SE9801988L - Integrerad mikrovåghybridkrets - Google Patents

Integrerad mikrovåghybridkrets

Info

Publication number
SE9801988L
SE9801988L SE9801988A SE9801988A SE9801988L SE 9801988 L SE9801988 L SE 9801988L SE 9801988 A SE9801988 A SE 9801988A SE 9801988 A SE9801988 A SE 9801988A SE 9801988 L SE9801988 L SE 9801988L
Authority
SE
Sweden
Prior art keywords
microwave hybrid
hybrid circuit
board
integrated microwave
chips
Prior art date
Application number
SE9801988A
Other languages
English (en)
Other versions
SE9801988D0 (sv
SE522105C2 (sv
Inventor
Viktor Anatolievich Iovdalsky
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801988L publication Critical patent/SE9801988L/sv
Publication of SE9801988D0 publication Critical patent/SE9801988D0/sv
Publication of SE522105C2 publication Critical patent/SE522105C2/sv

Links

Classifications

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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SE9801988A 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets SE522105C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000294 WO1998015981A1 (fr) 1996-10-10 1996-10-10 Circuit integre hybride et a frequence micro-ondes

Publications (3)

Publication Number Publication Date
SE9801988L true SE9801988L (sv) 1998-06-04
SE9801988D0 SE9801988D0 (sv) 1998-06-04
SE522105C2 SE522105C2 (sv) 2004-01-13

Family

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Application Number Title Priority Date Filing Date
SE9801988A SE522105C2 (sv) 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets

Country Status (5)

Country Link
US (1) US6204555B1 (sv)
JP (1) JP2000516044A (sv)
KR (1) KR19990072029A (sv)
SE (1) SE522105C2 (sv)
WO (1) WO1998015981A1 (sv)

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US6259148B1 (en) * 1998-08-13 2001-07-10 International Business Machines Corporation Modular high frequency integrated circuit structure
DE60137117D1 (de) * 2000-02-22 2009-02-05 Toray Eng Co Ltd Kontaktlose ic-karte und verfahren zu ihrer herstellung
WO2001075789A1 (fr) * 2000-04-04 2001-10-11 Toray Engineering Company, Limited Procede de production de boitier cof
DE10122221A1 (de) * 2001-05-08 2002-11-21 Danfoss Silicon Power Gmbh Leistungselektronikmodul mit einer Bodenplatte und darauf gelötetem Substrat
US6707150B1 (en) * 2002-10-24 2004-03-16 Galaxy Pcb Co., Ltd. Package support member with high heat-removing ability
JP3844467B2 (ja) * 2003-01-08 2006-11-15 沖電気工業株式会社 半導体装置及びその製造方法
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
JP2004361308A (ja) * 2003-06-06 2004-12-24 Fuji Electric Device Technology Co Ltd 物理量検出装置および物理量検出手段格納ケース
DE102004016940B4 (de) * 2004-04-06 2019-08-08 Continental Automotive Gmbh Schaltungsträger für einen Halbleiterchip und ein Bauelement mit einem Halbleiterchip
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US9704809B2 (en) * 2013-03-05 2017-07-11 Maxim Integrated Products, Inc. Fan-out and heterogeneous packaging of electronic components
CN105140189B (zh) * 2015-07-08 2019-04-26 华进半导体封装先导技术研发中心有限公司 板级扇出型芯片封装器件及其制备方法
CN113359248B (zh) * 2021-06-02 2022-11-15 青岛海信宽带多媒体技术有限公司 一种光模块

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127177A (en) * 1976-04-19 1977-10-25 Toshiba Corp Semiconductor device
JPS59182545A (ja) * 1983-03-31 1984-10-17 Nec Home Electronics Ltd 混成集積回路
JPS63271944A (ja) * 1987-04-28 1988-11-09 Sumitomo Electric Ind Ltd 半導体装置
JP3190057B2 (ja) * 1990-07-02 2001-07-16 株式会社東芝 複合集積回路装置
RU2025822C1 (ru) * 1991-03-19 1994-12-30 Государственное научно-производственное предприятие "Исток" Гибридная интегральная схема
RU2004036C1 (ru) * 1991-04-25 1993-11-30 Виктор Анатольевич Иовдальский Гибридна интегральна СВЧ- и КВЧ-схема
DE4222474A1 (de) * 1992-07-09 1994-01-13 Bosch Gmbh Robert Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen
JPH06132417A (ja) * 1992-10-20 1994-05-13 Fujitsu Ltd 超高周波装置
JPH0810739B2 (ja) * 1993-02-08 1996-01-31 日本電気株式会社 ハイブリッドｉｃ
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置

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SE9801988D0 (sv) 1998-06-04
US6204555B1 (en) 2001-03-20
JP2000516044A (ja) 2000-11-28
KR19990072029A (ko) 1999-09-27
WO1998015981A1 (fr) 1998-04-16
SE522105C2 (sv) 2004-01-13

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