TW200641086A - Adhesive sheet for dicing and dicing method using the same - Google Patents

Adhesive sheet for dicing and dicing method using the same

Info

Publication number
TW200641086A
TW200641086A TW095113605A TW95113605A TW200641086A TW 200641086 A TW200641086 A TW 200641086A TW 095113605 A TW095113605 A TW 095113605A TW 95113605 A TW95113605 A TW 95113605A TW 200641086 A TW200641086 A TW 200641086A
Authority
TW
Taiwan
Prior art keywords
dicing
adhesive sheet
same
substrate
thickness
Prior art date
Application number
TW095113605A
Other languages
Chinese (zh)
Other versions
TWI402325B (en
Inventor
Syouji Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200641086A publication Critical patent/TW200641086A/en
Application granted granted Critical
Publication of TWI402325B publication Critical patent/TWI402325B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

An adhesive sheet for dicing and a dicing method using the same are provided. The adhesive sheet for dicing in the present invention is that an adhesive layer is disposed on at least one surface of a substrate. The characteristic of the present invention is that the substrate is a complex layer structure containing a vinyl resin having a melting point which is equal to or smaller than 95DEG C; meanwhile, the thickness of the layer is equal to or larger than half of the thickness of the substrate.
TW095113605A 2005-05-12 2006-04-17 Adhesive sheet for dicing and dicing method using the same TWI402325B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005139247 2005-05-12

Publications (2)

Publication Number Publication Date
TW200641086A true TW200641086A (en) 2006-12-01
TWI402325B TWI402325B (en) 2013-07-21

Family

ID=37424525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113605A TWI402325B (en) 2005-05-12 2006-04-17 Adhesive sheet for dicing and dicing method using the same

Country Status (3)

Country Link
KR (1) KR101280648B1 (en)
CN (1) CN1865375B (en)
TW (1) TWI402325B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11047900B2 (en) 2016-10-27 2021-06-29 Mitsui Chemicals Tohcello, Inc. Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus
TWI743239B (en) * 2016-10-27 2021-10-21 日商三井化學東賽璐股份有限公司 Method for manufacturing electric device, adhesive film for manufacturing electric device, and test equipment for electronic component

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4717051B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
JP5318435B2 (en) * 2008-02-29 2013-10-16 日東電工株式会社 Adhesive sheet for semiconductor wafer back grinding and semiconductor wafer back grinding method using this back grinding adhesive sheet
CN102598339A (en) * 2009-10-29 2012-07-18 住友化学株式会社 Method for manufacturing organic thin-film solar battery module
US9315692B2 (en) * 2010-03-31 2016-04-19 Lintec Corporation Base material film for dicing sheet and dicing sheet
WO2014136181A1 (en) * 2013-03-04 2014-09-12 リンテック株式会社 Dicing sheet substrate film, and dicing sheet provided with said substrate film
KR102526158B1 (en) * 2017-08-09 2023-04-26 린텍 가부시키가이샤 Heating and peeling method of processing inspection object

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264940C (en) * 2001-08-10 2006-07-19 日东电工株式会社 Dicing adhesive sheet and dicing method
JP4286043B2 (en) * 2003-03-31 2009-06-24 ロンシール工業株式会社 Wafer dicing adhesive tape

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11047900B2 (en) 2016-10-27 2021-06-29 Mitsui Chemicals Tohcello, Inc. Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus
TWI743239B (en) * 2016-10-27 2021-10-21 日商三井化學東賽璐股份有限公司 Method for manufacturing electric device, adhesive film for manufacturing electric device, and test equipment for electronic component
TWI745464B (en) * 2016-10-27 2021-11-11 日商三井化學東賽璐股份有限公司 Method for manufacturing electric device, adhesive film for manufacturing electric device, and test equipment for electronic component
US11747388B2 (en) 2016-10-27 2023-09-05 Mitsui Chemicals Tohcello, Inc. Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus

Also Published As

Publication number Publication date
CN1865375A (en) 2006-11-22
TWI402325B (en) 2013-07-21
CN1865375B (en) 2012-05-30
KR20060117221A (en) 2006-11-16
KR101280648B1 (en) 2013-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees