SG11201702264TA - Turn table transport carriage - Google Patents
Turn table transport carriageInfo
- Publication number
- SG11201702264TA SG11201702264TA SG11201702264TA SG11201702264TA SG11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA
- Authority
- SG
- Singapore
- Prior art keywords
- transport carriage
- turn table
- table transport
- turn
- carriage
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/06—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
- F16M11/10—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/42—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B3/00—Folding or stowable tables
- A47B3/10—Travelling or trunk tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Handcart (AREA)
- Braking Arrangements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014215583A JP6178774B2 (en) | 2014-10-22 | 2014-10-22 | Surface plate carriage |
PCT/JP2015/005024 WO2016063464A1 (en) | 2014-10-22 | 2015-10-02 | Surface plate transport dolly |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201702264TA true SG11201702264TA (en) | 2017-05-30 |
Family
ID=55760525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201702264TA SG11201702264TA (en) | 2014-10-22 | 2015-10-02 | Turn table transport carriage |
Country Status (8)
Country | Link |
---|---|
US (1) | US10737365B2 (en) |
JP (1) | JP6178774B2 (en) |
KR (1) | KR102441700B1 (en) |
CN (1) | CN107073682B (en) |
DE (1) | DE112015004421T5 (en) |
SG (1) | SG11201702264TA (en) |
TW (1) | TWI611868B (en) |
WO (1) | WO2016063464A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI600601B (en) * | 2016-11-23 | 2017-10-01 | 住華科技股份有限公司 | Tiltable collecting device |
TWI628132B (en) * | 2016-11-23 | 2018-07-01 | 住華科技股份有限公司 | Tiltable collecting device |
CN112318251A (en) * | 2020-10-15 | 2021-02-05 | 温州源利智能科技有限公司 | Automatic polishing mechanism and polishing method for neodymium iron boron magnetic part |
CN112224935B (en) * | 2020-12-10 | 2021-03-09 | 万邑通(潍坊)信息科技有限公司 | Portable auxiliary unloading equipment for logistics |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3813825A (en) * | 1969-09-30 | 1974-06-04 | Alliance Tool And Die Corp | Polishing machine or the like with a removable platen |
US4268201A (en) * | 1979-05-07 | 1981-05-19 | Bud Antle, Inc. | Unitizing system for produce cartons and the like |
US4558648A (en) * | 1983-09-20 | 1985-12-17 | Lift-R Technologies, Inc. | Energy-recycling scissors lift |
JP3620629B2 (en) * | 1998-02-20 | 2005-02-16 | 新東工業株式会社 | Casting frame and surface plate carriage transfer equipment |
JP2000061832A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Load cassette tilting mechanism for polishing device |
JP2000141205A (en) * | 1998-11-10 | 2000-05-23 | Tokyo Seimitsu Co Ltd | Wafer polishing device and polishing surface plate adjusting device |
KR100591269B1 (en) * | 2004-12-09 | 2006-06-26 | 주식회사 금화피에스씨 | Valve disc lapping device |
US7255355B2 (en) * | 2005-01-03 | 2007-08-14 | Mk Diamond Products, Inc. | Portable collapsible stand |
CN2795133Y (en) | 2005-04-26 | 2006-07-12 | 江苏天奇物流***工程股份有限公司 | Pneumatic hydraulic lifting trolley |
JP2008093811A (en) | 2006-10-16 | 2008-04-24 | Shin Etsu Handotai Co Ltd | Polishing head and polishing device |
AR060518A1 (en) * | 2007-04-18 | 2008-06-25 | Hugo Enrique Chianale | A PORTABLE CART-TABLE SET |
JP5142077B2 (en) * | 2008-02-05 | 2013-02-13 | 株式会社日立プラントテクノロジー | Transport cart |
JP5058853B2 (en) | 2008-03-10 | 2012-10-24 | 旭硝子株式会社 | Wing-type container for transporting plate-like cargo and trailer for loading it |
JP5348610B2 (en) * | 2009-01-26 | 2013-11-20 | 旭硝子株式会社 | Plate body loading device |
TWI366638B (en) * | 2009-02-20 | 2012-06-21 | Rexon Ind Corp Ltd | Mobile tool stand |
JP2011126546A (en) | 2009-12-15 | 2011-06-30 | Shin-Etsu Chemical Co Ltd | Case for conveying glass substrate and cart for conveying glass substrate |
JP2012096893A (en) * | 2010-11-02 | 2012-05-24 | Toppan Printing Co Ltd | Substrate carriage |
US8910970B2 (en) * | 2011-06-10 | 2014-12-16 | Rexon Industrial Corp., Ltd. | Rapidly collapsible stand |
US9022713B2 (en) * | 2011-09-28 | 2015-05-05 | Mil-Stak Inc. | Rotatable and tiltable receiving table for a mid-size or big bale stack wagon |
CN102745458B (en) | 2012-02-10 | 2014-12-17 | 湖南吉利汽车部件有限公司 | Battery loading vehicle |
JP6255303B2 (en) * | 2014-05-14 | 2017-12-27 | 株式会社荏原製作所 | Polishing table changer and polishing table removal method |
-
2014
- 2014-10-22 JP JP2014215583A patent/JP6178774B2/en active Active
-
2015
- 2015-10-02 SG SG11201702264TA patent/SG11201702264TA/en unknown
- 2015-10-02 KR KR1020177010065A patent/KR102441700B1/en active IP Right Grant
- 2015-10-02 US US15/513,477 patent/US10737365B2/en active Active
- 2015-10-02 DE DE112015004421.3T patent/DE112015004421T5/en active Pending
- 2015-10-02 CN CN201580057427.8A patent/CN107073682B/en active Active
- 2015-10-02 WO PCT/JP2015/005024 patent/WO2016063464A1/en active Application Filing
- 2015-10-20 TW TW104134406A patent/TWI611868B/en active
Also Published As
Publication number | Publication date |
---|---|
CN107073682B (en) | 2020-03-10 |
WO2016063464A1 (en) | 2016-04-28 |
US20170304991A1 (en) | 2017-10-26 |
US10737365B2 (en) | 2020-08-11 |
JP2016078220A (en) | 2016-05-16 |
CN107073682A (en) | 2017-08-18 |
KR102441700B1 (en) | 2022-09-08 |
JP6178774B2 (en) | 2017-08-09 |
DE112015004421T5 (en) | 2017-08-10 |
KR20170072200A (en) | 2017-06-26 |
TWI611868B (en) | 2018-01-21 |
TW201636155A (en) | 2016-10-16 |
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