再移動偵測單元2(參照第3圖)。此時，此偵測單元2中，探針接腳12的中央部23事先稍微彎曲。因此，隨著偵測單元2的移動，探針接腳12中的頂端部21往第2支持部32側移動時，中央部23的彎曲量變化(變大)的同時，由於起因於彎曲量變化的彈性力，基端部22的頂端 確實接觸電極板13的端子13a。 First, the circuit board 100 is fixed to the circuit board support portion 4. Next, the circuit board detecting device 1 is operated. At this time, the control unit 6 moves the detecting unit 2 in the direction approaching the circuit board 100 by controlling the moving mechanism 3. Next, the control unit 6 contacts the position of the terminal 101 of the circuit board 100 from the end surface 21b of the distal end portion 21 of each probe pin 12 of the detecting unit 2, and moves the detecting unit 2 only at a predetermined distance (refer to FIG. 3). ). At this time, in the detecting unit 2, the central portion 23 of the probe pin 12 is slightly curved in advance. Therefore, when the distal end portion 21 of the probe pin 12 moves toward the second support portion 32 side as the detection unit 2 moves, the amount of bending of the central portion 23 changes (larges) and is caused by the amount of bending. Varying elastic force, the top end of the base end 22 It does contact the terminal 13a of the electrode plate 13.

在此，此偵測單元2中，頂端部21的周面21c(頂端部21表面上除去端面21b的頂端區域A)上形成第2絕緣層25。因此，偵測之際，端子101被探針接腳12切削而發生金屬屑，此金屬屑即使附著於探針接腳12的頂端部21，也可以確實防止鄰接的探針接腳12的頂端部21之間經由附著的金屬屑電氣連接的狀況。又，頂端部21的周面21c(頂端區域A)上形成第2絕緣層25，由於探針本體20的金屬面露出，附著於端子101的焊錫被切削出現切削屑(焊錫屑)，焊錫屑即使附著至探針接腳12的頂端部21，也可以確實防止此焊錫屑黏著於周面21c的狀況。 Here, in the detecting unit 2, the second insulating layer 25 is formed on the peripheral surface 21c of the distal end portion 21 (the distal end portion A of the end surface 21 on which the end surface 21b is removed). Therefore, at the time of detection, the terminal 101 is cut by the probe pin 12 to generate metal chips, and even if the metal chips adhere to the distal end portion 21 of the probe pin 12, the tip end of the adjacent probe pin 12 can be surely prevented. The condition in which the portions 21 are electrically connected via the attached metal chips. Further, the second insulating layer 25 is formed on the peripheral surface 21c (the tip end region A) of the distal end portion 21, and the metal surface of the probe body 20 is exposed, and the solder adhering to the terminal 101 is cut to cause chips (solder chips) and solder chips. Even if it adheres to the tip end portion 21 of the probe pin 12, it is possible to surely prevent the solder dust from adhering to the peripheral surface 21c.

其次，檢測部5，依照控制部6的控制，根據經由探針接腳12輸入的電氣信號，對電路基板100實行電氣檢測。接著，對電路基板100的檢查結束時，控制部6控制移動機構3，往離間電路基板100的方向移動偵測單元2。其次，對於其他電路基板100實行電氣檢測之際，反覆實行上述的工程。 Next, the detecting unit 5 performs electrical detection on the circuit board 100 based on an electrical signal input via the probe pin 12 in accordance with the control of the control unit 6. Next, when the inspection of the circuit board 100 is completed, the control unit 6 controls the moving mechanism 3 to move the detecting unit 2 in the direction of the separation circuit board 100. Next, when the electric circuit is performed on the other circuit board 100, the above-described work is repeatedly performed.

於是，根據偵測單元2及電路基板檢測裝置1，探針接腳12的頂端部21中作為頂端區域A的周面21c上，藉由形成第2絕緣層25，探測之際出現的金屬屑即使附著於探針接腳12的頂端部21，也可以確實防止鄰接的探針接腳12的頂端部21之間經由附著的金屬屑而電氣連接的狀況。因此，根據偵測單元2及電路基板檢測裝置1，可以確實防止起因於鄰接的探針接腳12的頂端部21之間電氣 連接而發生短路、漏電。又，根據偵測單元2及電路基板檢測裝置1，頂端部21的周面21c上形成第2絕緣層25，由於探針本體20的金屬面不露出，偵測之際發生的切削屑(焊錫屑)即使附著至探針接腳12的頂端部21，也可以確實防止此焊錫屑黏著於周面21c的狀況。因此，根據偵測單元2及電路基板檢測裝置1，可以確實防止黏著於頂端部21的焊錫屑被拉入第1插通孔31a內而此焊錫屑在偵測之際阻礙頂端部21的摺動之狀況，結果，可以實現順利的偵測。 Then, according to the detecting unit 2 and the circuit board detecting device 1, the metal swarf which is generated during the detection is formed by forming the second insulating layer 25 on the peripheral surface 21c which is the tip end region A in the distal end portion 21 of the probe pin 12. Even if it is attached to the distal end portion 21 of the probe pin 12, it is possible to reliably prevent the distal end portions 21 of the adjacent probe pins 12 from being electrically connected via the attached metal chips. Therefore, according to the detecting unit 2 and the circuit board detecting device 1, it is possible to surely prevent electrical contact between the tip end portions 21 of the adjacent probe pins 12 Short circuit and leakage occur when connected. Further, according to the detecting unit 2 and the circuit board detecting device 1, the second insulating layer 25 is formed on the peripheral surface 21c of the distal end portion 21, and the metal surface of the probe main body 20 is not exposed, and chips (stroke) occurring at the time of detection are detected. Even if it adheres to the distal end portion 21 of the probe pin 12, it is possible to surely prevent the solder dust from adhering to the peripheral surface 21c. Therefore, according to the detecting unit 2 and the circuit board detecting device 1, it is possible to surely prevent solder chips adhering to the distal end portion 21 from being drawn into the first insertion hole 31a, and the solder chips hinder the folding of the distal end portion 21 at the time of detection. As a result, smooth detection can be achieved.

又，此偵測單元2及電路基板檢測裝置1中，探針接腳12的中央部23的周面及頂端部21的頂端區域A上連續形成第2絕緣層25，在中央部23形成的第2絕緣層25的上部，形成作為上層的第1絕緣層24。因此，根據偵測單元2及電路基板檢測裝置1，從中央部23的周面到頂端部21的頂端區域A之間，由於探針本體20的表面(金屬面)露出部分不存在，可以更確實防止鄰接的探針接腳12的頂端部21之間經由金屬屑而電氣連接的狀況，同時可以更確實防止焊錫屑黏著於頂端部21的周面21c而被拉入第1插通孔31a內之狀況。 Further, in the detecting unit 2 and the circuit board detecting device 1, the second insulating layer 25 is continuously formed on the circumferential surface of the central portion 23 of the probe pin 12 and the distal end portion A of the distal end portion 21, and is formed in the central portion 23. The first insulating layer 24 as an upper layer is formed on the upper portion of the second insulating layer 25. Therefore, according to the detecting unit 2 and the circuit board detecting device 1, the exposed portion of the surface (metal surface) of the probe body 20 does not exist from the circumferential surface of the central portion 23 to the distal end region A of the distal end portion 21, and may be further It is possible to prevent the state in which the tip end portions 21 of the adjacent probe pins 12 are electrically connected to each other via the swarf, and it is possible to more reliably prevent the solder dust from adhering to the peripheral surface 21c of the distal end portion 21 and being pulled into the first insertion hole 31a. The situation inside.

又，根據此偵測單元2及電路基板檢測裝置1，探針接腳12的頂端部21形成一樣粗的圓柱狀，規定頂端部21的周面21c全區為頂端區域A，藉由形成第2絕緣層25，除了端面21b的頂端部21的表面21a全部的部分以第2絕緣層25覆蓋，可以成為不露出探針本體20的金屬面之狀 態。因此，根據此偵測單元2及電路基板檢測裝置1，可以抑制露出的金屬面至最小限度，結果，可以更確實防止鄰接的探針接腳12的頂端部21之間經由金屬屑而電氣連接的狀況，同時可以更確實防止焊錫屑黏著於頂端部21的周面21c而被拉入第1插通孔31a內之狀況。 Further, according to the detecting unit 2 and the circuit board detecting device 1, the distal end portion 21 of the probe pin 12 is formed in a substantially cylindrical shape, and the entire peripheral surface 21c of the distal end portion 21 is defined as the distal end region A. The insulating layer 25 is covered with the second insulating layer 25 except for the entire surface 21a of the distal end portion 21 of the end surface 21b, and can be formed without exposing the metal surface of the probe body 20. state. Therefore, according to the detecting unit 2 and the circuit board detecting device 1, the exposed metal surface can be suppressed to a minimum, and as a result, it is possible to more reliably prevent the distal end portions 21 of the adjacent probe pins 12 from being electrically connected via the metal chips. At the same time, it is possible to more reliably prevent the solder dust from adhering to the peripheral surface 21c of the distal end portion 21 and being pulled into the first insertion hole 31a.

又，偵測單元及電路基板檢測裝置，不限定於上述的構成。例如，雖然以上所述係關於探針接腳12的頂端部21形成一樣粗的圓柱狀之構成，但如第7圖所示，使用探針接腳12a，頂端部21具有沿著往頂端變小的小徑部21d，可以構成偵測單元2a，而具有此偵測單元2a也可以構成電路基板檢測裝置。又，同圖及後述的第8圖中，有關具有與上述的偵測單元2的構成要素相同功能之物，附以同一符號並省略重複的說明。 Further, the detecting unit and the circuit board detecting device are not limited to the above configuration. For example, although the above-described configuration is such that the distal end portion 21 of the probe pin 12 is formed in a substantially cylindrical shape, as shown in Fig. 7, the probe pin 12a is used, and the distal end portion 21 has a change toward the distal end. The small small-diameter portion 21d can constitute the detecting unit 2a, and the detecting unit 2a can also constitute a circuit board detecting device. In the same figure and the eighth embodiment to be described later, the same functions as those of the above-described detecting unit 2 are denoted by the same reference numerals, and the description thereof will not be repeated.

