SG11201604185PA - Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate - Google Patents

Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate

Info

Publication number
SG11201604185PA
SG11201604185PA SG11201604185PA SG11201604185PA SG11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA SG 11201604185P A SG11201604185P A SG 11201604185PA
Authority
SG
Singapore
Prior art keywords
carrier
polishing processing
manufacturingmagnetic
disk substrate
manufacturing
Prior art date
Application number
SG11201604185PA
Inventor
Masanori Tamaki
Hiroki Nakagawa
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG11201604185PA publication Critical patent/SG11201604185PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201604185PA 2013-11-29 2014-12-01 Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate SG11201604185PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013248291 2013-11-29
JP2013248263 2013-11-29
PCT/JP2014/081800 WO2015080295A1 (en) 2013-11-29 2014-12-01 Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method

Publications (1)

Publication Number Publication Date
SG11201604185PA true SG11201604185PA (en) 2016-07-28

Family

ID=53199229

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604185PA SG11201604185PA (en) 2013-11-29 2014-12-01 Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate

Country Status (4)

Country Link
JP (2) JP6371310B2 (en)
CN (2) CN108857869B (en)
SG (1) SG11201604185PA (en)
WO (1) WO2015080295A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6792106B2 (en) * 2017-03-30 2020-11-25 スピードファム株式会社 Work carrier and manufacturing method of work carrier
WO2020198761A1 (en) * 2019-03-26 2020-10-01 Hoya Corporation Method for producing substrate, method for producing magnetic disk, and polishing apparatus
EP4040469A4 (en) * 2019-10-01 2023-11-08 Mitsubishi Gas Chemical Company, Inc. Holding tool and manufacturing method
JP7444050B2 (en) * 2020-12-24 2024-03-06 株式会社Sumco Double-sided polishing carrier and wafer polishing method
KR102434418B1 (en) * 2022-03-10 2022-08-22 (주)뉴이스트 Manufacturing Method for Carrier Used in Polishing Wafer for Seimi-Conductor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221968A (en) * 1987-03-11 1988-09-14 Fujitsu Ltd Carrier
JPH11309665A (en) * 1998-04-30 1999-11-09 Toshiba Corp Manufacture of oxide single crystal substrate
JP2000301451A (en) * 1999-04-21 2000-10-31 Super Silicon Kenkyusho:Kk Polishing device carrier and manufacture thereof
JP2001138221A (en) * 1999-11-12 2001-05-22 Toshiba Ceramics Co Ltd Carrier for wrapping of semiconductor wafer
JP3439726B2 (en) * 2000-07-10 2003-08-25 住友ベークライト株式会社 Material to be polished and method of manufacturing the same
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
JP2002326156A (en) * 2001-04-27 2002-11-12 Nippon Sheet Glass Co Ltd Carrier for polishing glass substrate, and glass substrate polishing device
JP2004303280A (en) * 2003-03-28 2004-10-28 Hoya Corp Method for manufacturing glass substrate for information recording medium
JP2008000823A (en) * 2006-06-20 2008-01-10 Konica Minolta Opto Inc Polishing carrier
JP2008044083A (en) * 2006-08-18 2008-02-28 Kyocera Chemical Corp Holding material for grinding
DE102009015878A1 (en) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Method for removing material from flat workpieces
JP5741157B2 (en) * 2011-04-07 2015-07-01 旭硝子株式会社 Polishing carrier, glass substrate polishing method using the carrier, and glass substrate manufacturing method

Also Published As

Publication number Publication date
CN105792988A (en) 2016-07-20
JPWO2015080295A1 (en) 2017-03-16
WO2015080295A1 (en) 2015-06-04
JP2018196926A (en) 2018-12-13
JP6577636B2 (en) 2019-09-18
CN105792988B (en) 2018-07-20
JP6371310B2 (en) 2018-08-08
CN108857869A (en) 2018-11-23
CN108857869B (en) 2021-04-27

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