Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41F—PRINTING MACHINES OR PRESSES
  • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
  • B41F19/02—Apparatus or machines for carrying out printing operations combined with other operations with embossing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B30—PRESSES
  • B30B—PRESSES IN GENERAL
  • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
  • B30B15/06—Platens or press rams
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B44—DECORATIVE ARTS
  • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
  • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
  • B44B5/0052—Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B44—DECORATIVE ARTS
  • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
  • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
  • B44B5/02—Dies; Accessories
  • B44B5/026—Dies
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B44—DECORATIVE ARTS
  • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
  • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
  • B44C1/24—Pressing or stamping ornamental designs on surfaces
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
  • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
  • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Shaping Of Tube Ends By Bending Or Straightening (AREA)
• Chemical & Material Sciences (AREA)
• Crystallography & Structural Chemistry (AREA)
• Nanotechnology (AREA)
• Ceramic Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=50588682

Family Applications (1)

Country Status (8)

Families Citing this family (4)

Family Cites Families (41)

• 2014
  • 2014-04-22 JP JP2016563848A patent/JP6391709B2/ja active Active
  • 2014-04-22 US US15/113,111 patent/US10118381B2/en active Active
  • 2014-04-22 WO PCT/EP2014/058141 patent/WO2015161868A1/de active Application Filing
  • 2014-04-22 CN CN202011231500.8A patent/CN112445066A/zh active Pending
  • 2014-04-22 KR KR1020227014424A patent/KR102545684B1/ko active IP Right Grant
  • 2014-04-22 CN CN202011231477.2A patent/CN112445065A/zh active Pending
  • 2014-04-22 CN CN201480078179.0A patent/CN106462053B/zh active Active
  • 2014-04-22 EP EP19186550.0A patent/EP3591470A1/de active Pending
  • 2014-04-22 KR KR1020167029271A patent/KR102249004B1/ko active IP Right Grant
  • 2014-04-22 EP EP14719720.6A patent/EP3134771B1/de active Active
  • 2014-04-22 CN CN202011230126.XA patent/CN112445064A/zh active Pending
  • 2014-04-22 KR KR1020217012962A patent/KR102394754B1/ko active IP Right Grant
  • 2014-04-22 SG SG11201608362TA patent/SG11201608362TA/en unknown
• 2015
  • 2015-03-24 TW TW108104053A patent/TWI694967B/zh active
  • 2015-03-24 TW TW104109441A patent/TWI654134B/zh active
  • 2015-03-24 TW TW109114811A patent/TWI772789B/zh active
  • 2015-03-24 TW TW111123484A patent/TWI824579B/zh active
• 2018
  • 2018-09-25 US US16/141,059 patent/US10493747B2/en active Active
• 2019
  • 2019-10-16 US US16/654,098 patent/US10906293B2/en active Active
• 2020
  • 2020-12-17 US US17/124,931 patent/US20210129520A1/en not_active Abandoned

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