SG11201501674XA - Double-side polishing method - Google Patents
Double-side polishing methodInfo
- Publication number
- SG11201501674XA SG11201501674XA SG11201501674XA SG11201501674XA SG11201501674XA SG 11201501674X A SG11201501674X A SG 11201501674XA SG 11201501674X A SG11201501674X A SG 11201501674XA SG 11201501674X A SG11201501674X A SG 11201501674XA SG 11201501674X A SG11201501674X A SG 11201501674XA
- Authority
- SG
- Singapore
- Prior art keywords
- double
- polishing method
- side polishing
- polishing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012196642A JP5748717B2 (en) | 2012-09-06 | 2012-09-06 | Double-side polishing method |
PCT/JP2013/004785 WO2014038129A1 (en) | 2012-09-06 | 2013-08-08 | Double surface polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201501674XA true SG11201501674XA (en) | 2015-05-28 |
Family
ID=50236767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201501674XA SG11201501674XA (en) | 2012-09-06 | 2013-08-08 | Double-side polishing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US9987721B2 (en) |
JP (1) | JP5748717B2 (en) |
KR (1) | KR102004705B1 (en) |
CN (1) | CN104602864B (en) |
DE (1) | DE112013003643T5 (en) |
SG (1) | SG11201501674XA (en) |
TW (1) | TWI532091B (en) |
WO (1) | WO2014038129A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5847789B2 (en) * | 2013-02-13 | 2016-01-27 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer |
JP6128198B1 (en) | 2015-12-22 | 2017-05-17 | 株式会社Sumco | Wafer double-side polishing method and epitaxial wafer manufacturing method using the same |
JP6443370B2 (en) * | 2016-03-18 | 2018-12-26 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer |
JP6589762B2 (en) * | 2016-07-13 | 2019-10-16 | 株式会社Sumco | Double-side polishing equipment |
JP6579056B2 (en) | 2016-07-29 | 2019-09-25 | 株式会社Sumco | Wafer double-side polishing method |
JP6743785B2 (en) * | 2017-08-30 | 2020-08-19 | 株式会社Sumco | Carrier manufacturing method and wafer polishing method |
JP7200898B2 (en) * | 2019-09-27 | 2023-01-10 | 株式会社Sumco | Double-sided polishing method of workpiece |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1110530A (en) | 1997-06-25 | 1999-01-19 | Shin Etsu Handotai Co Ltd | Carrier for both-sided polishing |
JP2000301451A (en) | 1999-04-21 | 2000-10-31 | Super Silicon Kenkyusho:Kk | Polishing device carrier and manufacture thereof |
US6454635B1 (en) * | 2000-08-08 | 2002-09-24 | Memc Electronic Materials, Inc. | Method and apparatus for a wafer carrier having an insert |
JP4727218B2 (en) | 2004-12-10 | 2011-07-20 | 株式会社住友金属ファインテック | Double-side polishing carrier |
US20080166952A1 (en) | 2005-02-25 | 2008-07-10 | Shin-Etsu Handotai Co., Ltd | Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
KR101193406B1 (en) | 2005-02-25 | 2012-10-24 | 신에쯔 한도타이 가부시키가이샤 | Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method |
DE102005034119B3 (en) | 2005-07-21 | 2006-12-07 | Siltronic Ag | Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
JP5128793B2 (en) | 2006-09-01 | 2013-01-23 | 不二越機械工業株式会社 | Double-side polishing apparatus and double-side polishing method |
JP2008227393A (en) * | 2007-03-15 | 2008-09-25 | Fujikoshi Mach Corp | Double-side polishing apparatus for wafer |
DE102007049811B4 (en) | 2007-10-17 | 2016-07-28 | Peter Wolters Gmbh | Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers |
JP4605233B2 (en) | 2008-02-27 | 2011-01-05 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
JP5151800B2 (en) * | 2008-08-20 | 2013-02-27 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
JP2010179375A (en) * | 2009-02-03 | 2010-08-19 | Sumco Corp | Grinding object carrier and manufacturing method of ground product |
JP5452984B2 (en) | 2009-06-03 | 2014-03-26 | 不二越機械工業株式会社 | Wafer double-side polishing method |
JP5233888B2 (en) | 2009-07-21 | 2013-07-10 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus and double-side polishing method for wafer |
KR101150849B1 (en) * | 2009-11-27 | 2012-06-13 | 주식회사 엘지실트론 | Wafer carrier and apparatus for polishing double side of wafer having the same |
KR20110077297A (en) * | 2009-12-30 | 2011-07-07 | 주식회사 엘지실트론 | Carrier for double side polishing apparatus |
JP5494224B2 (en) * | 2010-05-20 | 2014-05-14 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
-
2012
- 2012-09-06 JP JP2012196642A patent/JP5748717B2/en active Active
-
2013
- 2013-08-08 WO PCT/JP2013/004785 patent/WO2014038129A1/en active Application Filing
- 2013-08-08 CN CN201380046138.9A patent/CN104602864B/en active Active
- 2013-08-08 KR KR1020157005645A patent/KR102004705B1/en active IP Right Grant
- 2013-08-08 US US14/421,578 patent/US9987721B2/en active Active
- 2013-08-08 SG SG11201501674XA patent/SG11201501674XA/en unknown
- 2013-08-08 DE DE201311003643 patent/DE112013003643T5/en active Pending
- 2013-08-16 TW TW102129515A patent/TWI532091B/en active
Also Published As
Publication number | Publication date |
---|---|
JP5748717B2 (en) | 2015-07-15 |
WO2014038129A1 (en) | 2014-03-13 |
US9987721B2 (en) | 2018-06-05 |
TW201413804A (en) | 2014-04-01 |
KR102004705B1 (en) | 2019-07-29 |
TWI532091B (en) | 2016-05-01 |
US20150217425A1 (en) | 2015-08-06 |
KR20150052060A (en) | 2015-05-13 |
CN104602864B (en) | 2016-11-09 |
DE112013003643T5 (en) | 2015-04-09 |
JP2014050913A (en) | 2014-03-20 |
CN104602864A (en) | 2015-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201401560VA (en) | Double-side polishing method | |
SG11201501825WA (en) | Double-side polishing method | |
TWI561618B (en) | Polishing component | |
SG11201405708VA (en) | Polishing method | |
GB201223172D0 (en) | Method | |
GB201212937D0 (en) | Method | |
GB201212932D0 (en) | Method | |
PL2817775T3 (en) | Audience-measuring method | |
SG11201403886VA (en) | Method of double-side polishing wafer | |
GB201213636D0 (en) | Method | |
GB201212934D0 (en) | Method | |
GB201210858D0 (en) | Method | |
GB201222693D0 (en) | Novel method | |
TWI562857B (en) | Polishing apparatus | |
SG11201501674XA (en) | Double-side polishing method | |
SG11201407032WA (en) | Method | |
EP2880048A4 (en) | Method | |
GB201218570D0 (en) | Method | |
GB201202198D0 (en) | Method | |
PL2805796T3 (en) | Grinding method | |
GB201211393D0 (en) | Method | |
GB201223316D0 (en) | Method | |
GB201222737D0 (en) | Method | |
GB201217688D0 (en) | Method | |
GB201214029D0 (en) | method |