SG11201400614RA - Polishing pad - Google Patents

Polishing pad

Info

Publication number: SG11201400614RA
Authority: SG; Singapore
Prior art keywords: polishing pad; polishing; pad
Prior art date: 2011-09-15

Application number

SG11201400614RA

Other languages

English (en)

Inventor

Yohei Noro

Ryoji Okuda

Seiji Fukuda

Original Assignee

Toray Industries

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-09-15

Filing date

2012-09-13

Publication date

2014-09-26

2012-09-13 Application filed by Toray Industries filed Critical Toray Industries

2014-09-26 Publication of SG11201400614RA publication Critical patent/SG11201400614RA/en

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

SG11201400614RA 2011-09-15 2012-09-13 Polishing pad SG11201400614RA (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2011201350		2011-09-15
PCT/JP2012/073538 WO2013039181A1 (ja)	2011-09-15	2012-09-13	研磨パッド

Publications (1)

Publication Number	Publication Date
SG11201400614RA true SG11201400614RA (en)	2014-09-26

Family

ID=47883398

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG11201400614RA SG11201400614RA (en)	2011-09-15	2012-09-13	Polishing pad

Country Status (8)

Country	Link
US (1)	US20140378035A1 (ja)
EP (1)	EP2757578A4 (ja)
JP (1)	JPWO2013039181A1 (ja)
KR (1)	KR20140062095A (ja)
CN (1)	CN103782372A (ja)
SG (1)	SG11201400614RA (ja)
TW (1)	TW201318766A (ja)
WO (1)	WO2013039181A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPWO2013011922A1 (ja) *	2011-07-15	2015-02-23	東レ株式会社	研磨パッド
WO2013011921A1 (ja) *	2011-07-15	2013-01-24	東レ株式会社	研磨パッド
JP2016047566A (ja) *	2014-08-27	2016-04-07	株式会社フジミインコーポレーテッド	研磨パッド
CN104493689B (zh) *	2014-12-16	2017-01-11	天津大学	双盘直槽圆柱形零件表面研磨盘
CN104493684B (zh) *	2014-12-16	2016-10-05	天津大学	一种圆柱形零件研磨设备及其工件推进装置和研磨方法
US10875146B2 (en) *	2016-03-24	2020-12-29	Rohm And Haas Electronic Materials Cmp Holdings	Debris-removal groove for CMP polishing pad
US10857648B2 (en)	2017-06-14	2020-12-08	Rohm And Haas Electronic Materials Cmp Holdings	Trapezoidal CMP groove pattern
US10777418B2 (en) *	2017-06-14	2020-09-15	Rohm And Haas Electronic Materials Cmp Holdings, I	Biased pulse CMP groove pattern
US10586708B2 (en)	2017-06-14	2020-03-10	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Uniform CMP polishing method
US10857647B2 (en)	2017-06-14	2020-12-08	Rohm And Haas Electronic Materials Cmp Holdings	High-rate CMP polishing method
US10861702B2 (en)	2017-06-14	2020-12-08	Rohm And Haas Electronic Materials Cmp Holdings	Controlled residence CMP polishing method
JP7087365B2 (ja) *	2017-12-05	2022-06-21	日本電気硝子株式会社	研磨パッド
US11685013B2 (en) *	2018-01-24	2023-06-27	Taiwan Semiconductor Manufacturing Company, Ltd.	Polishing pad for chemical mechanical planarization
KR102026250B1 (ko) *	2018-02-05	2019-09-27	에스케이실트론 주식회사	웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
US11878388B2 (en) *	2018-06-15	2024-01-23	Taiwan Semiconductor Manufacturing Company, Ltd.	Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
CN113165141A (zh) *	2018-11-29	2021-07-23	株式会社大辉	抛光垫及其制造方法
US20220202258A1 (en) *	2020-12-30	2022-06-30	Shawn Gregory Matthews	Cutting board with a narrow deep juice groove centered in a shallow wide juice groove
CN114043380B (zh) *	2021-11-18	2022-11-29	北京烁科精微电子装备有限公司	一种研磨垫及具有其的研磨装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000286218A (ja) *	1999-03-30	2000-10-13	Nikon Corp	研磨部材、研磨装置及び研磨方法
DE60039054D1 (de) *	1999-03-30	2008-07-10	Nikon Corp	Gt-polierkörper, poliervorrichtung, polierverfahren und verfahren zum herstellen einer halbleitervorrichtung (2002/23)
JP2001212752A (ja)	2000-02-02	2001-08-07	Nikon Corp	研磨体、研磨装置、半導体デバイス製造方法、及び半導体デバイス
US6346032B1 (en) *	1999-09-30	2002-02-12	Vlsi Technology, Inc.	Fluid dispensing fixed abrasive polishing pad
KR100387954B1 (ko) *	1999-10-12	2003-06-19	(주) 휴네텍	연마패드용 컨디셔너와 이의 제조방법
JP2004186392A (ja)	2002-12-03	2004-07-02	Toshiba Ceramics Co Ltd	研磨布
JP2006026844A (ja) *	2004-07-20	2006-02-02	Fujitsu Ltd	ポリッシングパッド、それを備えた研磨装置及び貼り付け装置
JP2006165323A (ja) *	2004-12-08	2006-06-22	Seiko Epson Corp	Ｃｍｐ加工用研磨布、ｃｍｐ装置並びに半導体装置の製造方法
US20070202780A1 (en) *	2006-02-24	2007-08-30	Chung-Ching Feng	Polishing pad having a surface texture and method and apparatus for fabricating the same
US8002611B2 (en) *	2006-12-27	2011-08-23	Texas Instruments Incorporated	Chemical mechanical polishing pad having improved groove pattern
US8562389B2 (en) *	2007-06-08	2013-10-22	Applied Materials, Inc.	Thin polishing pad with window and molding process
JP2009082995A (ja) *	2007-09-27	2009-04-23	Covalent Materials Corp	ラッピング用研磨布、プラズマエッチング装置用シリコン電極のラッピング方法
JP2010045306A (ja)	2008-08-18	2010-02-25	Kuraray Co Ltd	研磨パッド
TWM352127U (en) *	2008-08-29	2009-03-01	Bestac Advanced Material Co Ltd	Polishing pad
CN103347652A (zh) *	2011-02-15	2013-10-09	东丽株式会社	研磨垫
WO2013011921A1 (ja) *	2011-07-15	2013-01-24	東レ株式会社	研磨パッド
JPWO2013011922A1 (ja) *	2011-07-15	2015-02-23	東レ株式会社	研磨パッド
KR20140062475A (ko) *	2011-09-16	2014-05-23	도레이 카부시키가이샤	연마 패드

