SG111926A1 - Manufacturing method in manufacturing line, manufacturing method for exposure apparatus, and exposure apparatus - Google Patents
Manufacturing method in manufacturing line, manufacturing method for exposure apparatus, and exposure apparatusInfo
- Publication number
- SG111926A1 SG111926A1 SG200108070A SG200108070A SG111926A1 SG 111926 A1 SG111926 A1 SG 111926A1 SG 200108070 A SG200108070 A SG 200108070A SG 200108070 A SG200108070 A SG 200108070A SG 111926 A1 SG111926 A1 SG 111926A1
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- exposure apparatus
- line
- manufacturing line
- exposure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000400622 | 2000-12-28 | ||
JP2001395489A JP2002289515A (ja) | 2000-12-28 | 2001-12-26 | 製品の製造方法、露光装置の製造方法、露光装置、及びデバイス製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG111926A1 true SG111926A1 (en) | 2005-06-29 |
Family
ID=26607044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200108070A SG111926A1 (en) | 2000-12-28 | 2001-12-27 | Manufacturing method in manufacturing line, manufacturing method for exposure apparatus, and exposure apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US6891603B2 (fr) |
EP (1) | EP1220037A3 (fr) |
JP (1) | JP2002289515A (fr) |
KR (1) | KR20020055438A (fr) |
SG (1) | SG111926A1 (fr) |
TW (1) | TW546703B (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1380899B1 (fr) * | 2002-07-11 | 2014-09-03 | ASML Netherlands B.V. | Appareil lithographique et méthode de fabrication d'un dispositif |
TWI266151B (en) | 2002-07-11 | 2006-11-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US7817243B2 (en) | 2004-04-12 | 2010-10-19 | Asml Netherlands B.V. | Vibration isolation system |
CN100514193C (zh) * | 2005-03-29 | 2009-07-15 | 株式会社尼康 | 曝光装置、曝光装置的制造方法以及微元件的制造方法 |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7515281B2 (en) | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161659B2 (en) | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
JP2006303196A (ja) * | 2005-04-20 | 2006-11-02 | Canon Inc | 測定装置及びそれを有する露光装置 |
JP4410216B2 (ja) * | 2005-05-24 | 2010-02-03 | エーエスエムエル ネザーランズ ビー.ブイ. | 2ステージ・リソグラフィ装置及びデバイス製造方法 |
US7307694B2 (en) * | 2005-06-29 | 2007-12-11 | Asml Netherlands B.V. | Lithographic apparatus, radiation beam inspection device, method of inspecting a beam of radiation and device manufacturing method |
US8953148B2 (en) * | 2005-12-28 | 2015-02-10 | Nikon Corporation | Exposure apparatus and making method thereof |
EP1975980A4 (fr) * | 2005-12-28 | 2010-08-04 | Nikon Corp | Dispositif d exposition et son procede de fabrication |
EP2963498B8 (fr) * | 2006-01-19 | 2017-07-26 | Nikon Corporation | Appareil d'exposition, procédé d'exposition et procédé de production d'un dispositif |
US7483120B2 (en) | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
JP5025236B2 (ja) * | 2006-11-29 | 2012-09-12 | キヤノン株式会社 | 露光装置及び方法、並びに、デバイス製造方法 |
JP5505584B2 (ja) * | 2006-12-28 | 2014-05-28 | 株式会社ニコン | 露光装置 |
NL1036167A1 (nl) * | 2007-11-20 | 2009-05-25 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
DE102008015631A1 (de) * | 2008-03-20 | 2009-09-24 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zur Vermessung von Masken für die Photolithographie |
US8001495B2 (en) | 2008-04-17 | 2011-08-16 | International Business Machines Corporation | System and method of predicting problematic areas for lithography in a circuit design |
EP2128703A1 (fr) | 2008-05-28 | 2009-12-02 | ASML Netherlands BV | Appareil Lithographique et Procédé d'Exploitation de l'Appareil |
US20110001945A1 (en) * | 2009-07-01 | 2011-01-06 | Masayuki Shiraishi | Projection optical system, exposure apparatus, and assembly method thereof |
