SG107140A1 - Tin plating method - Google Patents

Tin plating method

Info

Publication number
SG107140A1
SG107140A1 SG200302194A SG200302194A SG107140A1 SG 107140 A1 SG107140 A1 SG 107140A1 SG 200302194 A SG200302194 A SG 200302194A SG 200302194 A SG200302194 A SG 200302194A SG 107140 A1 SG107140 A1 SG 107140A1
Authority
SG
Singapore
Prior art keywords
plating method
tin plating
tin
plating
Prior art date
Application number
SG200302194A
Inventor
Egli Andre
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of SG107140A1 publication Critical patent/SG107140A1/en

Links

SG200302194A 2002-09-06 2003-04-14 Tin plating method SG107140A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40878802P 2002-09-06 2002-09-06

Publications (1)

Publication Number Publication Date
SG107140A1 true SG107140A1 (en) 2004-11-29

Family

ID=34078934

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200302194A SG107140A1 (en) 2002-09-06 2003-04-14 Tin plating method

Country Status (1)

Country Link
SG (1) SG107140A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027055A (en) * 1973-07-24 1977-05-31 Photocircuits Division Of Kollmorgan Corporation Process of tin plating by immersion
JPH03183796A (en) * 1989-12-11 1991-08-09 Nippon Steel Corp Surface-treated steel sheet for electronic equipment parts excellent in whisker resistance and solderability
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
JP2000173364A (en) * 1998-12-09 2000-06-23 Sumitomo Electric Ind Ltd Tin plating applied flat conductor and flat cable using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027055A (en) * 1973-07-24 1977-05-31 Photocircuits Division Of Kollmorgan Corporation Process of tin plating by immersion
JPH03183796A (en) * 1989-12-11 1991-08-09 Nippon Steel Corp Surface-treated steel sheet for electronic equipment parts excellent in whisker resistance and solderability
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
JP2000173364A (en) * 1998-12-09 2000-06-23 Sumitomo Electric Ind Ltd Tin plating applied flat conductor and flat cable using same

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