SG11201707933RA - Dicing sheet, method for producing dicing sheet, and method for producing mold chips - Google Patents
Dicing sheet, method for producing dicing sheet, and method for producing mold chipsInfo
- Publication number
- SG11201707933RA SG11201707933RA SG11201707933RA SG11201707933RA SG11201707933RA SG 11201707933R A SG11201707933R A SG 11201707933RA SG 11201707933R A SG11201707933R A SG 11201707933RA SG 11201707933R A SG11201707933R A SG 11201707933RA SG 11201707933R A SG11201707933R A SG 11201707933RA
- Authority
- SG
- Singapore
- Prior art keywords
- producing
- dicing sheet
- mold chips
- chips
- sheet
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015065363 | 2015-03-26 | ||
PCT/JP2015/079514 WO2016151912A1 (en) | 2015-03-26 | 2015-10-20 | Dicing sheet, method for producing dicing sheet, and method for producing molded chip |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201707933RA true SG11201707933RA (en) | 2017-10-30 |
Family
ID=56978464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201707933RA SG11201707933RA (en) | 2015-03-26 | 2015-10-20 | Dicing sheet, method for producing dicing sheet, and method for producing mold chips |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6561114B2 (en) |
KR (1) | KR102429606B1 (en) |
CN (1) | CN107408500B (en) |
SG (1) | SG11201707933RA (en) |
TW (1) | TWI702269B (en) |
WO (1) | WO2016151912A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7079609B2 (en) * | 2018-01-19 | 2022-06-02 | 日東電工株式会社 | Masking tape for forming electromagnetic wave shield |
JP2021118330A (en) * | 2020-01-29 | 2021-08-10 | 日東電工株式会社 | Masking material |
CN116987468B (en) * | 2023-09-26 | 2023-12-22 | 北京序轮科技有限公司 | Migration-free rapid UV viscosity-reducing polymer composition and preparation method thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203822A (en) * | 2000-12-28 | 2002-07-19 | Lintec Corp | Method for processing brittle member and both-side adhesive sheet |
JP2005229040A (en) | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive sheet for fixing semiconductor base |
JP2009246302A (en) * | 2008-03-31 | 2009-10-22 | Lintec Corp | Die sorting tape |
JP2012180494A (en) * | 2011-02-10 | 2012-09-20 | Nitto Denko Corp | Spontaneously rolling adhesive sheet, and method of manufacturing cut piece |
JP5975621B2 (en) * | 2011-11-02 | 2016-08-23 | リンテック株式会社 | Dicing sheet and semiconductor chip manufacturing method |
JP6081094B2 (en) * | 2012-07-13 | 2017-02-15 | リンテック株式会社 | Dicing sheet |
JP6609473B2 (en) * | 2013-03-11 | 2019-11-20 | リンテック株式会社 | Adhesive sheet and method for producing processed device-related member |
-
2015
- 2015-10-20 KR KR1020177008502A patent/KR102429606B1/en active IP Right Grant
- 2015-10-20 JP JP2017507317A patent/JP6561114B2/en active Active
- 2015-10-20 SG SG11201707933RA patent/SG11201707933RA/en unknown
- 2015-10-20 WO PCT/JP2015/079514 patent/WO2016151912A1/en active Application Filing
- 2015-10-20 CN CN201580060101.0A patent/CN107408500B/en active Active
-
2016
- 2016-03-23 TW TW105108932A patent/TWI702269B/en active
Also Published As
Publication number | Publication date |
---|---|
CN107408500A (en) | 2017-11-28 |
JPWO2016151912A1 (en) | 2018-01-18 |
CN107408500B (en) | 2020-08-14 |
JP6561114B2 (en) | 2019-08-14 |
TWI702269B (en) | 2020-08-21 |
KR20170130345A (en) | 2017-11-28 |
KR102429606B1 (en) | 2022-08-04 |
TW201704392A (en) | 2017-02-01 |
WO2016151912A1 (en) | 2016-09-29 |
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