2012
- 2012-09-13 US US14/344,988 patent/US20140378035A1/en not_active Abandoned
- 2012-09-13 CN CN201280044813.XA patent/CN103782372A/zh active Pending
- 2012-09-13 SG SG11201400614RA patent/SG11201400614RA/en unknown
- 2012-09-13 KR KR1020147008470A patent/KR20140062095A/ko not_active Application Discontinuation
- 2012-09-13 WO PCT/JP2012/073538 patent/WO2013039181A1/ja active Application Filing
- 2012-09-13 EP EP12832538.8A patent/EP2757578A4/en not_active Withdrawn
- 2012-09-13 JP JP2012542716A patent/JPWO2013039181A1/ja active Pending
- 2012-09-14 TW TW101133741A patent/TW201318766A/zh unknown

Also Published As

Publication number	Publication date
JPWO2013039181A1 (ja)	2015-03-26
TW201318766A (zh)	2013-05-16
EP2757578A1 (en)	2014-07-23
CN103782372A (zh)	2014-05-07
KR20140062095A (ko)	2014-05-22
EP2757578A4 (en)	2015-05-20
WO2013039181A1 (ja)	2013-03-21
US20140378035A1 (en)	2014-12-25

Publication	Publication Date	Title
SG11201400614RA (en)	2014-09-26	Polishing pad
TWI561618B (en)	2016-12-11	Polishing component
SG10201604608QA (en)	2016-07-28	Polishing Composition
SG11201502768UA (en)	2015-05-28	Polishing composition
SG10201604609WA (en)	2016-07-28	Polishing Composition
HRP20130654T1 (en)	2013-09-30	Grinding device
EP2922085A4 (en)	2016-07-13	POLISHING COMPOSITION
EP2664261A4 (en)	2014-06-11	MILL
SG11201502766QA (en)	2015-05-28	Polishing composition
SG11201501849RA (en)	2015-04-29	Polishing composition
EP2777878A4 (en)	2015-11-04	POLISHING COMPOSITION
SG11201400637XA (en)	2014-05-29	Polishing pad
EP2732917A4 (en)	2015-04-15	POLISHING CUSHION
EP2915859A4 (en)	2015-10-28	POLISHING COMPOSITION
SG11201503597PA (en)	2015-06-29	Multilayer polishing pad
GB2494768B8 (en)	2014-08-20	Well pad placement
EP2712533A4 (en)	2014-09-03	MULTI-PURPOSE CLEANING CLOTH
PL2714334T3 (pl)	2021-10-25	Głowica szlifierska
EP2767190A4 (en)	2015-05-27	SEAT PAD
GB2499954B (en)	2014-06-18	Grinding assembly
ZA201304798B (en)	2014-02-26	Grinding body
SG11201402486TA (en)	2014-11-27	Polishing composition
GB201117768D0 (en)	2011-11-30	Cleaning pad
GB201108651D0 (en)	2011-07-06	Cleaning pad
GB201217155D0 (en)	2012-11-07	Layered cleaning pad