HK1244067B - 壓花漆及壓花方法 - Google Patents
壓花漆及壓花方法Info
- Publication number
- HK1244067B HK1244067B HK18103665.8A HK18103665A HK1244067B HK 1244067 B HK1244067 B HK 1244067B HK 18103665 A HK18103665 A HK 18103665A HK 1244067 B HK1244067 B HK 1244067B
- Authority
- HK
- Hong Kong
- Prior art keywords
- embossing
- lacquer
- embossing lacquer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/03—Viewing layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/03—Viewing layer characterised by chemical composition
- C09K2323/033—Silicon compound, e.g. glass or organosilicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/03—Viewing layer characterised by chemical composition
- C09K2323/035—Ester polymer, e.g. polycarbonate, polyacrylate or polyester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA887/2014A AT516558B1 (de) | 2014-12-10 | 2014-12-10 | Prägelack, Verfahren zum Prägen sowie mit dem Prägelack beschichtete Substratoberfläche |
PCT/AT2015/000156 WO2016090394A1 (de) | 2014-12-10 | 2015-12-09 | Prägelack sowie verfahren zum prägen und mit dem prägelack beschichtete substratoberfläche |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1244067B true HK1244067B (zh) | 2020-02-28 |
Family
ID=55066253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18103665.8A HK1244067B (zh) | 2014-12-10 | 2018-03-16 | 壓花漆及壓花方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US10809622B2 (zh) |
EP (1) | EP3230795B1 (zh) |
JP (1) | JP6967969B2 (zh) |
KR (1) | KR102423751B1 (zh) |
CN (1) | CN107209454B (zh) |
AT (1) | AT516558B1 (zh) |
DK (1) | DK3230795T3 (zh) |
ES (1) | ES2744336T3 (zh) |
HK (1) | HK1244067B (zh) |
WO (1) | WO2016090394A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI799550B (zh) * | 2018-03-27 | 2023-04-21 | 日商富士軟片股份有限公司 | 壓印用硬化性組成物、脫模劑、硬化物、圖案形成方法和微影方法 |
EP3547026B1 (en) * | 2018-03-28 | 2023-11-29 | CSEM Centre Suisse d'Electronique et de Microtechnique SA | Method for producing a metal stamp for embossing a nano- and/or microstructure on a metal device as well as uses thereof and devices made therewith |
WO2020010564A1 (en) * | 2018-07-12 | 2020-01-16 | Dow Global Technologies Llc | Aqueous polymer dispersion and process of making same |
AT521567A2 (de) * | 2018-07-20 | 2020-02-15 | Hueck Folien Gmbh | Sicherheitselement mit Manipulationsnachweis |
DE102018005872A1 (de) * | 2018-07-25 | 2020-01-30 | Giesecke+Devrient Currency Technology Gmbh | Verwendung einer durch Strahlung härtbaren Lackzusammensetzung, Verfahren zur Herstellung von mikrooptischen Strukturen, mikrooptische Struktur und Datenträger |
DE102019107090A1 (de) * | 2019-03-20 | 2020-09-24 | Joanneum Research Forschungsgesellschaft Mbh | Mikrostruktur mit thermoplastischer Prägelackschicht und Herstellungsverfahren |
EP3839625A1 (fr) | 2019-12-18 | 2021-06-23 | Nivarox-FAR S.A. | Procede de fabrication d'un composant horloger et composant obtenu selon ce procede |
CN113156765B (zh) * | 2020-01-07 | 2022-09-27 | 北京化工大学 | 一种紫外纳米压印用光刻胶组合物及其制备与应用 |
AT523393B1 (de) * | 2020-04-06 | 2021-08-15 | Hueck Folien Gmbh | Verfahren zur Herstellung eines Sicherheitselements mit einer farbigen Mikrostruktur |
CN111847989A (zh) * | 2020-07-16 | 2020-10-30 | 广东福莱特建筑材料有限公司 | 一种多复合改性疏水真石漆及其制备方法 |
DE102021001588A1 (de) * | 2021-03-25 | 2022-09-29 | Giesecke+Devrient Currency Technology Gmbh | Herstellungsverfahren für ein optisch variables Sicherheitselement |
DE102021001589A1 (de) * | 2021-03-25 | 2022-09-29 | Giesecke+Devrient Currency Technology Gmbh | Herstellungsverfahren für ein optisch variables Sicherheitselement |
DE102021001582A1 (de) | 2021-03-25 | 2022-09-29 | Giesecke+Devrient Currency Technology Gmbh | Optisch variables Sicherheitselement, Herstellungsverfahren und Prägeanordnung |
DE102021004984A1 (de) | 2021-10-05 | 2023-04-06 | Giesecke+Devrient Currency Technology Gmbh | Pigment und Herstellung desselben |
