SG10201601804QA - Substrate transfer hand - Google Patents

Substrate transfer hand

Info

Publication number
SG10201601804QA
SG10201601804QA SG10201601804QA SG10201601804QA SG10201601804QA SG 10201601804Q A SG10201601804Q A SG 10201601804QA SG 10201601804Q A SG10201601804Q A SG 10201601804QA SG 10201601804Q A SG10201601804Q A SG 10201601804QA SG 10201601804Q A SG10201601804Q A SG 10201601804QA
Authority
SG
Singapore
Prior art keywords
substrate transfer
transfer hand
hand
substrate
transfer
Prior art date
Application number
SG10201601804QA
Inventor
Toru Maruyama
Yasuyuki Motoshima
Yohei Eto
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201601804QA publication Critical patent/SG10201601804QA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/0014Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/0033Gripping heads and other end effectors with gripping surfaces having special shapes
    • B25J15/0038Cylindrical gripping surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/0033Gripping heads and other end effectors with gripping surfaces having special shapes
    • B25J15/0042V-shaped gripping surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0214Articles of special size, shape or weigh
    • B65G2201/022Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
SG10201601804QA 2015-03-10 2016-03-09 Substrate transfer hand SG10201601804QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015046668A JP6535187B2 (en) 2015-03-10 2015-03-10 Substrate transfer hand

Publications (1)

Publication Number Publication Date
SG10201601804QA true SG10201601804QA (en) 2016-10-28

Family

ID=56887371

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601804QA SG10201601804QA (en) 2015-03-10 2016-03-09 Substrate transfer hand

Country Status (6)

Country Link
US (1) US10475691B2 (en)
JP (1) JP6535187B2 (en)
KR (1) KR102277943B1 (en)
CN (1) CN105966916B (en)
SG (1) SG10201601804QA (en)
TW (1) TWI689031B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6757646B2 (en) * 2016-10-27 2020-09-23 川崎重工業株式会社 Board gripping hand and board transfer device equipped with it
CN106737805A (en) * 2016-12-13 2017-05-31 天津彼洋机器人***工程有限公司 A kind of multi-function robot clamping jaw
CN109461693B (en) * 2017-09-06 2023-06-02 台湾积体电路制造股份有限公司 Wafer transfer apparatus, wafer processing system and method
JP6992515B2 (en) * 2018-01-05 2022-01-13 コニカミノルタ株式会社 GPU allocation program, GPU allocation method, computer-readable recording medium, and GPU allocation device
KR20200078773A (en) * 2018-12-21 2020-07-02 세메스 주식회사 Reversing unit and Apparatus for treating substrate with the unit
CN111470283A (en) * 2020-04-24 2020-07-31 上海世禹精密机械有限公司 Circulation recovery plant of carrier
CN112018024A (en) 2020-09-11 2020-12-01 北京北方华创微电子装备有限公司 Mechanical arm
KR102241638B1 (en) * 2020-12-31 2021-04-19 주식회사 한국 방재리더스 Cable protection case device for the distribution cable of apartment house

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS46856Y1 (en) 1970-04-30 1971-01-13
US5061144A (en) 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
JP3182013B2 (en) 1992-12-02 2001-07-03 東京応化工業株式会社 Rotating cup type coating device
JP2000260858A (en) 1999-03-12 2000-09-22 Sumitomo Heavy Ind Ltd Wafer transfer hand and wafer transfer method using the same
JP4600856B2 (en) * 2000-10-24 2010-12-22 ムラテックオートメーション株式会社 Substrate holding device
JP3724361B2 (en) * 2000-10-31 2005-12-07 ダイキン工業株式会社 Substrate transfer device
JP2003077980A (en) * 2001-09-06 2003-03-14 Yaskawa Electric Corp Wafer carrying hand
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
JP3962609B2 (en) 2002-03-05 2007-08-22 東京エレクトロン株式会社 Transport device
EP1401168A1 (en) * 2002-09-20 2004-03-24 Alcatel A method to transport an internet packet and related network elements
US7654596B2 (en) 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
CN101383318B (en) 2003-06-27 2010-09-08 马特森技术公司 Endeffectors for handling semiconductor wafers
JP2005044938A (en) 2003-07-25 2005-02-17 Foi:Kk Substrate transfer device with aligner
US7290813B2 (en) 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
JP4616731B2 (en) * 2005-09-01 2011-01-19 東京エレクトロン株式会社 Coating and developing equipment
JP2010258170A (en) 2009-04-23 2010-11-11 Tokyo Electron Ltd Substrate holding member, substrate transfer arm, and substrate carrier
JP2012212751A (en) * 2011-03-31 2012-11-01 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and cleaning device of the same
JP6034080B2 (en) * 2012-07-13 2016-11-30 株式会社Screenホールディングス Substrate holding device
JP3182013U (en) * 2012-12-20 2013-02-28 東京エレクトロン株式会社 Substrate holding member
JP2014175404A (en) 2013-03-07 2014-09-22 Hitachi Kokusai Electric Inc Substrate processing device
JP6335587B2 (en) 2014-03-31 2018-05-30 株式会社荏原製作所 Substrate holding mechanism, substrate transfer device, semiconductor manufacturing device

Also Published As

Publication number Publication date
TWI689031B (en) 2020-03-21
JP6535187B2 (en) 2019-06-26
US10475691B2 (en) 2019-11-12
KR102277943B1 (en) 2021-07-16
US20160264365A1 (en) 2016-09-15
CN105966916B (en) 2019-08-30
CN105966916A (en) 2016-09-28
JP2016167531A (en) 2016-09-15
TW201643985A (en) 2016-12-16
KR20160110192A (en) 2016-09-21

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