又，如第8圖所示，小徑部21e隨著往頂端變小的同時，使用頂端形成尖銳狀的探針接腳12b，可以構成偵測單元2b，具有此偵測單元2b也可以構成電路基板檢測裝置。這些偵測單元2a、2b的構成中，規定上述頂端部21中除去上述小徑部21d的部分之周面21c為頂端區域A，此頂端區域A上形成第2絕緣層25。根據此構成，由於頂端部21具有小徑部21d、21e，端子101的形狀為半球狀(參照第7圖)、或電路基板100表面與端子101表面為同一平面(參照第8圖)時，對這些端子101可以確實接觸頂端部21(小徑部21d、21e)。 Further, as shown in Fig. 8, the small-diameter portion 21e can form the detecting unit 2b by forming the sharp-shaped probe pin 12b with the tip end, and the detecting unit 2b can also be configured. Circuit board detecting device. In the configuration of the detecting units 2a and 2b, the peripheral surface 21c of the portion of the distal end portion 21 from which the small-diameter portion 21d is removed is defined as the distal end region A, and the distal end region A is formed with the second insulating layer 25. According to this configuration, the distal end portion 21 has the small diameter portions 21d and 21e, the shape of the terminal 101 is hemispherical (see FIG. 7), or the surface of the circuit board 100 is flush with the surface of the terminal 101 (see FIG. 8). These terminals 101 can surely contact the distal end portion 21 (small diameter portions 21d, 21e).

又，雖然以上記述關於塗佈塗佈材料而形成第1絕緣 層24、第2絕緣層25的範例，但也可以採用絕緣材料形成的圓筒體安裝至探針本體20的頂端部21或中央部23(圓筒體內***探針本體20)，此絕緣材料為第1絕緣層24或第2絕緣層25的構成。 Further, the above description describes the application of the coating material to form the first insulation. An example of the layer 24 and the second insulating layer 25, but a cylindrical body formed of an insulating material may be attached to the top end portion 21 or the central portion 23 of the probe body 20 (the probe body 20 is inserted into the cylindrical body). It is a structure of the first insulating layer 24 or the second insulating layer 25.

其次，第二實施例，係參照圖面說明有關本發明的偵測單元、電路基板檢測裝置以及偵測單元製造方法之實施例。 Next, in the second embodiment, an embodiment of the detecting unit, the circuit board detecting device, and the detecting unit manufacturing method of the present invention will be described with reference to the drawings.

首先，說明有關電路基板檢測裝置701的構成。第10圖所示的電路基板檢測裝置701的構成係可實行有關偵測對象體的一範例之電路基板100的電氣檢測。具體而言，電路基板檢測裝置701的構成，如同圖所示，包括偵測單元702、移動機構703、電路基板支持部704、檢測部705以及控制部706。 First, the configuration of the circuit board detecting device 701 will be described. The circuit board detecting device 701 shown in Fig. 10 can perform electrical detection of the circuit board 100 as an example of the object to be detected. Specifically, the circuit board detecting device 701 includes a detecting unit 702, a moving mechanism 703, a circuit board supporting portion 704, a detecting portion 705, and a control portion 706 as shown in the drawing.

偵測單元702，係偵測單元的一範例，如第11圖所示，其構成包括保持部711與複數的探針712。 The detecting unit 702 is an example of a detecting unit. As shown in FIG. 11, the detecting unit 702 includes a holding portion 711 and a plurality of probes 712.

保持部711，如第11圖所示，以1枚板狀體構成，保持探針712。此時，保持部711，例如，以具有非導電性(絕緣性)的樹脂構成。又，如第12圖所示，保持部711中，形成構成探針712的被覆導線721可插通的插通孔711c。 As shown in FIG. 11, the holding portion 711 is constituted by one plate-like body, and holds the probe 712. At this time, the holding portion 711 is made of, for example, a resin having non-conductivity (insulating property). Further, as shown in Fig. 12, in the holding portion 711, an insertion hole 711c through which the covered lead wire 721 constituting the probe 712 can be inserted is formed.

探針712，如第12、13圖所示，以被覆導線721(線狀或棒狀的導電體的一例)構成。被覆導線721係導體部721a的周圍(除去端面721d的部分)形成絕緣皮膜721b所構成。此探針712，例如，使用外徑D702約50μm(微米)~500μm的漆包線作為被覆導線721。又，探針712，如第 12圖所示，頂端部712a(即，被覆導線721的頂端部721c)從保持部711的一面(同圖中下側的面，以下也稱作「下面711a」)突出，插通至保持部711的插通孔711c，經由作為此插通孔711c內充填的彈性材料之彈性接合劑713，由保持部711保持。此時，從頂端部712a的下面711a開始的突出長，根據被覆導線721的外徑D702、材質等，可以任意規定。此偵測單元702中，此突出長，例如，規定為外徑D702的10倍~100倍左右。又，第11、12圖及後述的第15~21圖中，頂端部712a的突出長與其他部分長度的比率係與實際不同的比率圖示。 As shown in Figs. 12 and 13, the probe 712 is composed of a covered wire 721 (an example of a linear or rod-shaped conductor). The periphery of the covered conductor 721-based conductor portion 721a (the portion where the end surface 721d is removed) is formed by forming an insulating film 721b. This probe 712 is, for example, an enamel wire having an outer diameter D702 of about 50 μm (micrometer) to 500 μm as the covered wire 721. Again, the probe 712, as described As shown in Fig. 12, the distal end portion 712a (that is, the distal end portion 721c of the covered wire 721) protrudes from one surface (the lower surface in the same drawing, hereinafter also referred to as "the lower surface 711a") of the holding portion 711, and is inserted into the holding portion. The insertion hole 711c of the 711 is held by the holding portion 711 via the elastic bonding agent 713 which is an elastic material filled in the insertion hole 711c. At this time, the projection length from the lower surface 711a of the distal end portion 712a can be arbitrarily defined depending on the outer diameter D702 of the covered wire 721, the material, and the like. In the detecting unit 702, the protruding length is, for example, about 10 to 100 times the outer diameter D702. Further, in Figs. 11 and 12 and Figs. 15 to 21 to be described later, the ratio of the length of the projection of the distal end portion 712a to the length of the other portion is shown as a ratio different from the actual value.

彈性接合劑713，可以使用在初期狀態有流動性並具有塗佈(供給)後在有彈性狀態下固化的性質之各種接合劑。具體而言，此偵測單元702使用例如，天然塑膠系接合劑、合成塑膠接合劑、矽系接合劑以及變成矽系接合劑等作為彈性接合劑713。 As the elastic bonding agent 713, various kinds of bonding agents which have fluidity in an initial state and have a property of being cured in an elastic state after coating (supply) can be used. Specifically, the detecting unit 702 uses, for example, a natural plastic-based bonding agent, a synthetic plastic bonding agent, a lanthanum-based bonding agent, and a lanthanum-based bonding agent as the elastic bonding agent 713.

此偵測單元702中，如第12圖所示，由於探針712經由彈性接合劑713由保持部711保持，對作為偵測對象體的電路基板100的端子101偵測時對頂端部712a(被覆導線721的頂端部721c)施力時，由於彈性接合劑713彈性變形，沿著插通孔711c的中心軸701A方向(同圖中的上下方向)可移動探針712。又，偵測時，以伴隨彈性接合劑713彈性變形的彈性力，頂端部712a按壓端子101，藉此頂端部712a確實接觸端子101而電氣連接。又，探針712由以絕緣皮膜721b絕緣的被覆導線721所構成，由於此被覆導 線721由具有非導電性的保持部711保持，成為對其他的探針712(其他的被覆導線721)絕緣的狀態。 In the detection unit 702, as shown in FIG. 12, the probe 712 is held by the holding portion 711 via the elastic bonding agent 713, and the distal end portion 712a is detected when the terminal 101 of the circuit substrate 100 as the detection target body is detected. When the distal end portion 721c) of the covered wire 721 is biased, the elastic bonding agent 713 is elastically deformed, and the probe 712 can be moved in the direction of the central axis 701A of the insertion hole 711c (upward and downward directions in the drawing). Further, at the time of detection, the distal end portion 712a presses the terminal 101 with the elastic force elastically deformed by the elastic bonding agent 713, whereby the distal end portion 712a is surely contacted with the terminal 101 to be electrically connected. Further, the probe 712 is composed of a covered wire 721 insulated by an insulating film 721b, and is covered by this cover. The wire 721 is held by the non-conductive holding portion 711, and is in a state of insulating the other probes 712 (other covered wires 721).

移動機構703的構成可固定偵測單元702，依照控制部706的控制，對電路基板支持部704往接近方向及背離方向移動偵測單元702。電路基板支持部704的構成可保持電路基板100。檢測部705，依照控制部706的控制，根據經由偵測單元702的探針712輸出入的電氣信號，對電路基板100實行斷線檢查、短路檢查等預先決定的電氣檢測。控制部706，藉由控制移動機構703，移動固定於移動機構703的偵測單元702。又，控制部706，控制檢測部705，實行對電路基板100的電氣檢測。 The moving mechanism 703 is configured to fix the detecting unit 702, and moves the detecting unit 702 to the circuit board supporting portion 704 in the approaching direction and the deviation direction in accordance with the control of the control unit 706. The circuit board support portion 704 is configured to hold the circuit board 100. The detection unit 705 performs predetermined electrical detection such as disconnection inspection or short-circuit inspection on the circuit board 100 based on the electrical signal input from the probe 712 of the detection unit 702 in accordance with the control of the control unit 706. The control unit 706 moves the detection unit 702 fixed to the movement mechanism 703 by controlling the movement mechanism 703. Moreover, the control unit 706 controls the detection unit 705 to perform electrical detection on the circuit board 100.

其次，有關偵測單元702的製造方法，參照圖面說明。 Next, the manufacturing method of the detecting unit 702 will be described with reference to the drawings.

首先，如第14圖所示，對於具有非導電性的樹脂所構成的板狀體，以與作為偵測對象體的電路基板100的端子101的排列圖案(參照第11圖)相同的排列圖案，形成插通孔711c，製作保持部711。此時，構成探針712的被覆導線721的外徑D702例如為50μm時，插通孔711c的內徑D701規定為100μm左右(即，外徑D702的2倍左右)(參照第12圖)。 First, as shown in Fig. 14, the plate-like body formed of the non-conductive resin has the same arrangement pattern as the arrangement pattern of the terminals 101 of the circuit board 100 as the detection target (see Fig. 11). The insertion hole 711c is formed, and the holding portion 711 is produced. At this time, when the outer diameter D702 of the covered wire 721 constituting the probe 712 is, for example, 50 μm, the inner diameter D701 of the insertion hole 711c is set to be about 100 μm (that is, about twice the outer diameter D702) (see FIG. 12).

其次，如第15圖所示，上述的外徑D702為50μm的被覆導線721插通至保持部711的各插通孔711c。此時，如同圖及第16圖所示，被覆導線721插通至插通孔711c，被覆導線721的頂端部721c從保持部711的下面711a突出。 Next, as shown in Fig. 15, the above-mentioned covered wire 721 having an outer diameter D702 of 50 μm is inserted into each of the insertion holes 711c of the holding portion 711. At this time, as shown in FIG. 16 and FIG. 16, the covered wire 721 is inserted into the insertion hole 711c, and the tip end portion 721c of the covered wire 721 protrudes from the lower surface 711a of the holding portion 711.