DE102022002099A1 (de) | 2022-06-10 | 2023-12-21 | Giesecke+Devrient Currency Technology Gmbh | Verfahren zur Herstellung optisch variabler Elemente sowie optisch variable Elemente zur Herstellung einer Druckfarbe und/oder eines Sicherheitsmerkmals |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2834768A1 (de) | 1977-08-23 | 1979-03-08 | Grace W R & Co | Verfahren zur herstellung einer druckplatte und sie enthaltende haertbare polymerzusammensetzung |
CA1172112A (en) * | 1980-12-12 | 1984-08-07 | Richard P. Plunkett | Process for making conductive coatings |
JP4414188B2 (ja) * | 2003-09-30 | 2010-02-10 | 大日本印刷株式会社 | ハードコート層の滑り性を改善した積層体 |
US8076386B2 (en) * | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
US20060216524A1 (en) * | 2005-03-23 | 2006-09-28 | 3M Innovative Properties Company | Perfluoropolyether urethane additives having (meth)acryl groups and hard coats |
US7939176B2 (en) * | 2005-12-23 | 2011-05-10 | Xerox Corporation | Coated substrates and method of coating |
KR101463849B1 (ko) * | 2006-09-27 | 2014-12-04 | 후지필름 가부시키가이샤 | 광 나노임프린트 리소그래피용 경화성 조성물 및 그것을사용한 패턴 형성 방법 |
US20080176049A1 (en) | 2007-01-24 | 2008-07-24 | Samsung Electronics Co., Ltd. | PHOTO-CURABLE COMPOSITION HAVING INHERENTLY EXCELLENT RELEASING PROPERtY AND PATTERN TRANSFER PROPERTY, METHOD FOR TRANSFERRING PATTERN USING THE COMPOSITION AND LIGHT RECORDING MEDIUM HAVING POLYMER PATTERN LAYER PRODUCED USING THE COMPOSITION |
DE102007007914A1 (de) * | 2007-02-14 | 2008-08-21 | Giesecke & Devrient Gmbh | Prägelack für mikrooptische Sicherheitselemente |
JP5243887B2 (ja) * | 2008-02-12 | 2013-07-24 | 富士フイルム株式会社 | ナノインプリント用硬化性組成物およびパターン形成方法 |
WO2009148138A1 (ja) * | 2008-06-05 | 2009-12-10 | 旭硝子株式会社 | ナノインプリント用モールド、その製造方法および表面に微細凹凸構造を有する樹脂成形体ならびにワイヤグリッド型偏光子の製造方法 |
DE102008027952A1 (de) * | 2008-06-12 | 2009-12-17 | Giesecke & Devrient Gmbh | Sicherheitselement mit gerasterter Schicht aus Rasterelementen |
US20100109195A1 (en) * | 2008-11-05 | 2010-05-06 | Molecular Imprints, Inc. | Release agent partition control in imprint lithography |
US20110281025A1 (en) | 2009-01-29 | 2011-11-17 | Showa Denko K.K. | Curable composition for transfer materials, and (meth) acryloyl group-containing urea compound |
EP2431150B1 (en) * | 2009-05-12 | 2017-08-23 | Daikin Industries, Ltd. | Transfer sheet and process for producing same |
EP2856258B1 (en) * | 2012-05-25 | 2021-01-06 | Micro Resist Technology Gesellschaft für chemische Materialien spezieller Photoresistsysteme mbH | Process of production of a nanopatterned article using nanoimprint lithography, nanopatterned article and uses thereof |
JP6037109B2 (ja) * | 2012-10-02 | 2016-11-30 | 株式会社スリーボンド | 光硬化性樹脂組成物 |
JP6029506B2 (ja) * | 2013-03-26 | 2016-11-24 | 富士フイルム株式会社 | インプリント用下層膜形成組成物およびパターン形成方法 |
JP2015071741A (ja) | 2013-09-04 | 2015-04-16 | Jsr株式会社 | 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板 |
-
2014
- 2014-12-10 AT ATA887/2014A patent/AT516558B1/de active
-
2015
- 2015-12-09 CN CN201580075898.1A patent/CN107209454B/zh active Active
- 2015-12-09 DK DK15817053.0T patent/DK3230795T3/da active
- 2015-12-09 ES ES15817053T patent/ES2744336T3/es active Active
- 2015-12-09 KR KR1020177018941A patent/KR102423751B1/ko active IP Right Grant
- 2015-12-09 JP JP2017549554A patent/JP6967969B2/ja active Active
- 2015-12-09 US US15/534,357 patent/US10809622B2/en active Active
- 2015-12-09 EP EP15817053.0A patent/EP3230795B1/de active Active
- 2015-12-09 WO PCT/AT2015/000156 patent/WO2016090394A1/de active Application Filing
-
2018
- 2018-03-16 HK HK18103665.8A patent/HK1244067B/zh unknown
Also Published As
Publication number | Publication date |
---|---|
ES2744336T3 (es) | 2020-02-24 |
EP3230795A1 (de) | 2017-10-18 |
CN107209454A (zh) | 2017-09-26 |
US20170343900A1 (en) | 2017-11-30 |
WO2016090394A1 (de) | 2016-06-16 |
AT516558B1 (de) | 2018-02-15 |
JP6967969B2 (ja) | 2021-11-17 |
EP3230795B1 (de) | 2019-06-05 |
KR20170093940A (ko) | 2017-08-16 |
CN107209454B (zh) | 2021-02-02 |
US10809622B2 (en) | 2020-10-20 |
AT516558A1 (de) | 2016-06-15 |
DK3230795T3 (da) | 2019-07-15 |
KR102423751B1 (ko) | 2022-07-20 |
JP2018506863A (ja) | 2018-03-08 |
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