SE9603750D0 - Plockhuvud för komponentmonteringsmaskin - Google Patents

Plockhuvud för komponentmonteringsmaskin

Info

Publication number
SE9603750D0
SE9603750D0 SE9603750A SE9603750A SE9603750D0 SE 9603750 D0 SE9603750 D0 SE 9603750D0 SE 9603750 A SE9603750 A SE 9603750A SE 9603750 A SE9603750 A SE 9603750A SE 9603750 D0 SE9603750 D0 SE 9603750D0
Authority
SE
Sweden
Prior art keywords
carriage
slide
pipettes
positions
arms
Prior art date
Application number
SE9603750A
Other languages
English (en)
Inventor
Peter Roos
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE9603750A priority Critical patent/SE9603750D0/sv
Publication of SE9603750D0 publication Critical patent/SE9603750D0/sv
Priority to US09/284,293 priority patent/US6397456B1/en
Priority to PCT/SE1997/001716 priority patent/WO1998017092A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SE9603750A 1996-10-14 1996-10-14 Plockhuvud för komponentmonteringsmaskin SE9603750D0 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9603750A SE9603750D0 (sv) 1996-10-14 1996-10-14 Plockhuvud för komponentmonteringsmaskin
US09/284,293 US6397456B1 (en) 1996-10-14 1997-10-14 Method and a machine for automatic mounting of components and a pick-up head for such a machine
PCT/SE1997/001716 WO1998017092A1 (en) 1996-10-14 1997-10-14 A method and a machine for automatic mounting of components and a pick-up head for such a machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9603750A SE9603750D0 (sv) 1996-10-14 1996-10-14 Plockhuvud för komponentmonteringsmaskin

Publications (1)

Publication Number Publication Date
SE9603750D0 true SE9603750D0 (sv) 1996-10-14

Family

ID=20404237

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9603750A SE9603750D0 (sv) 1996-10-14 1996-10-14 Plockhuvud för komponentmonteringsmaskin

Country Status (3)

Country Link
US (1) US6397456B1 (sv)
SE (1) SE9603750D0 (sv)
WO (1) WO1998017092A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4326474B2 (ja) * 2002-11-08 2009-09-09 アッセンブレオン エヌ ヴィ 位置決め装置の少なくとも２つの要素を動かす方法、及び、かかる位置決め装置
CN100438742C (zh) * 2002-11-13 2008-11-26 阿森姆布里昂股份有限公司 元件布置机以及一种用于传送印刷电路板的方法
PL2118077T3 (pl) 2007-02-08 2015-05-29 Synta Pharmaceuticals Corp Związki triazolowe modulujące aktywność hsp90
SG10201807847RA (en) 2012-06-28 2018-10-30 Universal Instruments Corp Flexible assembly machine, system and method
SE543326C2 (sv) 2014-02-07 2020-12-01 Universal Instruments Corp Pick and place head with internal vacuum and air pressure supply, system and method
US20230156991A1 (en) * 2021-11-15 2023-05-18 Kulicke & Soffa Netherlands B.V. Component placement systems, multi-pipette placement heads, and methods of using the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956888A (ja) * 1982-09-22 1984-04-02 Tokyo Erekutoron Kk 二次元駆動装置
JPS6150002A (ja) * 1984-08-20 1986-03-12 Matsushita Electric Ind Co Ltd 相対位置検出装置
US4705311A (en) * 1986-02-27 1987-11-10 Universal Instruments Corporation Component pick and place spindle assembly with compact internal linear and rotary displacement motors and interchangeable tool assemblies
JPS63168096A (ja) * 1986-12-29 1988-07-12 株式会社東芝 電子部品の実装装置
JPS63168098A (ja) * 1986-12-29 1988-07-12 株式会社東芝 電子部品の実装装置
JP2511515B2 (ja) * 1989-02-14 1996-06-26 ジューキ株式会社 電子部品装着装置
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
JPH0472797A (ja) * 1990-07-13 1992-03-06 Canon Inc 実装装置
JP2517178B2 (ja) * 1991-03-04 1996-07-24 松下電器産業株式会社 電子部品の実装方法
JP2924293B2 (ja) * 1991-06-06 1999-07-26 松下電器産業株式会社 電子部品の移載ヘッド装置
JPH0537194A (ja) * 1991-08-02 1993-02-12 Sanyo Electric Co Ltd 部品装着装置
US5259500A (en) * 1991-12-23 1993-11-09 Joseph Alvite Tape packaging system with removeable covers
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JPH1051198A (ja) * 1996-05-08 1998-02-20 Tenryu Technic:Kk 電子部品実装方法

Also Published As

Publication number Publication date
US6397456B1 (en) 2002-06-04
WO1998017092A1 (en) 1998-04-23

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