SG10201904710UA - Wafer processing method - Google Patents
Wafer processing methodInfo
- Publication number
- SG10201904710UA SG10201904710UA SG10201904710UA SG10201904710UA SG10201904710UA SG 10201904710U A SG10201904710U A SG 10201904710UA SG 10201904710U A SG10201904710U A SG 10201904710UA SG 10201904710U A SG10201904710U A SG 10201904710UA SG 10201904710U A SG10201904710U A SG 10201904710UA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- wafer processing
- wafer
- processing
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108955A JP7143019B2 (en) | 2018-06-06 | 2018-06-06 | Wafer processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201904710UA true SG10201904710UA (en) | 2020-01-30 |
Family
ID=68651971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201904710UA SG10201904710UA (en) | 2018-06-06 | 2019-05-24 | Wafer processing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US11018043B2 (en) |
JP (1) | JP7143019B2 (en) |
KR (1) | KR20190139143A (en) |
CN (1) | CN110571133B (en) |
DE (1) | DE102019208259A1 (en) |
MY (1) | MY191394A (en) |
SG (1) | SG10201904710UA (en) |
TW (1) | TWI815900B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7430515B2 (en) * | 2019-11-06 | 2024-02-13 | 株式会社ディスコ | Wafer processing method |
JP2023019193A (en) * | 2021-07-28 | 2023-02-09 | 株式会社ディスコ | Workpiece processing method |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3076179B2 (en) | 1993-07-26 | 2000-08-14 | 株式会社ディスコ | Dicing equipment |
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-
2018
- 2018-06-06 JP JP2018108955A patent/JP7143019B2/en active Active
-
2019
- 2019-05-17 MY MYPI2019002834A patent/MY191394A/en unknown
- 2019-05-22 US US16/419,139 patent/US11018043B2/en active Active
- 2019-05-24 SG SG10201904710UA patent/SG10201904710UA/en unknown
- 2019-06-04 KR KR1020190065794A patent/KR20190139143A/en not_active Application Discontinuation
- 2019-06-04 CN CN201910479952.9A patent/CN110571133B/en active Active
- 2019-06-05 TW TW108119433A patent/TWI815900B/en active
- 2019-06-06 DE DE102019208259.9A patent/DE102019208259A1/en active Pending
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CN110571133A (en) | 2019-12-13 |
JP2019212810A (en) | 2019-12-12 |
TWI815900B (en) | 2023-09-21 |
KR20190139143A (en) | 2019-12-17 |
DE102019208259A1 (en) | 2019-12-12 |
US20190378745A1 (en) | 2019-12-12 |
JP7143019B2 (en) | 2022-09-28 |
US11018043B2 (en) | 2021-05-25 |
TW202002055A (en) | 2020-01-01 |
CN110571133B (en) | 2024-02-27 |
MY191394A (en) | 2022-06-23 |
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