SG11201604185PA - Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate - Google Patents
Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrateInfo
- Publication number
- SG11201604185PA SG11201604185PA SG11201604185PA SG11201604185PA SG11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- polishing processing
- manufacturingmagnetic
- disk substrate
- manufacturing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Glass (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013248291 | 2013-11-29 | ||
JP2013248263 | 2013-11-29 | ||
PCT/JP2014/081800 WO2015080295A1 (ja) | 2013-11-29 | 2014-12-01 | 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604185PA true SG11201604185PA (en) | 2016-07-28 |
Family
ID=53199229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604185PA SG11201604185PA (en) | 2013-11-29 | 2014-12-01 | Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6371310B2 (ja) |
CN (2) | CN108857869B (ja) |
SG (1) | SG11201604185PA (ja) |
WO (1) | WO2015080295A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6792106B2 (ja) * | 2017-03-30 | 2020-11-25 | スピードファム株式会社 | ワークキャリア及びワークキャリアの製造方法 |
WO2020198761A1 (en) * | 2019-03-26 | 2020-10-01 | Hoya Corporation | Method for producing substrate, method for producing magnetic disk, and polishing apparatus |
EP4040469A4 (en) * | 2019-10-01 | 2023-11-08 | Mitsubishi Gas Chemical Company, Inc. | HOLDING TOOL AND MANUFACTURING METHOD |
JP7444050B2 (ja) * | 2020-12-24 | 2024-03-06 | 株式会社Sumco | 両面研磨用キャリア及びウェーハの研磨方法 |
KR102434418B1 (ko) * | 2022-03-10 | 2022-08-22 | (주)뉴이스트 | 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63221968A (ja) * | 1987-03-11 | 1988-09-14 | Fujitsu Ltd | キヤリア |
JPH11309665A (ja) * | 1998-04-30 | 1999-11-09 | Toshiba Corp | 酸化物単結晶基板の製造方法 |
JP2000301451A (ja) * | 1999-04-21 | 2000-10-31 | Super Silicon Kenkyusho:Kk | 研磨機用キャリア及びその製造方法 |
JP2001138221A (ja) * | 1999-11-12 | 2001-05-22 | Toshiba Ceramics Co Ltd | 半導体ウエハラッピング用キャリア |
JP3439726B2 (ja) * | 2000-07-10 | 2003-08-25 | 住友ベークライト株式会社 | 被研磨物保持材及びその製造方法 |
US6454635B1 (en) * | 2000-08-08 | 2002-09-24 | Memc Electronic Materials, Inc. | Method and apparatus for a wafer carrier having an insert |
JP2002326156A (ja) * | 2001-04-27 | 2002-11-12 | Nippon Sheet Glass Co Ltd | ガラス基板研磨用キャリア及びガラス基板研磨装置 |
JP2004303280A (ja) * | 2003-03-28 | 2004-10-28 | Hoya Corp | 情報記録媒体用ガラス基板の製造方法 |
JP2008000823A (ja) * | 2006-06-20 | 2008-01-10 | Konica Minolta Opto Inc | 研磨キャリア |
JP2008044083A (ja) * | 2006-08-18 | 2008-02-28 | Kyocera Chemical Corp | 研磨用保持材 |
DE102009015878A1 (de) * | 2009-04-01 | 2010-10-07 | Peter Wolters Gmbh | Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken |
JP5741157B2 (ja) * | 2011-04-07 | 2015-07-01 | 旭硝子株式会社 | 研磨用キャリア及び該キャリアを用いたガラス基板の研磨方法及びガラス基板の製造方法 |
-
2014
- 2014-12-01 WO PCT/JP2014/081800 patent/WO2015080295A1/ja active Application Filing
- 2014-12-01 JP JP2015551038A patent/JP6371310B2/ja active Active
- 2014-12-01 CN CN201810660620.6A patent/CN108857869B/zh active Active
- 2014-12-01 SG SG11201604185PA patent/SG11201604185PA/en unknown
- 2014-12-01 CN CN201480064905.3A patent/CN105792988B/zh active Active
-
2018
- 2018-07-11 JP JP2018131797A patent/JP6577636B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN105792988A (zh) | 2016-07-20 |
JPWO2015080295A1 (ja) | 2017-03-16 |
WO2015080295A1 (ja) | 2015-06-04 |
JP2018196926A (ja) | 2018-12-13 |
JP6577636B2 (ja) | 2019-09-18 |
CN105792988B (zh) | 2018-07-20 |
JP6371310B2 (ja) | 2018-08-08 |
CN108857869A (zh) | 2018-11-23 |
CN108857869B (zh) | 2021-04-27 |
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