TWI256674B - Method for dicing a wafer - Google Patents
Method for dicing a waferInfo
- Publication number
- TWI256674B TWI256674B TW94136026A TW94136026A TWI256674B TW I256674 B TWI256674 B TW I256674B TW 94136026 A TW94136026 A TW 94136026A TW 94136026 A TW94136026 A TW 94136026A TW I256674 B TWI256674 B TW I256674B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- reference point
- dicing
- cracks
- temperature difference
- Prior art date
Links
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A method for dicing a wafer is disclosed. In the method, a wafer containing a first surface and a second surface opposite the first surface is supplied firstly, herein a plurality of scribe lines on the first surface. The wafer is then vertically diced along the scribe lines from the first surface to a reference point so as to form a plurality of scribe lanes, herein the reference point is at a predetermined distance from the second surface. Thereafter, a thermal shake process is performed on the wafer to generate a temperature difference between the reference point and the second surface, herein the temperature difference produces a stress concentration between the reference point and the second surface to form a plurality of cracks thereon, thereby dicing the wafer by the cracks to form a plurality of dies.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94136026A TWI256674B (en) | 2005-10-14 | 2005-10-14 | Method for dicing a wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94136026A TWI256674B (en) | 2005-10-14 | 2005-10-14 | Method for dicing a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI256674B true TWI256674B (en) | 2006-06-11 |
TW200715388A TW200715388A (en) | 2007-04-16 |
Family
ID=37614744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94136026A TWI256674B (en) | 2005-10-14 | 2005-10-14 | Method for dicing a wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI256674B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098148A (en) * | 2018-01-30 | 2019-08-06 | 株式会社迪思科 | The processing method of chip |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107275251B (en) * | 2016-04-08 | 2020-10-16 | 上海新昇半导体科技有限公司 | Method for reducing temperature of chip in pre-pumping cavity and chip cooling device |
JP6855127B2 (en) * | 2017-06-05 | 2021-04-07 | 株式会社ディスコ | Chip manufacturing method |
JP7143019B2 (en) * | 2018-06-06 | 2022-09-28 | 株式会社ディスコ | Wafer processing method |
-
2005
- 2005-10-14 TW TW94136026A patent/TWI256674B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098148A (en) * | 2018-01-30 | 2019-08-06 | 株式会社迪思科 | The processing method of chip |
Also Published As
Publication number | Publication date |
---|---|
TW200715388A (en) | 2007-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |