SE9903531D0 - Method for electro-deposition of metallic multi-layers - Google Patents

Method for electro-deposition of metallic multi-layers

Info

Publication number
SE9903531D0
SE9903531D0 SE9903531A SE9903531A SE9903531D0 SE 9903531 D0 SE9903531 D0 SE 9903531D0 SE 9903531 A SE9903531 A SE 9903531A SE 9903531 A SE9903531 A SE 9903531A SE 9903531 D0 SE9903531 D0 SE 9903531D0
Authority
SE
Sweden
Prior art keywords
ions
layers
solution
electro
deposition
Prior art date
Application number
SE9903531A
Other languages
Swedish (sv)
Inventor
Sima Valizadeh
Original Assignee
Res Inst Acreo Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Res Inst Acreo Ab filed Critical Res Inst Acreo Ab
Priority to SE9903531A priority Critical patent/SE9903531D0/en
Publication of SE9903531D0 publication Critical patent/SE9903531D0/en
Priority to KR1020027003613A priority patent/KR20020042680A/en
Priority to PCT/SE2000/001902 priority patent/WO2001023645A1/en
Priority to EP00970386A priority patent/EP1230443A1/en
Priority to CA002382481A priority patent/CA2382481A1/en
Priority to CN00813445A priority patent/CN1376214A/en
Priority to JP2001527021A priority patent/JP2003510465A/en
Priority to AU79777/00A priority patent/AU7977700A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers

Abstract

An electrodeposition method for the production of multilayer structures comprising substrates provided with layers of thin metal films of Co and Au by means of applying a current between two electrodes having a potential therebetween, immersed in a solution at least partly covering one or more substrate(s), said solution comprising Co ions and Au ions, said method comprising growing the multilayers on the substrate(s) in the solution, characterised in that the method is controlled by modulating either the current density and/or the applied potential and that the concentration of the Au ions is kept much lower than the concentration of the Co ions.
SE9903531A 1999-09-30 1999-09-30 Method for electro-deposition of metallic multi-layers SE9903531D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9903531A SE9903531D0 (en) 1999-09-30 1999-09-30 Method for electro-deposition of metallic multi-layers
KR1020027003613A KR20020042680A (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
PCT/SE2000/001902 WO2001023645A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
EP00970386A EP1230443A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
CA002382481A CA2382481A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
CN00813445A CN1376214A (en) 1999-09-30 2000-10-02 Method for electrodeposition of emtallic multilayers
JP2001527021A JP2003510465A (en) 1999-09-30 2000-10-02 Electrodeposition method of metal multilayer
AU79777/00A AU7977700A (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9903531A SE9903531D0 (en) 1999-09-30 1999-09-30 Method for electro-deposition of metallic multi-layers

Publications (1)

Publication Number Publication Date
SE9903531D0 true SE9903531D0 (en) 1999-09-30

Family

ID=20417206

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9903531A SE9903531D0 (en) 1999-09-30 1999-09-30 Method for electro-deposition of metallic multi-layers

Country Status (8)

Country Link
EP (1) EP1230443A1 (en)
JP (1) JP2003510465A (en)
KR (1) KR20020042680A (en)
CN (1) CN1376214A (en)
AU (1) AU7977700A (en)
CA (1) CA2382481A1 (en)
SE (1) SE9903531D0 (en)
WO (1) WO2001023645A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132275B2 (en) * 2001-05-14 2006-11-07 The John Hopkins University Multifunctional magnetic nanowires
CN1896337B (en) * 2006-06-16 2010-05-12 南京航空航天大学 Full-automatic fluid system microreactor for electrodeposition coded nano-line
KR100848689B1 (en) * 2006-11-01 2008-07-28 고려대학교 산학협력단 Method of Manufacturing Multilayered Nanowires and Nanowires thereof
US7736753B2 (en) * 2007-01-05 2010-06-15 International Business Machines Corporation Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD
WO2013066454A2 (en) * 2011-08-02 2013-05-10 Massachusetts Institute Of Technology Tuning nano-scale grain size distribution in multilayered alloys electrodeposited using ionic solutions, including a1-mn and similar alloys
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution
WO2015065150A1 (en) * 2013-11-04 2015-05-07 서울시립대학교 산학협력단 Method for forming multilayer-plated thin film using alloy plating liquid and pulse current
JP6422658B2 (en) * 2014-02-27 2018-11-14 新光電気工業株式会社 Electroplating bath and electroplating method
KR101776149B1 (en) * 2015-07-24 2017-09-08 덕산하이메탈(주) Plating apparatus and plating method for alloy with exothermic and amorphous characteristics plating
KR101713016B1 (en) * 2015-07-24 2017-03-07 덕산하이메탈(주) Manufacturing method of sheet with exothermic and amorphous characteristics by plating
US10988851B2 (en) 2015-09-02 2021-04-27 Dankook University Cheonan Campus Industry Academic Cooperation Foundation Method for manufacturing composition controlled thin alloy foil by using electro-forming
KR101837440B1 (en) 2016-05-02 2018-03-09 한국과학기술연구원 Metal nanolaminates and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1965768A1 (en) * 1969-01-07 1970-07-30 Western Electric Co Electronic precipitation of precious metals
US4108739A (en) * 1973-09-04 1978-08-22 Fuji Photo Film Co., Ltd. Plating method for memory elements
JPS55164092A (en) * 1979-06-08 1980-12-20 Sony Corp Noncrystalline alloy-plated layer and its manufacture
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
JPH0270084A (en) * 1988-09-06 1990-03-08 C Uyemura & Co Ltd Gold plating bath and gold plating method
JP3102505B2 (en) * 1991-07-18 2000-10-23 ティーディーケイ株式会社 Method for manufacturing soft magnetic multilayer plating film, soft magnetic multilayer plating film, and magnetic head

Also Published As

Publication number Publication date
EP1230443A1 (en) 2002-08-14
AU7977700A (en) 2001-04-30
KR20020042680A (en) 2002-06-05
CN1376214A (en) 2002-10-23
CA2382481A1 (en) 2001-04-05
JP2003510465A (en) 2003-03-18
WO2001023645A1 (en) 2001-04-05

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