US8841065B2 (en) * | 2010-02-12 | 2014-09-23 | Nikon Corporation | Manufacturing method of exposure apparatus and device manufacturing method |
US8877080B2 (en) | 2010-10-18 | 2014-11-04 | Tokyo Electron Limited | Using vacuum ultra-violet (VUV) data in microwave sources |
TWI674392B (zh) * | 2014-03-27 | 2019-10-11 | 日商荏原製作所股份有限公司 | 頂板開閉機構及檢查裝置 |
WO2016184571A2 (fr) | 2015-05-20 | 2016-11-24 | Carl Zeiss Smt Gmbh | Procédé de mesure et ensemble de mesure pour un système optique de formation d'image |
DE102015209173B4 (de) | 2015-05-20 | 2018-11-08 | Carl Zeiss Smt Gmbh | Verfahren zum herstellen eines objektivs für eine lithographieanlage |
CN108508704B (zh) * | 2017-02-28 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | 光刻机和光刻机中吊框面型补偿方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
US5907392A (en) * | 1995-07-20 | 1999-05-25 | Nikon Corporation | Exposure apparatus |
EP0951054A1 (fr) * | 1996-11-28 | 1999-10-20 | Nikon Corporation | Dispositif d'alignement et procede d'exposition |
US6027262A (en) * | 1996-09-03 | 2000-02-22 | Tokyo Electron Limited | Resist process method and system |
US6262796B1 (en) * | 1997-03-10 | 2001-07-17 | Asm Lithography B.V. | Positioning device having two object holders |
US6327022B1 (en) * | 1997-01-27 | 2001-12-04 | Nikon Corporation | Projection exposure method and apparatus |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2769897B2 (ja) * | 1990-01-19 | 1998-06-25 | キヤノン株式会社 | 露光装置 |
FR2663130B1 (fr) * | 1990-06-08 | 1994-12-09 | Nippon Seiko Kk | Dispositif d'exposition par projection. |
NL9100202A (nl) * | 1991-02-05 | 1992-09-01 | Asm Lithography Bv | Lithografische inrichting met een hangende objecttafel. |
JP3360760B2 (ja) | 1993-12-08 | 2002-12-24 | 株式会社ニコン | 露光量むらの計測方法、並びに露光方法及び露光装置 |
JPH09289155A (ja) * | 1996-04-19 | 1997-11-04 | Nikon Corp | 走査型露光装置 |
JP3283767B2 (ja) | 1996-10-02 | 2002-05-20 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
JP3259657B2 (ja) * | 1997-04-30 | 2002-02-25 | キヤノン株式会社 | 投影露光装置及びそれを用いたデバイスの製造方法 |
JP3392708B2 (ja) | 1997-05-29 | 2003-03-31 | 株式会社東芝 | 結像特性の測定装置、露光装置及びそれらの方法 |
EP1030351A1 (fr) | 1997-11-12 | 2000-08-23 | Nikon Corporation | Appareil d'exposition, appareil de fabrication de composants, et procede de fabrication d'appareils d'exposition |
JPH11295901A (ja) * | 1998-04-10 | 1999-10-29 | Nikon Corp | 露光装置 |
JP2000058420A (ja) * | 1998-08-11 | 2000-02-25 | Ushio Inc | 露光装置におけるマスクステージの取り付け構造 |
-
2001
- 2001-12-26 JP JP2001395489A patent/JP2002289515A/ja not_active Withdrawn
- 2001-12-27 SG SG200108070A patent/SG111926A1/en unknown
- 2001-12-27 US US10/026,909 patent/US6891603B2/en not_active Expired - Fee Related
- 2001-12-28 EP EP01131026A patent/EP1220037A3/fr not_active Withdrawn
- 2001-12-28 KR KR1020010086817A patent/KR20020055438A/ko not_active Application Discontinuation
- 2001-12-28 TW TW090132691A patent/TW546703B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
US5907392A (en) * | 1995-07-20 | 1999-05-25 | Nikon Corporation | Exposure apparatus |
US6027262A (en) * | 1996-09-03 | 2000-02-22 | Tokyo Electron Limited | Resist process method and system |
EP0951054A1 (fr) * | 1996-11-28 | 1999-10-20 | Nikon Corporation | Dispositif d'alignement et procede d'exposition |
US6327022B1 (en) * | 1997-01-27 | 2001-12-04 | Nikon Corporation | Projection exposure method and apparatus |
US6262796B1 (en) * | 1997-03-10 | 2001-07-17 | Asm Lithography B.V. | Positioning device having two object holders |
Also Published As
Publication number | Publication date |
---|---|
TW546703B (en) | 2003-08-11 |
EP1220037A3 (fr) | 2006-02-01 |
US6891603B2 (en) | 2005-05-10 |
US20020085190A1 (en) | 2002-07-04 |
EP1220037A2 (fr) | 2002-07-03 |
JP2002289515A (ja) | 2002-10-04 |
KR20020055438A (ko) | 2002-07-08 |
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