SG10202101865RA - Electronic Component Handling Apparatus And Electronic Component Testing Apparatus - Google Patents
Electronic Component Handling Apparatus And Electronic Component Testing ApparatusInfo
- Publication number
- SG10202101865RA SG10202101865RA SG10202101865RA SG10202101865RA SG 10202101865R A SG10202101865R A SG 10202101865RA SG 10202101865R A SG10202101865R A SG 10202101865RA SG 10202101865R A SG10202101865R A SG 10202101865RA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic component
- testing apparatus
- handling apparatus
- component testing
- component handling
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020000875U JP3227434U (en) | 2020-03-12 | 2020-03-12 | Electronic component handling device and electronic component testing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202101865RA true SG10202101865RA (en) | 2021-10-28 |
Family
ID=72145572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202101865R SG10202101865RA (en) | 2020-03-12 | 2021-02-24 | Electronic Component Handling Apparatus And Electronic Component Testing Apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US11353502B2 (en) |
JP (1) | JP3227434U (en) |
SG (1) | SG10202101865RA (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11573267B1 (en) | 2021-11-12 | 2023-02-07 | Advantest Corporation | Electronic component handling apparatus and electronic component testing apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1058367A (en) | 1996-08-23 | 1998-03-03 | Advantest Corp | Ic carrying device |
WO2006059360A1 (en) * | 2004-11-30 | 2006-06-08 | Advantest Corporation | Electronic component handling apparatus |
KR101104291B1 (en) | 2006-10-12 | 2012-01-12 | 가부시키가이샤 아드반테스트 | Tray transfer apparatus and electronic component testing apparatus provided with the same |
JP5119744B2 (en) | 2007-05-28 | 2013-01-16 | セイコーエプソン株式会社 | Component detection method, component detection device, IC handler component detection method, and IC handler |
JP4539685B2 (en) * | 2007-06-22 | 2010-09-08 | セイコーエプソン株式会社 | Component conveyor and IC handler |
JP5137965B2 (en) | 2007-11-06 | 2013-02-06 | 株式会社アドバンテスト | Conveying device and electronic component handling device |
JP5040829B2 (en) | 2008-06-25 | 2012-10-03 | パナソニック株式会社 | Component mounting apparatus and component mounting method |
JP2011232275A (en) | 2010-04-30 | 2011-11-17 | Seiko Epson Corp | Tray inspection apparatus and electronic component inspection apparatus |
JP5637734B2 (en) | 2010-05-31 | 2014-12-10 | 富士機械製造株式会社 | Electronic component mounting apparatus and electronic component mounting method |
JP2012042407A (en) * | 2010-08-23 | 2012-03-01 | Renesas Electronics Corp | Semiconductor integrated circuit inspection apparatus, inspection method of semiconductor integrated circuit, and control program for inspection apparatus for semiconductor integrated circuit |
JP2014025723A (en) | 2012-07-24 | 2014-02-06 | Seiko Epson Corp | Handler, controller, notification method and inspection device |
JP6903268B2 (en) | 2016-12-27 | 2021-07-14 | 株式会社Nsテクノロジーズ | Electronic component transfer device and electronic component inspection device |
-
2020
- 2020-03-12 JP JP2020000875U patent/JP3227434U/en active Active
-
2021
- 2021-02-24 SG SG10202101865R patent/SG10202101865RA/en unknown
- 2021-02-26 US US17/186,846 patent/US11353502B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11353502B2 (en) | 2022-06-07 |
JP3227434U (en) | 2020-08-27 |
US20210285999A1 (en) | 2021-09-16 |
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