SG11201401560VA - Double-side polishing method - Google Patents
Double-side polishing methodInfo
- Publication number
- SG11201401560VA SG11201401560VA SG11201401560VA SG11201401560VA SG11201401560VA SG 11201401560V A SG11201401560V A SG 11201401560VA SG 11201401560V A SG11201401560V A SG 11201401560VA SG 11201401560V A SG11201401560V A SG 11201401560VA SG 11201401560V A SG11201401560V A SG 11201401560VA
- Authority
- SG
- Singapore
- Prior art keywords
- double
- polishing method
- side polishing
- polishing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011243342A JP5614397B2 (en) | 2011-11-07 | 2011-11-07 | Double-side polishing method |
PCT/JP2012/006374 WO2013069198A1 (en) | 2011-11-07 | 2012-10-04 | Double-sided polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401560VA true SG11201401560VA (en) | 2014-09-26 |
Family
ID=48288996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401560VA SG11201401560VA (en) | 2011-11-07 | 2012-10-04 | Double-side polishing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US9156123B2 (en) |
JP (1) | JP5614397B2 (en) |
KR (1) | KR101835414B1 (en) |
CN (1) | CN103889655B (en) |
DE (1) | DE112012004211B4 (en) |
SG (1) | SG11201401560VA (en) |
TW (1) | TWI523094B (en) |
WO (1) | WO2013069198A1 (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10335060B1 (en) | 2010-06-19 | 2019-07-02 | Dp Technologies, Inc. | Method and apparatus to provide monitoring |
US9192326B2 (en) | 2011-07-13 | 2015-11-24 | Dp Technologies, Inc. | Sleep monitoring system |
US9459597B2 (en) | 2012-03-06 | 2016-10-04 | DPTechnologies, Inc. | Method and apparatus to provide an improved sleep experience by selecting an optimal next sleep state for a user |
JP5896884B2 (en) * | 2012-11-13 | 2016-03-30 | 信越半導体株式会社 | Double-side polishing method |
US9474876B1 (en) | 2012-12-14 | 2016-10-25 | DPTechnologies, Inc. | Sleep aid efficacy |
US9594354B1 (en) | 2013-04-19 | 2017-03-14 | Dp Technologies, Inc. | Smart watch extended system |
JP6146213B2 (en) * | 2013-08-30 | 2017-06-14 | 株式会社Sumco | Double-side polishing apparatus and double-side polishing method for work |
US11963792B1 (en) | 2014-05-04 | 2024-04-23 | Dp Technologies, Inc. | Sleep ecosystem |
JP6389660B2 (en) * | 2014-07-04 | 2018-09-12 | 株式会社ディスコ | Grinding method |
US11883188B1 (en) | 2015-03-16 | 2024-01-30 | Dp Technologies, Inc. | Sleep surface sensor based sleep analysis system |
JP6383700B2 (en) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | Thin plate workpiece manufacturing method and double-head surface grinding apparatus |
CN107398780B (en) * | 2016-05-18 | 2020-03-31 | 上海新昇半导体科技有限公司 | Double-side polishing method for wafer |
JP6605395B2 (en) * | 2016-05-20 | 2019-11-13 | スピードファム株式会社 | Sectional shape measurement method |
CN106078492A (en) * | 2016-06-15 | 2016-11-09 | 江苏吉星新材料有限公司 | A kind of sapphire rectangular-shaped piece double-side grinding method |
JP6635003B2 (en) * | 2016-11-02 | 2020-01-22 | 株式会社Sumco | Method for polishing both sides of semiconductor wafer |
JP6743746B2 (en) * | 2017-03-31 | 2020-08-19 | 株式会社Sumco | Wafer double-side polishing apparatus and double-side polishing method |
CN107263278A (en) * | 2017-07-03 | 2017-10-20 | 适新科技(苏州)有限公司 | Twin grinder and grinding technics |
JP6451825B1 (en) * | 2017-12-25 | 2019-01-16 | 株式会社Sumco | Wafer double-side polishing method |
CN108326727A (en) * | 2018-04-12 | 2018-07-27 | 新乡日升数控轴承装备股份有限公司 | Size Control system and safety grinding detection method for twin grinder |
JP7031491B2 (en) * | 2018-05-22 | 2022-03-08 | 株式会社Sumco | Work double-sided polishing device and double-sided polishing method |
JP7010166B2 (en) * | 2018-07-24 | 2022-01-26 | 株式会社Sumco | Work double-sided polishing device and double-sided polishing method |
TWI704978B (en) * | 2018-09-26 | 2020-09-21 | 禾璟科技有限公司 | Computer programming products that can be applied to the grinder |
US11471097B1 (en) | 2018-10-15 | 2022-10-18 | Dp Technologies, Inc. | Hardware sensor system for improved sleep detection |