接著，往插通孔711c***被覆導線721全部結束時，如第16圖所示，在保持部711的其他面(同圖中上側的面，以下也稱作「上面711b」)的插通孔711c的緣部(即，插通孔711c內插通的被覆導線721周圍)上，塗佈彈性接合劑713(例如，矽系接合劑)。其次，從保持部711的下面711a側進行吸引。此時，如第12圖所示，上面711b上塗佈的彈性接合劑713被拉入插通孔711c的內周面與被覆導線721之間的隙間內，充填此間隙。 Then, when all the covered wires 721 are inserted into the insertion holes 711c, as shown in Fig. 16, the insertion holes of the other faces of the holding portion 711 (the upper surface in the same drawing, hereinafter also referred to as "the upper surface 711b") are inserted. An elastic bonding agent 713 (for example, a lanthanum-based bonding agent) is applied to the edge of the 711c (that is, around the covered conductive wire 721 through which the insertion hole 711c is inserted). Next, suction is performed from the lower surface 711a side of the holding portion 711. At this time, as shown in Fig. 12, the elastic bonding agent 713 applied on the upper surface 711b is pulled into the gap between the inner circumferential surface of the insertion hole 711c and the covered wire 721, and the gap is filled.

接著，彈性接合劑713固化(乾燥)後，經由對各被覆導線721的頂端部721c進行切削加工、研磨加工，從保持部711的下面711a開始的頂端部721c突出長一致為預先決定的長度。此時，頂端部712a的端面721d形成酸化皮膜、或端面721d上附著絕緣皮膜721b的碎片、髒污時，以切削加工、研磨加工除去。 After the elastic bonding agent 713 is cured (dried), the distal end portion 721c of the holding portion 711 is cut and lengthed by a predetermined length from the distal end portion 721c of the holding portion 711 by cutting and polishing. At this time, when the end surface 721d of the distal end portion 712a forms an acidified film or a piece of the insulating film 721b adhered to the end surface 721d and is stained, it is removed by cutting or polishing.

其次，被覆導線721中對頂端部721c的端面721d進行電鍍處理(例如，鍍金處理)，在端面721d形成有導性(低電阻)的金屬膜。根據上述，完成偵測單元702。 Next, in the covered wire 721, the end surface 721d of the distal end portion 721c is subjected to a plating treatment (for example, gold plating treatment), and a conductive (low resistance) metal film is formed on the end surface 721d. According to the above, the detecting unit 702 is completed.

此時，偵測單元702的構成係1枚板狀體構成的保持部711與被覆導線721構成的探針712。因此，此偵測單元702，相較於接腳狀的探針以複數的構件支持可座屈型之習知偵測單元，構成要素的種類變少且構造單純。又，由於構造單純，如上述，製造之際的工程也單純，這部分可以降低製造成成本。 At this time, the detection unit 702 is constituted by a holding portion 711 composed of one plate-like body and a probe 712 composed of a covered wire 721. Therefore, the detecting unit 702 supports the conventional detecting unit of the seatable type with a plurality of members as compared with the pin-shaped probe, and the types of constituent elements are small and the structure is simple. Moreover, since the structure is simple, as described above, the engineering at the time of manufacture is also simple, and this part can reduce the manufacturing cost.

其次，有關使用電路基板檢測裝置701對電路基板100 進行的電氣檢測方法，參照圖面說明。 Next, regarding the use of the circuit substrate detecting device 701 for the circuit substrate 100 The electrical detection method performed will be described with reference to the drawings.

首先，固定偵測單元702至移動機構703。其次，固定電路基板100至電路基板支持部704。接著，使電路基板檢測裝置701動作。此時，控制部706，藉由控制移動機構703，對電路基板100往接近的方向(第11圖中往下)移動偵測單元702。其次，控制部706，在偵測單元702的各探針712中的頂端部712a接觸電路基板100的端子101時，控制移動機構703，一面對偵測單元702往下施加預先決定大小的重量，一面更往下移動偵測單元702。 First, the detecting unit 702 is fixed to the moving mechanism 703. Next, the circuit board 100 is fixed to the circuit board support portion 704. Next, the circuit board detecting device 701 is operated. At this time, the control unit 706 moves the detecting unit 702 in the direction in which the circuit board 100 approaches (downward in FIG. 11) by controlling the moving mechanism 703. Next, when the distal end portion 712a of each probe 712 of the detecting unit 702 contacts the terminal 101 of the circuit substrate 100, the control unit 706 controls the moving mechanism 703 to apply a predetermined weight to the detecting unit 702. The detection unit 702 is moved further downward.

此時，對偵測單元702施加的重量分散至各探針712，分散的重量按壓電路基板100的端子101。在此，此偵測單元702中，探針712(構成探針712的被覆導線721)經由彈性接合劑713由保持部711保持。因此，此偵測單元702中，偵測之際對端子101的按壓力的反作用力施加至各探針712時，保持探針712的彈性接合劑713彈性變形，因此保持部711中沿著插通孔711c的中心軸701A容許探針712的移動。因此，各探針712的頂端部712a與端子101之間的距離即使各探針712不同時，藉由使彈性接合劑713彈性變形，也可以使各探針712的頂端部712a與端子101之間確實接觸。 At this time, the weight applied to the detecting unit 702 is dispersed to the respective probes 712, and the dispersed weight presses the terminals 101 of the circuit board 100. Here, in the detecting unit 702, the probe 712 (the covered wire 721 constituting the probe 712) is held by the holding portion 711 via the elastic bonding agent 713. Therefore, in the detecting unit 702, when the reaction force against the pressing force of the terminal 101 is applied to each of the probes 712, the elastic bonding agent 713 of the holding probe 712 is elastically deformed, so that the holding portion 711 is inserted along the insertion portion 711. The central axis 701A of the through hole 711c allows the movement of the probe 712. Therefore, when the distance between the distal end portion 712a of each probe 712 and the terminal 101 is different, the distal end portion 712a of each probe 712 and the terminal 101 can be made by elastically deforming the elastic bonding agent 713. Real contact.

接著，檢測部705，依照控制部706的控制，根據經由探針712輸出入的電氣信號，對電路基板100實行電氣檢測。其次，對電路基板100的檢查結束時，控制部706，控制移動機構703，往背離電路基板100的方向移動偵測 單元702。接著，對其他的電路基板100實行電氣檢測之際，重複實行上述的步驟。 Next, the detecting unit 705 performs electrical detection on the circuit board 100 based on the electrical signal input and output via the probe 712 in accordance with the control of the control unit 706. Next, when the inspection of the circuit board 100 is completed, the control unit 706 controls the movement mechanism 703 to move in a direction away from the circuit board 100. Unit 702. Next, when electrical inspection is performed on the other circuit board 100, the above-described steps are repeatedly performed.

於是，此偵測單元702、電路基板檢測裝置701及偵測單元製造方法中，板狀體中形成插通孔711c製作保持部711，功能為探針712的被覆導線721的頂端部721c從保持部711的下面711a突出，插通被覆導線721至插通孔711c內，沿著插通孔711c的中心軸701A可移動地經由彈性接合劑713由保持部711保持被覆導線721，插通孔711c內充填彈性接合劑713，製造偵測單元。即，此偵測單元702係以1枚枚狀體構成的保持部711以及被覆導線721構成的探針712所構成。因此，此偵測單元702，根據電路基板檢測裝置701及偵測單元製造方法，相較於接腳狀的探針以複數的構件支持可座屈型之習知偵測單元，由於偵測單元702的構成要素的種類少且構造單純，製造之際可以單純化步驟的結果，此部分可以充分降低製造成本。因此，根據此偵測單元702、電路基板檢測裝置701及偵測單元製造方法，構造單純的部分，對應高密度的電路基板100，可以容易小型化偵測單元702，同時可以充分降低其製造成本。又，根據此偵測單元702、電路基板檢測裝置701及偵測單元製造方法，用以輸出入信號的電極與探針的連接部之間的接觸及背離不同於每次偵測時重複的習知構成，由於如此每次偵測時重複接觸及背離的部分不存在，可以確實防止起因於此部分中的接觸不良而發生的故障。 Therefore, in the detecting unit 702, the circuit board detecting device 701, and the detecting unit manufacturing method, the insertion hole 711c is formed in the plate-like body to form the holding portion 711, and the tip end portion 721c of the covered wire 721 of the probe 712 is maintained. The lower surface 711a of the portion 711 protrudes, the covered wire 721 is inserted into the insertion hole 711c, and the covered wire 721 is held by the holding portion 711 via the elastic bonding agent 713 along the central axis 701A of the insertion hole 711c, and the insertion hole 711c is inserted. The elastic bonding agent 713 is filled inside to manufacture a detecting unit. In other words, the detecting unit 702 is configured by a holding portion 711 composed of one ridge and a probe 712 composed of a covered wire 721. Therefore, the detecting unit 702 supports the conventional detecting unit capable of the flexing type by the plurality of members according to the circuit board detecting device 701 and the detecting unit manufacturing method. The number of constituent elements of 702 is small and the structure is simple, and the result of the simplification step can be obtained at the time of production, and this part can sufficiently reduce the manufacturing cost. Therefore, according to the detecting unit 702, the circuit board detecting device 701, and the detecting unit manufacturing method, a simple portion is constructed, and the high-density circuit substrate 100 can be easily miniaturized, and the manufacturing cost can be sufficiently reduced. . Moreover, according to the detecting unit 702, the circuit board detecting device 701, and the detecting unit manufacturing method, the contact and the deviation between the electrode for inputting the signal and the connecting portion of the probe are different from the repetition of each detecting. Knowing the configuration, since the portion that repeatedly contacts and deviates from each other during the detection does not exist, it is possible to surely prevent the malfunction caused by the contact failure in this portion.

又，根據此偵測單元702及電路基板檢測裝置701，由於探針712以被覆導線721構成，因為被覆導線721本身有絕緣性，各被覆導線721之間確實絕緣的狀態下，各被覆導線721可以由保持部711保持。又，由於探針712以被覆導線721構成，此被覆導線721可以直接連接至檢測部705。即，作為探針712的被覆導線721可以維持原狀用作與檢測部705連接用的引線。因此，比較作為探針712的導電體與採用別體的連接用引線的構成，作為探針712的導電體與連接用的引線之間的連結不需要的部分，可以更降低偵測單元702的製造成本。 Further, according to the detecting unit 702 and the circuit board detecting device 701, since the probe 712 is constituted by the covered wire 721, since the covered wire 721 itself is insulative, the covered wires 721 are insulated from each other, and the covered wires 721 are covered. It can be held by the holding portion 711. Further, since the probe 712 is constituted by the covered wire 721, the covered wire 721 can be directly connected to the detecting portion 705. In other words, the covered lead wire 721 as the probe 712 can be used as a lead wire for connection to the detecting portion 705. Therefore, by comparing the configuration of the conductor used as the probe 712 and the connection lead using the other body, it is possible to further reduce the detection unit 702 as a portion unnecessary for the connection between the conductor of the probe 712 and the lead for connection. manufacturing cost.

