SE9903531D0 - Förfarande för elektroavsättning av metalliska flerskikt - Google Patents

Förfarande för elektroavsättning av metalliska flerskikt

Info

Publication number
SE9903531D0
SE9903531D0 SE9903531A SE9903531A SE9903531D0 SE 9903531 D0 SE9903531 D0 SE 9903531D0 SE 9903531 A SE9903531 A SE 9903531A SE 9903531 A SE9903531 A SE 9903531A SE 9903531 D0 SE9903531 D0 SE 9903531D0
Authority
SE
Sweden
Prior art keywords
ions
layers
solution
electro
deposition
Prior art date
Application number
SE9903531A
Other languages
English (en)
Inventor
Sima Valizadeh
Original Assignee
Res Inst Acreo Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Res Inst Acreo Ab filed Critical Res Inst Acreo Ab
Priority to SE9903531A priority Critical patent/SE9903531D0/sv
Publication of SE9903531D0 publication Critical patent/SE9903531D0/sv
Priority to JP2001527021A priority patent/JP2003510465A/ja
Priority to CA002382481A priority patent/CA2382481A1/en
Priority to EP00970386A priority patent/EP1230443A1/en
Priority to KR1020027003613A priority patent/KR20020042680A/ko
Priority to AU79777/00A priority patent/AU7977700A/en
Priority to PCT/SE2000/001902 priority patent/WO2001023645A1/en
Priority to CN00813445A priority patent/CN1376214A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE9903531A 1999-09-30 1999-09-30 Förfarande för elektroavsättning av metalliska flerskikt SE9903531D0 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9903531A SE9903531D0 (sv) 1999-09-30 1999-09-30 Förfarande för elektroavsättning av metalliska flerskikt
JP2001527021A JP2003510465A (ja) 1999-09-30 2000-10-02 金属多層の電着方法
CA002382481A CA2382481A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
EP00970386A EP1230443A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
KR1020027003613A KR20020042680A (ko) 1999-09-30 2000-10-02 금속 다층체의 전착 방법
AU79777/00A AU7977700A (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
PCT/SE2000/001902 WO2001023645A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers
CN00813445A CN1376214A (zh) 1999-09-30 2000-10-02 金属多层的电解沉积方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9903531A SE9903531D0 (sv) 1999-09-30 1999-09-30 Förfarande för elektroavsättning av metalliska flerskikt

Publications (1)

Publication Number Publication Date
SE9903531D0 true SE9903531D0 (sv) 1999-09-30

Family

ID=20417206

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9903531A SE9903531D0 (sv) 1999-09-30 1999-09-30 Förfarande för elektroavsättning av metalliska flerskikt

Country Status (8)

Country Link
EP (1) EP1230443A1 (sv)
JP (1) JP2003510465A (sv)
KR (1) KR20020042680A (sv)
CN (1) CN1376214A (sv)
AU (1) AU7977700A (sv)
CA (1) CA2382481A1 (sv)
SE (1) SE9903531D0 (sv)
WO (1) WO2001023645A1 (sv)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132275B2 (en) * 2001-05-14 2006-11-07 The John Hopkins University Multifunctional magnetic nanowires
CN1896337B (zh) * 2006-06-16 2010-05-12 南京航空航天大学 用于电沉积编码纳米线的全自动流动体系微反应器
KR100848689B1 (ko) * 2006-11-01 2008-07-28 고려대학교 산학협력단 다층 나노선 및 이의 형성방법
US7736753B2 (en) * 2007-01-05 2010-06-15 International Business Machines Corporation Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD
CN103906863A (zh) * 2011-08-02 2014-07-02 麻省理工学院 在使用离子溶液电沉积的包括Al-Mn和类似合金的多层合金中调节纳米尺度的晶粒尺寸分布
JP5025815B1 (ja) * 2011-08-10 2012-09-12 小島化学薬品株式会社 硬質金めっき液
WO2015065150A1 (ko) * 2013-11-04 2015-05-07 서울시립대학교 산학협력단 합금 도금액과 펄스전류를 이용한 다층 도금 박막 제조방법
JP6422658B2 (ja) * 2014-02-27 2018-11-14 新光電気工業株式会社 電気めっき浴及び電気めっき方法
KR101713016B1 (ko) * 2015-07-24 2017-03-07 덕산하이메탈(주) 도금에 의한 발열 및 비정질 특성을 갖는 박판 제조방법
KR101776149B1 (ko) * 2015-07-24 2017-09-08 덕산하이메탈(주) 발열 및 비정질 특성을 가진 합금 도금용 도금장치 및 도금방법
US10988851B2 (en) 2015-09-02 2021-04-27 Dankook University Cheonan Campus Industry Academic Cooperation Foundation Method for manufacturing composition controlled thin alloy foil by using electro-forming
KR101837440B1 (ko) 2016-05-02 2018-03-09 한국과학기술연구원 금속 나노적층체 및 이의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE743946A (sv) * 1969-01-07 1970-05-28
US4108739A (en) * 1973-09-04 1978-08-22 Fuji Photo Film Co., Ltd. Plating method for memory elements
JPS55164092A (en) * 1979-06-08 1980-12-20 Sony Corp Noncrystalline alloy-plated layer and its manufacture
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
JPH0270084A (ja) * 1988-09-06 1990-03-08 C Uyemura & Co Ltd 金めっき浴及び金めっき方法
JP3102505B2 (ja) * 1991-07-18 2000-10-23 ティーディーケイ株式会社 軟磁性多層めっき膜の製造方法および軟磁性多層めっき膜ならびに磁気ヘッド

Also Published As

Publication number Publication date
KR20020042680A (ko) 2002-06-05
CN1376214A (zh) 2002-10-23
EP1230443A1 (en) 2002-08-14
AU7977700A (en) 2001-04-30
WO2001023645A1 (en) 2001-04-05
CA2382481A1 (en) 2001-04-05
JP2003510465A (ja) 2003-03-18

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