SG10202001434RA - Polishing Composition - Google Patents
Polishing CompositionInfo
- Publication number
- SG10202001434RA SG10202001434RA SG10202001434RA SG10202001434RA SG10202001434RA SG 10202001434R A SG10202001434R A SG 10202001434RA SG 10202001434R A SG10202001434R A SG 10202001434RA SG 10202001434R A SG10202001434R A SG 10202001434RA SG 10202001434R A SG10202001434R A SG 10202001434RA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019061627 | 2019-03-27 | ||
JP2019178322A JP7267893B2 (ja) | 2019-03-27 | 2019-09-30 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202001434RA true SG10202001434RA (en) | 2020-10-29 |
Family
ID=72714306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202001434RA SG10202001434RA (en) | 2019-03-27 | 2020-02-18 | Polishing Composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7267893B2 (ja) |
KR (1) | KR20200115201A (ja) |
SG (1) | SG10202001434RA (ja) |
TW (1) | TW202100708A (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004273502A (ja) | 2003-03-05 | 2004-09-30 | Matsushita Electric Ind Co Ltd | ウェハの研磨方法及びその装置 |
EP2489714B1 (en) | 2009-10-13 | 2015-08-12 | LG Chem, Ltd. | Slurry composition for cmp, and polishing method |
SG11201407916RA (en) | 2012-05-25 | 2015-03-30 | Nissan Chemical Ind Ltd | Polishing solution composition for wafers |
US20200299543A1 (en) | 2016-03-24 | 2020-09-24 | Fujimi Incorporated | Polishing composition |
US11326049B2 (en) | 2016-09-21 | 2022-05-10 | Fujimi Incorporated | Composition for surface treatment |
WO2018168206A1 (ja) | 2017-03-14 | 2018-09-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法 |
JP7148506B2 (ja) | 2017-05-26 | 2022-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
-
2019
- 2019-09-30 JP JP2019178322A patent/JP7267893B2/ja active Active
-
2020
- 2020-02-18 SG SG10202001434RA patent/SG10202001434RA/en unknown
- 2020-02-19 TW TW109105259A patent/TW202100708A/zh unknown
- 2020-03-20 KR KR1020200034168A patent/KR20200115201A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
TW202100708A (zh) | 2021-01-01 |
KR20200115201A (ko) | 2020-10-07 |
JP2020164780A (ja) | 2020-10-08 |
JP7267893B2 (ja) | 2023-05-02 |
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