其次，說明第17圖所示的偵測單元732。又，以下的說明中，有關具有與上述的偵測單元702相同的構成要素，附以同一符號並省略重複的說明。偵測單元732，係偵測單元的另一範例，如同圖所示，係具有保持部711與探針712的構成。此時，保持部711的插通孔711c內，插通分別構成2個(複數的一例)探針712的2個被覆導線721。又，插通孔711c內插通的各被覆導線721，沿著插通孔711c的中心軸701A可移動且與其他互為絕緣的狀態下，經由插通孔711c內充填彈性接合劑713由保持部711保持。又，1個插通孔711c內插通的探針712數量不限於2個，可以規定任意的複數。 Next, the detecting unit 732 shown in Fig. 17 will be described. In the following description, the same components as those of the above-described detection unit 702 are denoted by the same reference numerals, and the description thereof will not be repeated. The detecting unit 732 is another example of the detecting unit, and has a configuration of the holding portion 711 and the probe 712 as shown in the drawing. At this time, in the insertion hole 711c of the holding portion 711, two covered wires 721 each constituting two (a plurality of) probes 712 are inserted. Further, each of the covered conductive wires 721 inserted through the insertion hole 711c is movable along the central axis 701A of the insertion hole 711c and is insulated from each other, and is filled with the elastic bonding agent 713 via the insertion hole 711c. The part 711 is kept. Further, the number of probes 712 inserted into one insertion hole 711c is not limited to two, and any plural number may be defined.

根據此偵測單元732，由於1個插通孔711c內插通複數的探針712，相較於1個插通孔711c內插通1探針712的構成，各探針712之間的間隔(間距)可以縮短。因此， 根據此偵測單元732，一面充分地降低製造成本，一面對應更高密度的電路基板100可以更小型化偵測單元732。 According to the detecting unit 732, since a plurality of probes 712 are inserted into one insertion hole 711c, the interval between the probes 712 is compared with the configuration in which one probe 712 is inserted into one insertion hole 711c. (Pitch) can be shortened. therefore, According to the detecting unit 732, the manufacturing unit can be further reduced in size, and the detecting unit 732 can be further miniaturized in accordance with the circuit board 100 having a higher density.

其次，說明有關第18圖所示的偵測單元742。又，以下的說明中，有關與上述的偵測單元702相同的構成要素，附以同一符號並省略重複的說明。偵測單元742係偵測單元的又另一範例，如同圖所示，具有保持部711與探針712而構成。此時，保持部711的插通孔711c內，插通分別構成2個(複數的一例)探針712的2個被覆導線721。各被覆導線721，沿著插通孔711c的中心軸701A可移動且與其他互為絕緣的狀態下，經由插通孔711c內充填彈性接合劑713由保持部711保持。又，如同圖所示，各探針712(1個插通孔711c內插通各被覆導線721)在扭轉狀態下插通至插通孔711c內。 Next, the detecting unit 742 shown in Fig. 18 will be explained. In the following description, the same components as those of the above-described detection unit 702 are denoted by the same reference numerals and the description thereof will not be repeated. The detecting unit 742 is another example of the detecting unit, and has a holding portion 711 and a probe 712 as shown in the drawing. At this time, in the insertion hole 711c of the holding portion 711, two covered wires 721 each constituting two (a plurality of) probes 712 are inserted. Each of the covered wires 721 is held by the holding portion 711 via the insertion hole 711c by being filled with the elastic bonding agent 713 in a state in which the center axis 701A of the insertion hole 711c is movable and insulated from each other. Further, as shown in the figure, each of the probes 712 (the respective covered wires 721 are inserted into one insertion hole 711c) is inserted into the insertion hole 711c in a twisted state.

根據此偵測單元742，由於扭轉狀態的複數的探針712插通至插1個通孔711c內，1個插通孔711c內插通的複數的探針712之間的間隔(間距)可以更縮短。因此，根據此偵測單元742，一面充分地降低製造成本，一面對應更高密度的電路基板100可以更小型化偵測單元742。 According to the detecting unit 742, since the plurality of probes 712 in the twisted state are inserted into the one through hole 711c, the interval (pitch) between the plurality of probes 712 inserted through the one insertion hole 711c can be Shorter. Therefore, according to the detecting unit 742, the manufacturing cost can be sufficiently reduced, and the detecting unit 742 can be further miniaturized corresponding to the circuit board 100 of higher density.

又，偵測單元及電路基板檢測裝置，不限定於上述的構成。例如，有關使用形成線狀的導體的被覆導線721的範例，如上所述，取代覆導線721，但也可以採用使用形成棒狀的導體之構成。 Further, the detecting unit and the circuit board detecting device are not limited to the above configuration. For example, as an example of using the covered wire 721 forming a linear conductor, as described above, the covered wire 721 is replaced, but a configuration in which a rod-shaped conductor is used may be employed.

又，構成探針712的被覆導線721中，雖然以上所述係除去端面721d的部分以絕緣皮膜721b覆蓋的構成例(參 照第12圖)，如第19圖所示，使用頂端部721c的周面的一部分(除去端面721d的部分)中去掉絕緣皮膜721b的被覆導線721所構成的探針712，可以構成偵測單元752，具有此偵測單元752也可以構成電路基板檢測裝置。 Further, in the covered conductive wire 721 constituting the probe 712, a configuration example in which the portion where the end surface 721d is removed is covered with the insulating film 721b is described. According to Fig. 12, as shown in Fig. 19, the probe 712 including the covered wire 721 of the insulating film 721b is removed from a part of the peripheral surface of the distal end portion 721c (the portion where the end surface 721d is removed), and the detecting unit can be constructed. 752. The detecting unit 752 can also constitute a circuit board detecting device.

又，如第20圖所示，使用頂端部721c形成針狀(越往頂端慢慢變細的形狀)的被覆導線721所構成的探針712，可以構成偵測單元762，具有此偵測單元762也可以構成電路基板檢測裝置。又，如第21圖所示，使用頂端部721c形成半球體狀的被覆導線721所構成的探針712，可以構成偵測單元772，具有此偵測單元772也可以構成電路基板檢測裝置。 Further, as shown in Fig. 20, the probe unit 712 formed by the covered wire 721 having the needle-shaped portion (the shape gradually tapered toward the tip end) is formed by the distal end portion 721c, and the detecting unit 762 can be constructed. The 762 can also constitute a circuit board detecting device. Further, as shown in Fig. 21, the probe unit 712 formed by forming the hemispherical coated lead wire 721 using the distal end portion 721c can constitute the detecting unit 772, and the detecting unit 772 can also constitute the circuit board detecting device.

其次，第三實施例，係參照圖面說明有關本發明的偵測單元、電路基板檢測裝置以及偵測單元製造方法之實施例。 Next, in the third embodiment, an embodiment of the detecting unit, the circuit board detecting device, and the detecting unit manufacturing method of the present invention will be described with reference to the drawings.

首先，說明有關電路基板檢測裝置801的構成。第22圖所示的電路基板檢測裝置801的構成係可實行有關偵測對象體的一範例之電路基板100的電氣檢測。具體而言，電路基板檢測裝置801的構成，如同圖所示，包括偵測單元802、移動機構803、電路基板支持部804、檢測部805以及控制部806。 First, the configuration of the circuit board detecting device 801 will be described. The circuit board detecting device 801 shown in Fig. 22 can perform electrical detection of the circuit board 100 as an example of the object to be detected. Specifically, the configuration of the circuit board detecting device 801 includes a detecting unit 802, a moving mechanism 803, a circuit board supporting portion 804, a detecting portion 805, and a control portion 806 as shown in the drawing.

此偵測單元802，如第23圖所示，具有保持部811及複數的探針812而構成。 As shown in FIG. 23, the detecting unit 802 has a holding portion 811 and a plurality of probes 812.

保持部811，如第23圖所示，以1枚板狀體構成，保持探針812。此時，保持部811，例如，以具有非導電性(絕 緣)的樹脂構成。又，如第24圖所示，保持部811中，形成構成探針812的被覆導線821的頂端部821c可插通之插通孔811c。此偵測單元802中，如後述，保持部811的插通孔811c內插通的被覆導線821的頂端部821c以接合劑813接合，固定至插通孔811c的內周面，藉此探針812(被覆導線821)由保持部811保持。 As shown in Fig. 23, the holding portion 811 is constituted by one plate-like body, and holds the probe 812. At this time, the holding portion 811, for example, has non-conductivity (absolutely The resin composition of the edge. Further, as shown in Fig. 24, in the holding portion 811, the insertion hole 811c through which the distal end portion 821c of the covered lead wire 821 constituting the probe 812 can be inserted is formed. In the detecting unit 802, as described later, the distal end portion 821c of the covered lead wire 821 inserted into the insertion hole 811c of the holding portion 811 is joined by the bonding agent 813 and fixed to the inner circumferential surface of the insertion hole 811c, whereby the probe 812 (covered wire 821) is held by the holding portion 811.

探針812的構成，如第24、25圖所示，具有作為導線的一例的被覆導線821以及作為頂端構件的一例的頂端晶片822。被覆導線821在導體部821a的周圍形成絕緣皮膜821b而構成。此探針812，例如，使用外徑D802約50μm(微米)~500μm的漆包線作為被覆導線821。又，被覆導線821，如第24圖所示，其頂端部821c插通至保持部811的插通孔811c內，頂端部821c的端面821d與保持部811的一面(同圖中下側的面，以下也稱作「下面811a」)成為同一平面的狀態下，以接合劑813固定至保持部811(頂端部821c埋入保持部811)。 As shown in Figs. 24 and 25, the probe 812 has a covered lead wire 821 as an example of a lead wire and a tip end wafer 822 as an example of a distal end member. The covered wire 821 is formed by forming an insulating film 821b around the conductor portion 821a. This probe 812 is, for example, an enamel wire having an outer diameter D802 of about 50 μm (micrometer) to 500 μm as the covered wire 821. Further, as shown in Fig. 24, the covered wire 821 is inserted into the insertion hole 811c of the holding portion 811, and the end surface 821d of the distal end portion 821c and one surface of the holding portion 811 (the lower surface in the same drawing) In the state in which the "the lower surface 811a" is the same plane, the bonding agent 813 is fixed to the holding portion 811 (the distal end portion 821c is embedded in the holding portion 811).

此時，被覆導線821因絕緣皮膜821b而具有絕緣性，且因為頂端部821c埋入具有非導電性的保持部811，各探針812在各探針812之間互為絕緣的狀態下，由保持部811保持。 At this time, the covered conductive wire 821 has insulating properties due to the insulating film 821b, and the probe portion 812 is insulated from each of the probes 812 by the non-conductive holding portion 811 in the distal end portion 821c. The holding portion 811 is held.