CN110193775B (en) * | 2019-03-12 | 2021-09-17 | 上海新昇半导体科技有限公司 | Chemical mechanical polishing method and chemical polishing system |
JP6683277B1 (en) * | 2019-03-13 | 2020-04-15 | 信越半導体株式会社 | Method for measuring thickness of semiconductor wafer and double-sided polishing apparatus for semiconductor wafer |
JP7081544B2 (en) * | 2019-03-22 | 2022-06-07 | 株式会社Sumco | Work double-sided polishing method and work double-sided polishing device |
CN110640621B (en) * | 2019-07-31 | 2021-03-19 | 华灿光电(浙江)有限公司 | Double-side grinding machine and double-side grinding method |
CN113001379A (en) * | 2021-03-17 | 2021-06-22 | 天津中环领先材料技术有限公司 | Large-size silicon wafer double-side polishing method |
JP2023167038A (en) * | 2022-05-11 | 2023-11-24 | 信越半導体株式会社 | Double-sided polishing method |
JP7296161B1 (en) * | 2022-06-27 | 2023-06-22 | 不二越機械工業株式会社 | Double-sided polishing machine |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271859A (en) * | 1999-03-24 | 2000-10-03 | Mitsubishi Materials Corp | Polishing device for stabilizing polishing rate |
JP2002057131A (en) * | 2000-08-10 | 2002-02-22 | Super Silicon Kenkyusho:Kk | Mechanism for controlling shape of surface table for wafer polishing |
DE10132504C1 (en) * | 2001-07-05 | 2002-10-10 | Wacker Siltronic Halbleitermat | Method for simultaneously polishing both sides of semiconductor wafer mounted on cogwheel between central cogwheel and annulus uses upper and lower polishing wheel |
JP2004014780A (en) * | 2002-06-06 | 2004-01-15 | Renesas Technology Corp | Method of evaluating flattening process and manufacturing semiconductor device |
JP2007268679A (en) * | 2006-03-31 | 2007-10-18 | Speedfam Co Ltd | Correction implement for polishing pad for double-sided polishing device and double-sided polishing device equipped therewith |
JP2008142802A (en) | 2006-12-06 | 2008-06-26 | Ohara Inc | Manufacturing method for substrate and substrate |
JP5076723B2 (en) * | 2007-08-09 | 2012-11-21 | 富士通株式会社 | Polishing apparatus, substrate and method for manufacturing electronic apparatus |
JP4605233B2 (en) * | 2008-02-27 | 2011-01-05 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
JP5177539B2 (en) | 2008-07-14 | 2013-04-03 | 株式会社名機製作所 | Shutter device for airtight structure and method for operating the same |
US8834230B2 (en) * | 2008-07-31 | 2014-09-16 | Shin-Etsu Handotai Co., Ltd. | Wafer polishing method and double-side polishing apparatus |
DE102008053610B4 (en) * | 2008-10-29 | 2011-03-31 | Siltronic Ag | Method for polishing both sides of a semiconductor wafer |
CN102054894A (en) * | 2009-11-10 | 2011-05-11 | 均豪精密工业股份有限公司 | Method for controlling etching process of photovoltaic device |
DE112011101518B4 (en) * | 2010-04-30 | 2019-05-09 | Sumco Corporation | Method for polishing silicon wafers |
-
2011
- 2011-11-07 JP JP2011243342A patent/JP5614397B2/en active Active
-
2012
- 2012-10-04 US US14/350,933 patent/US9156123B2/en active Active
- 2012-10-04 SG SG11201401560VA patent/SG11201401560VA/en unknown
- 2012-10-04 CN CN201280052936.8A patent/CN103889655B/en active Active
- 2012-10-04 WO PCT/JP2012/006374 patent/WO2013069198A1/en active Application Filing
- 2012-10-04 KR KR1020147011911A patent/KR101835414B1/en active IP Right Grant
- 2012-10-04 DE DE112012004211.5T patent/DE112012004211B4/en active Active
- 2012-10-19 TW TW101138724A patent/TWI523094B/en active
Also Published As
Publication number | Publication date |
---|---|
US20140256227A1 (en) | 2014-09-11 |
DE112012004211T5 (en) | 2014-09-11 |
US9156123B2 (en) | 2015-10-13 |
KR20140099232A (en) | 2014-08-11 |
JP2013094954A (en) | 2013-05-20 |
DE112012004211B4 (en) | 2023-08-31 |
JP5614397B2 (en) | 2014-10-29 |
TW201334051A (en) | 2013-08-16 |
CN103889655B (en) | 2016-07-20 |
TWI523094B (en) | 2016-02-21 |
KR101835414B1 (en) | 2018-03-08 |
CN103889655A (en) | 2014-06-25 |
WO2013069198A1 (en) | 2013-05-16 |
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