SG11201801665TA - Phosphorus-containing copper powder and method for producing the same - Google Patents
Phosphorus-containing copper powder and method for producing the sameInfo
- Publication number
- SG11201801665TA SG11201801665TA SG11201801665TA SG11201801665TA SG11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA
- Authority
- SG
- Singapore
- Prior art keywords
- phosphorus
- producing
- same
- copper powder
- containing copper
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
- B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29147—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29186—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2224/29187—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173730 | 2015-09-03 | ||
PCT/JP2016/074076 WO2017038478A1 (en) | 2015-09-03 | 2016-08-18 | Phosphorus-containing copper powder and method for producing same |
JP2016160289A JP6807681B2 (en) | 2015-09-03 | 2016-08-18 | Phosphorus-containing copper powder and its manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201801665TA true SG11201801665TA (en) | 2018-03-28 |
Family
ID=58278906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201801665TA SG11201801665TA (en) | 2015-09-03 | 2016-08-18 | Phosphorus-containing copper powder and method for producing the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US10773311B2 (en) |
EP (1) | EP3345696B1 (en) |
JP (1) | JP6807681B2 (en) |
KR (1) | KR102404788B1 (en) |
CN (1) | CN107921532B (en) |
SG (1) | SG11201801665TA (en) |
TW (1) | TWI689604B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6807681B2 (en) * | 2015-09-03 | 2021-01-06 | Dowaエレクトロニクス株式会社 | Phosphorus-containing copper powder and its manufacturing method |
CN110740827B (en) * | 2017-06-21 | 2022-03-01 | 福田金属箔粉工业株式会社 | Copper powder for laminate molding and laminate molding |
JP2019031735A (en) * | 2017-08-07 | 2019-02-28 | Dowaエレクトロニクス株式会社 | Surface treatment silver-coated alloy powder, production method of powder, conductive paste, electronic component and electric device |
CN110052617A (en) * | 2018-01-17 | 2019-07-26 | 昆山磁通新材料科技有限公司 | A kind of manufacturing method of low oxygen content water atomization metal powder |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0699731B2 (en) * | 1986-10-14 | 1994-12-07 | 株式会社クボタ | Molding method of Al, Mg-based metal rapidly solidified powder |
JPH05195024A (en) | 1992-01-14 | 1993-08-03 | Nippon Steel Corp | Method for preventing oxidation of metal powder during production of metal powder |
JP2920343B2 (en) * | 1993-10-25 | 1999-07-19 | 松下電器産業株式会社 | Hydrogen storage alloy powder, nickel-metal hydride battery having the hydrogen storage alloy powder as negative electrode active material, and method for producing hydrogen storage alloy powder |
US5605585A (en) * | 1993-07-15 | 1997-02-25 | Matsushita Electric Industrial Co., Ltd. | Method for producing hydrogen storage alloy particles and sealed-type nickel-metal hydride storage battery using the same |
JP3984534B2 (en) * | 2002-11-19 | 2007-10-03 | 三井金属鉱業株式会社 | Copper powder for conductive paste and method for producing the same |
US20050106435A1 (en) * | 2003-11-13 | 2005-05-19 | Jang Bor Z. | Twin-wire arc deposited electrode, solid electrolyte membrane, membrane electrode assembly and fuel cell |
JP4158713B2 (en) | 2004-02-03 | 2008-10-01 | 住友金属鉱山株式会社 | Copper paste composition for external electrodes |
JP4888769B2 (en) * | 2006-10-16 | 2012-02-29 | 新東工業株式会社 | Copper powder and method for producing the same |
US20100192728A1 (en) * | 2007-06-28 | 2010-08-05 | Nippon Mining & Metals Co., Ltd. | Spherical Copper Fine Powder and Process for Producing the Same |
JP5392884B2 (en) * | 2007-09-21 | 2014-01-22 | 三井金属鉱業株式会社 | Method for producing copper powder |
JP2011006740A (en) * | 2009-06-25 | 2011-01-13 | Mitsui Mining & Smelting Co Ltd | Copper powder for conductive paste, and conductive paste |
WO2011145378A1 (en) * | 2010-05-19 | 2011-11-24 | 三井金属鉱業株式会社 | Copper powder for conductive paste, and conductive paste |
JP5785433B2 (en) * | 2011-04-28 | 2015-09-30 | 三井金属鉱業株式会社 | Low carbon copper particles |
JP6028727B2 (en) | 2011-05-18 | 2016-11-16 | 戸田工業株式会社 | Copper powder, copper paste, method for producing conductive coating film and conductive coating film |
CN102398040A (en) * | 2011-12-07 | 2012-04-04 | 昆山德泰新材料科技有限公司 | Atomization production method for ultralow-apparent-density copper powder |
JP2014077101A (en) | 2012-10-12 | 2014-05-01 | Hitachi Chemical Co Ltd | Adhesive composition using phosphorus-containing copper alloy particles and semiconductor device using the same |
JP6807681B2 (en) * | 2015-09-03 | 2021-01-06 | Dowaエレクトロニクス株式会社 | Phosphorus-containing copper powder and its manufacturing method |
-
2016
- 2016-08-18 JP JP2016160289A patent/JP6807681B2/en active Active
- 2016-08-18 US US15/757,427 patent/US10773311B2/en active Active
- 2016-08-18 SG SG11201801665TA patent/SG11201801665TA/en unknown
- 2016-08-18 KR KR1020187009322A patent/KR102404788B1/en active IP Right Grant
- 2016-08-18 CN CN201680050994.5A patent/CN107921532B/en active Active
- 2016-08-18 EP EP16841510.7A patent/EP3345696B1/en active Active
- 2016-08-25 TW TW105127249A patent/TWI689604B/en active
Also Published As
Publication number | Publication date |
---|---|
EP3345696B1 (en) | 2023-06-07 |
KR20180048980A (en) | 2018-05-10 |
JP6807681B2 (en) | 2021-01-06 |
CN107921532A (en) | 2018-04-17 |
TWI689604B (en) | 2020-04-01 |
EP3345696C0 (en) | 2023-06-07 |
EP3345696A4 (en) | 2019-03-20 |
CN107921532B (en) | 2020-05-08 |
TW201715048A (en) | 2017-05-01 |
JP2017048461A (en) | 2017-03-09 |
EP3345696A1 (en) | 2018-07-11 |
US10773311B2 (en) | 2020-09-15 |
US20180243831A1 (en) | 2018-08-30 |
KR102404788B1 (en) | 2022-06-02 |
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