頂端晶片822具有導電性及彈性，如第24、25圖所示，形成圓柱狀(球狀、橢圓體狀、柱狀及錐體狀中的任一形狀之一例)。此時，頂端晶片822以具有導電性及彈性的高分子材料(例如導電性塑膠)形成。又，如第24圖所示，頂端 晶片822的形成係其外徑D803比被覆導線821的外徑D802稍小(例如，與被覆導線821的導體部821a同程度的外徑)。又，頂端晶片822，如同圖所示，基端部822a電氣連接至被覆導線821中頂端部821c的端面821d的狀態下，從保持部811的下面811a突出，固定至被覆導線821。 The tip wafer 822 has electrical conductivity and elasticity, and as shown in Figs. 24 and 25, it is formed in a columnar shape (an example of any of a spherical shape, an ellipsoid shape, a column shape, and a pyramid shape). At this time, the tip wafer 822 is formed of a polymer material (for example, a conductive plastic) having conductivity and elasticity. Again, as shown in Figure 24, the top The wafer 822 is formed such that its outer diameter D803 is slightly smaller than the outer diameter D802 of the covered wire 821 (for example, the outer diameter of the same portion as the conductor portion 821a of the covered wire 821). Further, as shown in the figure, the distal end wafer 822 is electrically connected to the end surface 821d of the distal end portion 821c of the covered lead wire 821 as shown in the figure, and protrudes from the lower surface 811a of the holding portion 811 to be fixed to the covered conductive wire 821.

此時，由於頂端晶片822具有導電性及彈性，對作為偵測對象的電路基板100的端子101偵測時，由於頂端晶片822的彈性變形，頂端晶片822的頂端部822b按壓端子101，藉此頂端晶片822的頂端部822b確實接觸端子101，電氣連接。 At this time, since the tip wafer 822 has conductivity and elasticity, when the terminal 101 of the circuit board 100 to be detected is detected, the tip end portion 822b of the tip wafer 822 presses the terminal 101 due to the elastic deformation of the tip wafer 822. The top end portion 822b of the top wafer 822 does contact the terminal 101 and is electrically connected.

移動機構803的構成可固定偵測單元802，依照控制部806的控制，對電路基板支持部804往接近方向及背離方向移動偵測單元802。電路基板支持部804的構成可保持電路基板100。檢測部805，依照控制部806的控制，根據經由偵測單元802的探針812輸出入的電氣信號，對電路基板100實行斷線檢查、短路檢查等預先決定的電氣檢測。控制部806，藉由控制移動機構803，移動固定於移動機構803的偵測單元802。又，控制部806，控制檢測部805，實行對電路基板100的電氣檢測。 The moving mechanism 803 is configured to fix the detecting unit 802, and moves the detecting unit 802 to the circuit board supporting portion 804 in the approaching direction and the deviation direction in accordance with the control of the control unit 806. The circuit board support portion 804 is configured to hold the circuit board 100. The detection unit 805 performs predetermined electrical detection such as disconnection inspection or short-circuit inspection on the circuit board 100 based on an electrical signal input from the probe 812 of the detection unit 802 in accordance with the control of the control unit 806. The control unit 806 moves the detecting unit 802 fixed to the moving mechanism 803 by controlling the moving mechanism 803. Moreover, the control unit 806 controls the detection unit 805 to perform electrical detection on the circuit board 100.

其次，有關偵測單元802的製造方法，參照圖面說明。 Next, a method of manufacturing the detecting unit 802 will be described with reference to the drawings.

首先，如第26圖所示，對於具有非導電性的樹脂所構成的板狀體，以與作為偵測對象體的電路基板100的端子101的排列圖案(參照第23圖)相同的排列圖案，形成插通孔811c，製作保持部811。此時，構成探針812的被覆導 線821的外徑D802例如為50μm時，規定插通孔811c的內徑D801，以產生1μm~5μm左右(即，相當於外徑D802的2%~10%左右的長度)的間隙(參照第24圖)。 First, as shown in Fig. 26, the plate-like body formed of the non-conductive resin has the same arrangement pattern as the arrangement pattern of the terminals 101 of the circuit board 100 as the detection target (see Fig. 23). The insertion hole 811c is formed, and the holding portion 811 is produced. At this time, the covered guide constituting the probe 812 When the outer diameter D802 of the wire 821 is 50 μm, for example, the inner diameter D801 of the insertion hole 811c is defined to generate a gap of about 1 μm to 5 μm (that is, a length corresponding to about 2% to 10% of the outer diameter D802) (see the 24)).

其次，如第27圖所示，上述的外徑D802為50μm的被覆導線821插通至保持部811的各插通孔811c。此時，如同圖及第28圖所示，被覆導線821插通至插通孔811c，被覆導線821的頂端部821c從保持部811的下面811a稍微突出。 Next, as shown in Fig. 27, the above-described covered wire 821 having an outer diameter D802 of 50 μm is inserted into each of the insertion holes 811c of the holding portion 811. At this time, as shown in FIG. 28 and FIG. 28, the covered wire 821 is inserted into the insertion hole 811c, and the tip end portion 821c of the covered wire 821 slightly protrudes from the lower surface 811a of the holding portion 811.

接著，往插通孔811c***被覆導線821全部結束時，如第28圖所示，在保持部811的其他面(同圖中上側的面，以下也稱作「上面811b」)的插通孔811c的緣部(即，插通孔811c內插通的被覆導線821周圍)上，塗佈(供給)接合劑813。其次，從保持部811的下面811a側進行吸引。此時，如第29圖所示，上面811b上塗佈的接合劑813被拉入插通孔811c的內周面與被覆導線821之間的隙間內，充填此間隙。 When all the covered conductive wires 821 are inserted into the insertion holes 811c, as shown in FIG. 28, the insertion holes of the other surface of the holding portion 811 (the upper surface in the same figure, hereinafter also referred to as "the upper surface 811b") are inserted. The bonding agent 813 is applied (supplied) to the edge of the 811c (that is, around the covered conductive wire 821 through which the insertion hole 811c is inserted). Next, suction is performed from the lower surface 811a side of the holding portion 811. At this time, as shown in Fig. 29, the bonding agent 813 applied on the upper surface 811b is pulled into the gap between the inner circumferential surface of the insertion hole 811c and the covered conductive wire 821, and the gap is filled.

接著，接合劑813固化(乾燥)後，如第29圖所示，切斷從保持部811的下面811a突出之被覆導線821的頂端部821c。其次，進行研磨，下面811a與頂端部821c的端面821d成為同一平面。藉此，端部821c的端面821d，與保持部811的下面811a成為同一平面的狀態且對保持部811絕緣的狀態下，固定至保持部811。 Next, after the bonding agent 813 is cured (dried), as shown in FIG. 29, the distal end portion 821c of the covered conductive wire 821 protruding from the lower surface 811a of the holding portion 811 is cut. Next, polishing is performed, and the lower surface 811a and the end surface 821d of the distal end portion 821c are flush with each other. Thereby, the end surface 821d of the end portion 821c is fixed to the holding portion 811 in a state in which the end surface 821d of the holding portion 811 is in the same plane and is insulated from the holding portion 811.

接著，頂端晶片822固定至被覆導線821。具體而言，如第30圖所示，例如，頂端晶片822的基端部822a上塗 佈導電性接合劑814。其次，使基端部822a與端面821d電氣接觸。接著，基端部822a與端面821d間維持接觸狀態，直到導電性接合劑固化。藉此，基端部822a電氣連接至被覆導線821中頂端部821c的端面821d狀態下，從保持部811的下面811a突出，頂端晶片822固定至被覆導線821。以下，同樣地，藉由固定頂端晶片822至各被覆導線821，完成偵測單元802。 Next, the top wafer 822 is fixed to the covered wire 821. Specifically, as shown in Fig. 30, for example, the base end portion 822a of the top end wafer 822 is coated. Conductive bonding agent 814. Next, the base end portion 822a is brought into electrical contact with the end surface 821d. Next, the base end portion 822a and the end surface 821d are maintained in contact with each other until the conductive bonding agent is cured. Thereby, the base end portion 822a is electrically connected to the end surface 821d of the tip end portion 821c of the covered lead wire 821, and protrudes from the lower surface 811a of the holding portion 811, and the tip end wafer 822 is fixed to the covered wire 821. Hereinafter, the detecting unit 802 is completed by fixing the tip wafer 822 to each of the covered wires 821.

此時，此偵測單元802係以1枚板狀體構成的保持部811以及被覆導線821及頂端晶片822構成的探針812所構成。因此，此偵測單元802，相較於接腳狀的探針以複數的構件支持可座屈型之習知偵測單元，構成要素的種類少且構造單純。又，由於構造單純，如上述，製造之際的工程也單純，此部分可以降低製造成本。因此，此偵測單元802，構造單純的部分，對應高密度的電路基板100，可以容易小型化偵測單元802，並且也可以充分降低其製造成本。又，此偵測單元802中，用以輸出入信號的電極與探針的連接部之間的接觸及背離不同於每次偵測時重複的習知構成，由於如此每次偵測時重複接觸及背離的部分不存在，可以確實防止起因於此部分中的接觸不良而發生的故障。 At this time, the detecting unit 802 is composed of a holding portion 811 composed of one plate-like body and a probe 812 including a covered wire 821 and a tip wafer 822. Therefore, the detecting unit 802 supports the conventional detecting unit of the lockable type with a plurality of members as compared with the pin-shaped probe, and has few types of components and a simple structure. Moreover, since the structure is simple, as described above, the engineering at the time of manufacture is also simple, and this part can reduce the manufacturing cost. Therefore, the detecting unit 802 has a simple structure, and corresponds to the high-density circuit substrate 100, so that the detecting unit 802 can be easily miniaturized, and the manufacturing cost thereof can be sufficiently reduced. Moreover, in the detecting unit 802, the contact and the deviation between the electrode for inputting and outputting signals and the connecting portion of the probe are different from the conventional configuration repeated each time, since repeated contact is detected every time. The portion that is away from it does not exist, and it is possible to surely prevent a malfunction that occurs due to poor contact in this portion.

又，此偵測單元802中，被覆導線821的端面821d與保持部811的下面811a成為同一平面的狀態下固定被覆導線821至保持部811，頂端晶片822固定至此被覆導線821的端面821d。因此，相同形狀(尺寸)的頂端晶片822固定 至各被覆導線821的端面821d，藉此頂端晶片822從保持部811的下面811a開始的突出量(從下面811a開始到頂端晶片822的頂端部822b為止的長度)可以一致為相同的長度。 Further, in the detecting unit 802, the end surface 821d of the covered wire 821 and the lower surface 811a of the holding portion 811 are flush with the covered wire 821 to the holding portion 811, and the tip end wafer 822 is fixed to the end surface 821d of the covered wire 821. Therefore, the top wafer 822 of the same shape (size) is fixed The end surface 821d of each of the covered wires 821 can be made to have the same length from the lower surface 811a of the holding portion 811 (the length from the lower surface 811a to the distal end portion 822b of the tip wafer 822).

其次，有關使用電路基板檢測裝置801對電路基板100進行電氣檢測的方法，參照圖面說明。 Next, a method of electrically detecting the circuit board 100 using the circuit board detecting device 801 will be described with reference to the drawings.

首先，固定偵測單元802至移動機構803。其次，固定電路基板100至電路基板支持部804。接著，使電路基板檢測裝置801動作。此時，控制部806，藉由控制移動機構803，往接近電路基板100的方向(第23圖中往下)移動偵測單元802。其次，控制部806，當偵測單元802的各探針812中的頂端晶片822的頂端部822b接觸電路基板100的端子101時，控制移動機構803，一面對偵測單元802往下施加預先決定的大小的重量，一面更往下移動偵測單元802。 First, the detecting unit 802 is fixed to the moving mechanism 803. Next, the circuit board 100 is fixed to the circuit board support portion 804. Next, the circuit board detecting device 801 is operated. At this time, the control unit 806 moves the detecting unit 802 toward the direction of the circuit board 100 (downward in FIG. 23) by controlling the moving mechanism 803. Next, when the top end portion 822b of the top end wafer 822 of each of the probes 812 of the detecting unit 802 contacts the terminal 101 of the circuit substrate 100, the control unit 806 controls the moving mechanism 803 to apply the pre-detection unit 802 downward. The weight of the determined size moves the detection unit 802 downward.

此時，對偵測單元802施加的重量分散至各探針812，分散的重量按壓電路基板100的端子101。此時，構成探針812之頂端晶片822的頂端部822b沿著偵測方向(上下方向)彈性變形(壓縮變形)。 At this time, the weight applied to the detecting unit 802 is dispersed to the respective probes 812, and the dispersed weight presses the terminals 101 of the circuit board 100. At this time, the distal end portion 822b of the distal end wafer 822 constituting the probe 812 is elastically deformed (compression-deformed) in the detection direction (up-and-down direction).

在此，例如，形成球狀、錐體狀的頂端晶片822中，沿著中心軸方向(偵測方向)，根據變形量的大小，與端子101間的接觸面積變化(變形量越大接觸面積越大，越小接觸面積越小地變化)。相對於此，偵測單元802採用的頂端晶片822，由於形成圓柱狀，不拘於沿著中心軸方向的變 形量，與端子101間的接觸面積可以維持固定(或，大致固定)。即，與端子101間的接觸面積維持固定(或，大致固定)的狀態下，沿著中心軸可以大彈性變形。因此，各頂端晶片822的頂端部822b與端子101間的距離即使每頂端晶片822大不同的情況下，藉由使頂端晶片822大彈性變形，一面維持接觸面積固定(或，大致固定)，一面可以使各頂端晶片822的頂端部822b與端子101確實接觸。 Here, for example, in the spherical or pyramid-shaped distal end wafer 822, the contact area with the terminal 101 varies depending on the amount of deformation along the central axis direction (detection direction) (the larger the contact area is, the larger the contact area is) The larger the smaller the contact area, the smaller the change). On the other hand, the top end wafer 822 used by the detecting unit 802 is formed in a cylindrical shape and does not depend on the direction along the central axis. The amount of contact and the contact area with the terminal 101 can be maintained constant (or substantially fixed). That is, in a state where the contact area with the terminal 101 is maintained constant (or substantially fixed), the central axis can be largely elastically deformed. Therefore, even when the distance between the distal end portion 822b of each of the distal end wafers 822 and the terminal 101 is greatly different from the distal end wafer 822, the distal end wafer 822 is elastically deformed to maintain a constant contact area (or substantially fixed). The tip end portion 822b of each of the tip wafers 822 can be surely brought into contact with the terminal 101.

接著，檢測部805，依照控制部806的控制，根據經由探針812輸出入的電氣信號，對電路基板100實行電氣檢測。其次，對電路基板100的檢查結束時，控制部806，藉由控制移動機構803，往背離電路基板100的方向移動偵測單元802。接著，對其他的電路基板100實行電氣檢測之際，重複實行上述的步驟。 Next, the detecting unit 805 performs electrical detection on the circuit board 100 based on the electrical signal input and output via the probe 812 in accordance with the control of the control unit 806. Next, when the inspection of the circuit board 100 is completed, the control unit 806 moves the detecting unit 802 in a direction away from the circuit board 100 by controlling the moving mechanism 803. Next, when electrical inspection is performed on the other circuit board 100, the above-described steps are repeatedly performed.

於是，此偵測單元802、電路基板檢測裝置801及偵測單元製造方法中，板狀體中形成插通孔811c，製作保持部811，構成探針812的被覆導線821的頂端部821c插通至插通孔811c內，固定至保持部811，構成探針812的圓柱狀之頂端晶片822的基端部822a電氣連接至端面821d的狀態下，頂端晶片822從下面811a突出，固定被覆導線821，製造偵測單元802。即，此偵測單元802係以1枚板狀體構成的保持部811以及被覆導線821及頂端晶片822構成的探針812所構成。因此，此偵測單元802，根據電路基板檢測裝置801及偵測單元製造方法，相較於接腳狀的探針以複數的構件支持可座屈型之習知偵測單元，由於 偵測單元802的構成要素的種類少且構造單純，製造之際可以單純化工程的結果，此部分可以充分降低製造成本。因此，根據此偵測單元802、電路基板檢測裝置801及偵測單元製造方法，構造單純的部分，對應高密度的電路基板100，可以容易小型化偵測單元802，同時可以充分降低其製造成本。又，根據此偵測單元802、電路基板檢測裝置801及偵測單元製造方法，用以輸出入信號的電極與探針的連接部之間的接觸及背離不同於每次偵測時重複的習知構成，由於如此每次偵測時重複接觸及背離的部分不存在，可以確實防止起因於此部分中的接觸不良而發生的故障。 Then, in the detecting unit 802, the circuit board detecting device 801, and the detecting unit manufacturing method, the insertion hole 811c is formed in the plate-like body, and the holding portion 811 is formed, and the tip end portion 821c of the covered wire 821 constituting the probe 812 is inserted. The insertion hole 811c is fixed to the holding portion 811, and the base end portion 822a of the cylindrical tip end wafer 822 constituting the probe 812 is electrically connected to the end surface 821d. The tip end wafer 822 protrudes from the lower surface 811a to fix the covered wire 821. , manufacturing detection unit 802. That is, the detecting unit 802 is constituted by a holding portion 811 composed of one plate-like body and a probe 812 including a covered wire 821 and a tip end wafer 822. Therefore, the detecting unit 802 supports the known detecting unit of the seatable type by a plurality of members according to the circuit board detecting device 801 and the detecting unit manufacturing method. The detection unit 802 has a small number of components and a simple structure, and can simplify the manufacturing cost when manufacturing. Therefore, according to the detecting unit 802, the circuit board detecting device 801, and the detecting unit manufacturing method, a simple portion is constructed, and the high-density circuit substrate 100 can be easily miniaturized, and the manufacturing cost can be sufficiently reduced. . Moreover, according to the detecting unit 802, the circuit board detecting device 801, and the detecting unit manufacturing method, the contact and the deviation between the electrode for inputting and outputting signals and the connecting portion of the probe are different from the repetition of each detecting. Knowing the configuration, since the portion that repeatedly contacts and deviates from each other during the detection does not exist, it is possible to surely prevent the malfunction caused by the contact failure in this portion.

又，此偵測單元802及電路基板檢測裝置801中，被覆導線821的端面821d與保持部811的下面811a成為同一平面的狀態下，固定被覆導線821至保持部811。因此，根據此偵測單元802及電路基板檢測裝置801，藉由固定同樣形狀(尺寸)的頂端晶片822至各被覆導線821的端面821d，可以確實且容易製造從保持部811的下面811a開始的頂端晶片822的突出量(從下面811a開始到頂端晶片822的頂端部822b為止的長度)一致為同樣長度之高精度偵測單元802。 In the detection unit 802 and the circuit board detecting device 801, the covered wire 821 is fixed to the holding portion 811 with the end surface 821d of the covered wire 821 and the lower surface 811a of the holding portion 811 being flush with each other. Therefore, according to the detecting unit 802 and the circuit board detecting device 801, by fixing the tip end wafer 822 having the same shape (size) to the end surface 821d of each of the covered wires 821, it is possible to reliably and easily manufacture the lower surface 811a of the holding portion 811. The protruding amount of the tip wafer 822 (the length from the lower surface 811a to the tip end portion 822b of the top end wafer 822) coincides with the high-precision detecting unit 802 of the same length.

又，根據此偵測單元802及電路基板檢測裝置801，以具有導電性及彈性的高分子材料形成頂端晶片822，由於對高分子材料容易加工，對應偵測對象體形狀之所希望的形狀的頂端晶片822可以確實且容易形成的結果，可以 確實且容易製造適合作為偵測對象體的基板的端子101、導體圖案的形狀之偵測單元802。 Further, according to the detecting unit 802 and the circuit board detecting device 801, the tip wafer 822 is formed of a polymer material having conductivity and elasticity, and the polymer material is easily processed, and the desired shape of the object shape is detected. The result of the top wafer 822 being positive and easy to form can It is possible to easily and easily manufacture the terminal 101 of the substrate to be detected, and the detecting unit 802 of the shape of the conductor pattern.

又，根據此偵測單元802及電路基板檢測裝置801，由於頂端晶片822形成柱狀，不同於具有形成例如球狀、錐狀體的頂端晶片之構成，不拘於沿著中心軸方向(偵測方向)的變形量，與端子101的接觸面積可以維持固定(或，大致固定)。因此，與端子101的接觸面積維持固定的狀態下，沿著中心軸方向可以大彈性變形。因此，各頂端晶片822的頂端部822b與端子101間的距離即使每頂端晶片822大不同的情況下，藉由使頂端晶片822大彈性變形，一面維持接觸面積固定(或，大致固定)，一面可以使各頂端晶片822的頂端部822b與端子101間確實接觸。 Further, according to the detecting unit 802 and the circuit board detecting device 801, since the top end wafer 822 is formed in a columnar shape, unlike the configuration of the top end wafer having a spherical shape or a tapered shape, it is not limited to the central axis direction (detection) The amount of deformation in the direction) and the contact area with the terminal 101 can be maintained constant (or substantially fixed). Therefore, in a state where the contact area with the terminal 101 is maintained constant, it is possible to largely elastically deform along the central axis direction. Therefore, even when the distance between the distal end portion 822b of each of the distal end wafers 822 and the terminal 101 is greatly different from the distal end wafer 822, the distal end wafer 822 is elastically deformed to maintain a constant contact area (or substantially fixed). The top end portion 822b of each of the tip wafers 822 can be surely brought into contact with the terminals 101.

