SG10202111787PA - Local polisher, method of a local polisher and program - Google Patents

Local polisher, method of a local polisher and program

Info

Publication number
SG10202111787PA
SG10202111787PA SG10202111787PA SG10202111787PA SG10202111787PA SG 10202111787P A SG10202111787P A SG 10202111787PA SG 10202111787P A SG10202111787P A SG 10202111787PA SG 10202111787P A SG10202111787P A SG 10202111787PA SG 10202111787P A SG10202111787P A SG 10202111787PA
Authority
SG
Singapore
Prior art keywords
polisher
local
program
local polisher
Prior art date
Application number
SG10202111787PA
Inventor
Koichi Takeda
Tsuneo Torikoshi
Kunio Oishi
Katsuhide Watanabe
Hozumi Yasuda
Yu Ishii
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016204675A external-priority patent/JP6782145B2/en
Priority claimed from JP2016204676A external-priority patent/JP6817778B2/en
Priority claimed from JP2016204678A external-priority patent/JP6753758B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202111787PA publication Critical patent/SG10202111787PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202111787PA 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program SG10202111787PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016204675A JP6782145B2 (en) 2016-10-18 2016-10-18 Board processing control system, board processing control method, and program
JP2016204676A JP6817778B2 (en) 2016-10-18 2016-10-18 Local polishing equipment, local polishing methods and programs
JP2016204678A JP6753758B2 (en) 2016-10-18 2016-10-18 Polishing equipment, polishing methods and programs

Publications (1)

Publication Number Publication Date
SG10202111787PA true SG10202111787PA (en) 2021-11-29

Family

ID=62019303

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program

Country Status (4)

Country Link
US (1) US20190240799A1 (en)
SG (3) SG10202111787PA (en)
TW (2) TWI739906B (en)
WO (1) WO2018074091A1 (en)

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JP2020053550A (en) * 2018-09-27 2020-04-02 株式会社荏原製作所 Polishing device, polishing method, and machine learning device
US11731232B2 (en) * 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
JP7220573B2 (en) * 2019-01-24 2023-02-10 株式会社荏原製作所 Information processing system, information processing method, program and substrate processing apparatus
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JP7224265B2 (en) * 2019-09-18 2023-02-17 株式会社荏原製作所 machine learning device, substrate processing device, trained model, machine learning method, machine learning program
JP2021108367A (en) * 2019-12-27 2021-07-29 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus, substrate processing method, substrate processing system, and learning data generation method
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JP2022108789A (en) * 2021-01-14 2022-07-27 株式会社荏原製作所 Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate
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JP7420328B2 (en) * 2021-12-27 2024-01-23 株式会社レゾナック Waviness prediction device, waviness prediction method, method and program for processing objects to be polished

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Also Published As

Publication number Publication date
TW202204090A (en) 2022-02-01
US20190240799A1 (en) 2019-08-08
TWI739906B (en) 2021-09-21
TW201832872A (en) 2018-09-16
SG10202111784SA (en) 2021-12-30
WO2018074091A1 (en) 2018-04-26
TWI775569B (en) 2022-08-21
SG11201902651QA (en) 2019-05-30

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