又，偵測單元及電路基板檢測裝置，不限定於上述的構成。例如，雖然以上記述有關使用具有導電性及彈性的高分子材料之導電性塑膠形成的頂端晶片822的構成及方法，但也可以採用使用具有導電性及彈性的樹脂所形成的頂端晶片822之構成及方法。又，以具有彈性的高分子材料形成頂端晶片本體部分，此本體部分的表面上，以蒸鍍、濺鍍形成導電性塗膜(例如金屬塗膜)而構成頂端晶片，也可以採用使用上述頂端晶片的構成及方法。 Further, the detecting unit and the circuit board detecting device are not limited to the above configuration. For example, although the configuration and method of the tip wafer 822 formed using a conductive plastic having a conductive and elastic polymer material are described above, the configuration of the tip wafer 822 formed using a resin having conductivity and elasticity may be employed. And methods. Further, the top wafer main body portion is formed of a polymer material having elasticity, and a conductive coating film (for example, a metal coating film) is formed on the surface of the main body portion by vapor deposition or sputtering to form a tip wafer, and the top end may be used. The structure and method of the wafer.

又，雖然以上記述有關具有形成圓柱狀的頂端晶片822之範例，但頂端晶片822的形狀不限於此。具體而言，可以採用，如第31圖所示，剖面形成橢圓形的柱狀的頂端晶片832，或如第32圖所示，剖面形成四角形的柱狀的頂端 晶片842。又，也可以採用，如第33圖所示，形成四角錐狀的頂端晶片852，或如第34圖所示，形成圓錐形的頂端晶片862。又，也可以採用，如第35圖所示，形成球狀的頂端晶片872，或如第36圖所示，形成橢圓體狀的頂端晶片882。 Further, although an example in which the top end wafer 822 having a columnar shape is formed is described above, the shape of the tip end wafer 822 is not limited thereto. Specifically, as shown in FIG. 31, the elliptical columnar top end wafer 832 is formed in a cross section, or as shown in Fig. 32, the cross section is formed into a quadrangular columnar top end. Wafer 842. Further, as shown in Fig. 33, a quadrangular pyramid-shaped tip wafer 852 may be formed, or as shown in Fig. 34, a conical tip wafer 862 may be formed. Further, as shown in Fig. 35, a spherical top end wafer 872 may be formed, or as shown in Fig. 36, an ellipsoidal top end wafer 882 may be formed.

又，雖然以上記述導體部821a的周圍形成絕緣皮膜821b的被覆導線821用作導線的範例，採用的構成也可以是使用不形成絕緣皮膜821b的導線。 In addition, although the covered conductive wire 821 in which the insulating film 821b is formed around the conductor portion 821a is used as an example of a lead wire, a wire which does not form the insulating film 821b may be used.

1‧‧‧電路基板檢測裝置 1‧‧‧Circuit board inspection device

2、2a、2b、102、732、742、752、762、772‧‧‧偵測單元 2, 2a, 2b, 102, 732, 742, 752, 762, 772‧‧‧ detection unit

3、703、803‧‧‧移動機構 3, 703, 803 ‧ ‧ mobile agencies

4‧‧‧電路基板支持部 4‧‧‧Circuit board support

5、705、805‧‧‧檢測部 5, 705, 805 ‧ ‧ inspection department

6、706、806‧‧‧控制部 6, 706, 806‧ ‧ control department

11‧‧‧本體部 11‧‧‧ Body Department

12、12a、12b、112‧‧‧探針接腳 12, 12a, 12b, 112‧‧ ‧ probe pins

13、113‧‧‧電極板 13, 113‧‧‧electrode plates

13b‧‧‧纜線 13b‧‧‧ Cable

13a、101‧‧‧端子 13a, 101‧‧‧ terminals

20、120‧‧‧探針本體 20, 120‧‧ ‧ probe body

21、121、712a、721c、821c、822a、822b‧‧‧頂端部 21, 121, 712a, 721c, 821c, 822a, 822b‧‧‧ top

21a‧‧‧頂端部21的表面 21a‧‧‧ Surface of the tip portion 21

21b、721d、821d‧‧‧端面 21b, 721d, 821d‧‧‧ end faces

21c‧‧‧周面 21c‧‧‧Week

21d、21e‧‧‧小徑部 21d, 21e‧‧‧ small diameter department

22‧‧‧基端部 22‧‧‧ base end

23、123‧‧‧中央部 23, 123‧‧‧ Central Department

24‧‧‧第1絕緣層 24‧‧‧1st insulation layer

25‧‧‧第2絕緣層 25‧‧‧2nd insulation layer

31‧‧‧第1支持部 31‧‧‧1st Support Department

31a‧‧‧第1插通孔 31a‧‧‧1st through hole

32‧‧‧第2支持部 32‧‧‧2nd Support Department

32a‧‧‧第2插通孔 32a‧‧‧2nd through hole

33‧‧‧連結部 33‧‧‧Connecting Department

41、42‧‧‧支持板 41, 42‧‧‧ Support board

41a、42a‧‧‧插通孔 41a, 42a‧‧‧ inserted through hole

41c、41d、42c、42d‧‧‧***孔 41c, 41d, 42c, 42d‧‧‧ insertion holes

43‧‧‧固定接腳 43‧‧‧Fixed pins

D1‧‧‧第1插通孔31a的直徑 D1‧‧‧Diameter of the first insertion hole 31a

D2‧‧‧插通孔41a的直徑 D2‧‧‧Diameter of inserted through hole 41a

100‧‧‧電路基板 100‧‧‧ circuit board

124‧‧‧絕緣層 124‧‧‧Insulation

131‧‧‧第1支持部 131‧‧‧1st Support Department

131a‧‧‧第1插通孔 131a‧‧‧1st through hole

132‧‧‧第2支持部 132‧‧‧2nd Support Department

132a‧‧‧第2插通孔 132a‧‧‧2nd through hole

701‧‧‧電路基板檢測裝置 701‧‧‧Circuit board inspection device

701A‧‧‧中心軸 701A‧‧‧ central axis

702、802‧‧‧偵測單元 702, 802‧‧‧ detection unit

704‧‧‧電路基板支持部 704‧‧‧Circuit board support

711、811‧‧‧保持部 711, 811‧‧‧ Keeping Department

711a、811a‧‧‧下面 711a, 811a‧‧‧ below

711b、811b‧‧‧上面 711b, 811b‧‧‧ above

711c、811c‧‧‧插通孔 711c, 811c‧‧‧ inserted through hole

712、812‧‧‧探針 712, 812‧‧ probe

713‧‧‧彈性接合劑 713‧‧‧Flexible cement

721、821‧‧‧被覆導線 721, 821‧‧‧coated wires

721a、821a‧‧‧導體部 721a, 821a‧‧‧ conductor

721b、821b‧‧‧絕緣皮膜 721b, 821b‧‧‧ insulation film

801‧‧‧電路基板檢測裝置 801‧‧‧Circuit board inspection device

804‧‧‧電路基板支持部 804‧‧‧Circuit board support

813‧‧‧接合劑 813‧‧‧Adhesive

814‧‧‧導電性接合劑 814‧‧‧ Conductive bonding agent

822、832、842、852、862、872、882‧‧‧頂端晶片 822, 832, 842, 852, 862, 872, 882‧‧‧ top chip

A‧‧‧頂端區域 A‧‧‧ top area

D1‧‧‧第1插通孔31a的直徑 D1‧‧‧Diameter of the first insertion hole 31a

D2‧‧‧插通孔41a的直徑 D2‧‧‧Diameter of inserted through hole 41a

D3‧‧‧插通孔42a的直徑 D3‧‧‧Diameter of insertion hole 42a

D4‧‧‧頂端部21的直徑 D4‧‧‧Diameter of the tip end 21

D5‧‧‧中央部23的直徑 D5‧‧‧ Diameter of the central part 23

D701‧‧‧內徑 D701‧‧‧Inner diameter

D702、D802、D803‧‧‧外徑 D702, D802, D803‧‧‧ OD

[第1圖]係顯示電路基板檢測裝置1的構成之構成圖；[第2圖]係顯示偵測單元2的構成之構成圖；[第3圖]係偵測單元2的剖面圖；[第4圖]係探針接腳12的剖面圖；[第5圖]係說明偵測單元2的組裝方法之第1說明圖；[第6圖]係說明偵測單元2的組裝方法之第2說明圖；[第7圖]係偵測單元2a的剖面圖；[第8圖]係偵測單元2b的剖面圖；[第9圖]係顯示偵測單元102的構成之構成圖；[第10圖]係顯示電路基板檢測裝置701的構成之構成圖；[第11圖]係顯示偵測單元702的構成之構成圖；[第12圖]係偵測單元702的剖面圖；[第13圖]係從探針712的頂端部712a側所見的偵測 單元702之平面圖；[第14圖]係說明偵測單元702的製造方法之第1說明圖；[第15圖]係說明偵測單元702的製造方法之第2說明圖；[第16圖]係說明偵測單元702的製造方法之第3說明圖；[第17圖]係顯示偵測單元732的構成之剖面圖；[第18圖]係顯示偵測單元742的構成之剖面圖；[第19圖]係顯示偵測單元752的構成之剖面圖；[第20圖]係顯示偵測單元762的構成之剖面圖；[第21圖]係顯示偵測單元772的構成之剖面圖；[第22圖]係顯示電路基板檢測裝置801的構成之構成圖；[第23圖]係顯示偵測單元802的構成之構成圖；[第24圖]係偵測單元802的剖面圖；[第25圖]係從探針812的頂端晶片822側所見的偵測單元802之平面圖；[第26圖]係說明偵測單元802的製造方法之第1說明圖；[第27圖]係說明偵測單元802的製造方法之第2說明圖；[第28圖]係說明偵測單元802的製造方法之第3說明圖； [第29圖]係說明偵測單元802的製造方法之第4說明圖；[第30圖]係說明偵測單元802的製造方法之第5說明圖；[第31圖]係顯示頂端晶片832的構成之立體圖；[第32圖]係顯示頂端晶片842的構成之立體圖；[第33圖]係顯示頂端晶片852的構成之立體圖；[第34圖]係顯示頂端晶片862的構成之立體圖；[第35圖]係顯示頂端晶片872的構成之立體圖；[第36圖]係顯示頂端晶片882的構成之立體圖。 [Fig. 1] is a configuration diagram showing the configuration of the circuit board detecting device 1; [Fig. 2] is a configuration diagram showing the configuration of the detecting unit 2; [Fig. 3] is a sectional view of the detecting unit 2; 4] is a cross-sectional view of the probe pin 12; [Fig. 5] is a first explanatory diagram illustrating a method of assembling the detecting unit 2; [Fig. 6] is a description of the assembling method of the detecting unit 2. 2 explanatory diagram; [Fig. 7] is a sectional view of the detecting unit 2a; [Fig. 8] is a sectional view of the detecting unit 2b; [Fig. 9] is a structural diagram showing the configuration of the detecting unit 102; 10 is a configuration diagram showing a configuration of the circuit board detecting device 701; [FIG. 11] is a configuration diagram of a configuration of the detecting unit 702; [12] is a sectional view of the detecting unit 702; 13] is the detection seen from the side of the tip end portion 712a of the probe 712 A plan view of the unit 702; [Fig. 14] is a first explanatory diagram for explaining a method of manufacturing the detecting unit 702; [Fig. 15] is a second explanatory diagram for explaining a method of manufacturing the detecting unit 702; [Fig. 16] A third explanatory diagram of the manufacturing method of the detecting unit 702; [17] is a cross-sectional view showing the configuration of the detecting unit 732; [Fig. 18] is a sectional view showing the configuration of the detecting unit 742; Figure 19 is a cross-sectional view showing the configuration of the detecting unit 752; [Fig. 20] is a cross-sectional view showing the configuration of the detecting unit 762; [21] is a sectional view showing the configuration of the detecting unit 772; [Fig. 22] is a configuration diagram showing the configuration of the circuit board detecting device 801; [Fig. 23] is a configuration diagram showing the configuration of the detecting unit 802; [Fig. 24] is a sectional view of the detecting unit 802; Fig. 25 is a plan view of the detecting unit 802 seen from the tip wafer 822 side of the probe 812; [Fig. 26] is a first explanatory diagram illustrating a method of manufacturing the detecting unit 802; [Fig. 27] A second explanatory diagram of a method of manufacturing the detecting unit 802; [FIG. 28] is a third explanatory diagram illustrating a method of manufacturing the detecting unit 802; [Fig. 29] is a fourth explanatory diagram illustrating a method of manufacturing the detecting unit 802; [Fig. 30] is a fifth explanatory diagram illustrating a method of manufacturing the detecting unit 802; [31] shows a top end wafer 832. [Fig. 32] is a perspective view showing the configuration of the distal end wafer 842; [Fig. 33] is a perspective view showing the configuration of the distal end wafer 852; [Fig. 34] is a perspective view showing the configuration of the distal end wafer 862; [Fig. 35] is a perspective view showing the configuration of the distal end wafer 872; [Fig. 36] is a perspective view showing the configuration of the distal end wafer 882.

2‧‧‧偵測單元 2‧‧‧Detection unit

11‧‧‧本體部 11‧‧‧ Body Department

12‧‧‧探針接腳 12‧‧‧ probe pin

13‧‧‧電極板 13‧‧‧Electrode plate

13b‧‧‧纜線 13b‧‧‧ Cable

13a‧‧‧端子 13a‧‧‧terminal

20‧‧‧探針本體 20‧‧‧ probe body

21‧‧‧頂端部 21‧‧‧Top part

21b‧‧‧端面 21b‧‧‧ end face

22‧‧‧基端部 22‧‧‧ base end

23‧‧‧中央部 23‧‧‧ Central Department

24‧‧‧第1絕緣層 24‧‧‧1st insulation layer

25‧‧‧第2絕緣層 25‧‧‧2nd insulation layer

31‧‧‧第1支持部 31‧‧‧1st Support Department

31a‧‧‧第1插通孔 31a‧‧‧1st through hole

32‧‧‧第2支持部 32‧‧‧2nd Support Department

41、42‧‧‧支持板 41, 42‧‧‧ Support board

41a、42a‧‧‧插通孔 41a, 42a‧‧‧ inserted through hole

41c、41d、42c、42d‧‧‧***孔 41c, 41d, 42c, 42d‧‧‧ insertion holes

43‧‧‧固定接腳 43‧‧‧Fixed pins

100‧‧‧電路基板 100‧‧‧ circuit board

101‧‧‧端子 101‧‧‧ terminals

Claims (17)

一種偵測單元，包括：複數的探針；以及保持部，保持各探針；其中，上述保持部由具有插通孔的板狀體構成；以及上述探針係頂端部從上述保持部的一面突出，由插通至上述插通孔的線狀或棒狀之導電體所構成的同時，沿著上述插通孔的中心軸可移動且對其他的上述導電體絕緣的狀態下，經由充填上述插通孔的彈性材料，由上述保持部保持。 A detecting unit comprising: a plurality of probes; and a holding portion for holding each of the probes; wherein the holding portion is formed of a plate-like body having an insertion hole; and the tip end portion of the probe system is from one side of the holding portion And protruding, and being formed by a linear or rod-shaped conductor inserted through the insertion hole, while being movable along a central axis of the insertion hole and insulating the other conductors The elastic material of the insertion hole is held by the above holding portion. 如申請專利範圍第1項所述的偵測單元，其中，上述探針由被覆導線構成。 The detecting unit according to claim 1, wherein the probe is composed of a covered wire. 如申請專利範圍第1項所述的偵測單元，其中，一個上述插通孔內插通複數的上述探針。 The detecting unit according to claim 1, wherein the plurality of the probes are inserted into one of the insertion holes. 如申請專利範圍第2項所述的偵測單元，其中，一個上述插通孔內插通複數的上述探針。 The detecting unit according to claim 2, wherein the plurality of the probes are inserted into one of the insertion holes. 如申請專利範圍第3項所述的偵測單元，其中，上述複數的探針在扭轉的狀態下，插通至上述的一個插通孔。 The detecting unit according to claim 3, wherein the plurality of probes are inserted into the one of the insertion holes in a twisted state. 如申請專利範圍第4項所述的偵測單元，其中，上述複數的探針在扭轉的狀態下，插通至上述的一個插通孔。 The detecting unit according to claim 4, wherein the plurality of probes are inserted into the one insertion hole in a twisted state. 一種電路基板檢測裝置，包括：偵測單元，如申請專利範圍第1至6項中任一項所述者；以及檢測部，經由接觸偵測對象體的電路基板之上述偵測 單元的上述探針，根據輸出入的電氣信號，實行對上述電路基板的電氣檢測。 A circuit board detecting device, comprising: a detecting unit, as described in any one of claims 1 to 6; and a detecting unit that detects the circuit substrate of the object by contact The probe of the unit performs electrical detection on the circuit board based on the input electrical signal. 一種偵測單元製造方法，製造包括複數的探針、以及保持上述各探針的保持部之偵測單元，包括下列步驟：在板狀體中形成插通孔，製作上述保持部；功能為上述探針的線狀或棒狀之導電體的頂端部從上述保持部的一面突出，插通上述導電體至上述插通孔；在前述保持部的其他面的前述插通孔的緣部，塗佈彈性接合劑；從前述保持部的前述一面側進行吸引，將塗佈於前述其他面的前述彈性接合劑拉入前述插通孔的內周面和前述導電體之間的隙間，以充填該隙間；使前述彈性接合劑固化作為彈性材料；以及沿著上述插通孔的中心軸可移動且對其他上述導電體絕緣的狀態下，經由前述彈性材料，使上述保持部保持上述導電體，製造前述偵測單元。 A detecting unit manufacturing method, comprising: a plurality of probes, and a detecting unit for holding the holding portions of the probes, comprising the steps of: forming an insertion hole in the plate body to form the holding portion; a distal end portion of the linear or rod-shaped conductor of the probe protrudes from one surface of the holding portion, and the conductive body is inserted into the insertion hole; and the edge of the insertion hole is coated on the other surface of the holding portion a cloth elastic bonding agent; suctioning from the one surface side of the holding portion, and pulling the elastic bonding agent applied to the other surface into a gap between the inner circumferential surface of the insertion hole and the conductor to fill the gap Interlocking; curing the elastic bonding agent as an elastic material; and moving the conductive body to the holding portion via the elastic material while being movable along a central axis of the insertion hole and insulating the other electrical conductor The aforementioned detecting unit. 一種偵測單元，包括：複數的探針；以及保持部，用以保持上述各探針；其中，上述保持部由具有插通孔的板狀體構成；上述探針的構成，包括：導線，頂端部在插通至上述插通孔的絕緣狀態下，固定至上述保持部；以及頂端構件，形成柱狀、錐體狀、球狀及橢圓體狀中的任一形狀的同時，基端部電氣連接上述頂端部的端面的狀 態下，從上述保持部的一面突出，具有固定至上述導線的導電性及彈性。 A detecting unit comprising: a plurality of probes; and a holding portion for holding the probes; wherein the holding portion is formed by a plate-like body having an insertion hole; and the probe comprises: a wire, The distal end portion is fixed to the holding portion in an insulated state inserted into the insertion hole; and the distal end member is formed into any one of a columnar shape, a pyramidal shape, a spherical shape, and an ellipsoidal shape, and the base end portion Electrically connecting the end faces of the above-mentioned top end portions In the state, it protrudes from one surface of the holding portion and has electrical conductivity and elasticity fixed to the lead wire. 如申請專利範圍第9項所述的偵測單元，其中，上述導線係上述端面與上述一面成為同一平面的狀態下固定至上述保持部。 The detecting unit according to claim 9, wherein the lead wire is fixed to the holding portion in a state in which the end surface and the one surface are flush with each other. 如申請專利範圍第9項所述的偵測單元，其中，上述頂端構件係以具有導電性及彈性的高分子材料形成。 The detecting unit according to claim 9, wherein the tip member is formed of a polymer material having conductivity and elasticity. 如申請專利範圍第10項所述的偵測單元，其中，上述頂端構件係以具有導電性及彈性的高分子材料形成。 The detecting unit according to claim 10, wherein the tip member is formed of a polymer material having conductivity and elasticity. 如申請專利範圍第9項所述的偵測單元，其中，上述頂端構件形成柱狀。 The detecting unit according to claim 9, wherein the tip member is formed in a columnar shape. 如申請專利範圍第10項所述的偵測單元，其中，上述頂端構件形成柱狀。 The detecting unit according to claim 10, wherein the tip member is formed in a columnar shape. 如申請專利範圍第11項所述的偵測單元，其中，上述頂端構件形成柱狀。 The detecting unit according to claim 11, wherein the tip member is formed in a columnar shape. 如申請專利範圍第12項所述的偵測單元，其中，上述頂端構件形成柱狀。 The detecting unit according to claim 12, wherein the tip member is formed in a columnar shape. 一種電路基板檢測裝置，包括：偵測單元，如申請專利範圍第9至16項中任一項所述者；以及檢測部，經由接觸偵測對象體的電路基板之上述偵測單元的上述探針，根據輸出入的電氣信號，實行對上述電路基板的電氣檢測。 A circuit board detecting device, comprising: a detecting unit, as described in any one of claims 9 to 16, and a detecting unit, wherein the detecting unit detects the detecting unit of the circuit substrate by detecting the object body The needle performs electrical detection on the circuit board based on the electrical signal input and output.
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