SE8403302D0 - MANUFACTURING TRANSISTOR - Google Patents
MANUFACTURING TRANSISTORInfo
- Publication number
- SE8403302D0 SE8403302D0 SE8403302A SE8403302A SE8403302D0 SE 8403302 D0 SE8403302 D0 SE 8403302D0 SE 8403302 A SE8403302 A SE 8403302A SE 8403302 A SE8403302 A SE 8403302A SE 8403302 D0 SE8403302 D0 SE 8403302D0
- Authority
- SE
- Sweden
- Prior art keywords
- mosfets
- manufacturing transistor
- fabricating
- aperture
- image
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76294—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
A method for fabricating a plurality of relatively closely spaced MOSFETs is disclosed. A field oxide (54) having a plurality of vertical-walled apertures (56) is formed on the surface (52) of a silicon substrate (50), and a monocrystalline semiconductor region (58) is grown epitaxially within each aperture. MOSFETs are then formed in these semiconductor regions. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50680483A | 1983-06-22 | 1983-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8403302D0 true SE8403302D0 (en) | 1984-06-20 |
SE8403302L SE8403302L (en) | 1984-12-23 |
Family
ID=24016078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8403302A SE8403302L (en) | 1983-06-22 | 1984-06-20 | MANUFACTURING TRANSISTOR |
Country Status (5)
Country | Link |
---|---|
DE (1) | DE3422495A1 (en) |
FR (1) | FR2549294A1 (en) |
GB (1) | GB2142185A (en) |
IT (1) | IT1174192B (en) |
SE (1) | SE8403302L (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942449A (en) * | 1988-03-28 | 1990-07-17 | General Electric Company | Fabrication method and structure for field isolation in field effect transistors on integrated circuit chips |
KR890017771A (en) * | 1988-05-20 | 1989-12-18 | 강진구 | Semiconductor device manufacturing method |
US5158907A (en) * | 1990-08-02 | 1992-10-27 | At&T Bell Laboratories | Method for making semiconductor devices with low dislocation defects |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2059116C3 (en) * | 1970-12-01 | 1974-11-21 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Method for manufacturing a semiconductor component |
US3861968A (en) * | 1972-06-19 | 1975-01-21 | Ibm | Method of fabricating integrated circuit device structure with complementary elements utilizing selective thermal oxidation and selective epitaxial deposition |
US4536842A (en) * | 1982-03-31 | 1985-08-20 | Tokyo Shibaura Denki Kabushiki Kaisha | System for measuring interfloor traffic for group control of elevator cars |
-
1984
- 1984-06-12 GB GB08414923A patent/GB2142185A/en not_active Withdrawn
- 1984-06-13 IT IT8421384A patent/IT1174192B/en active
- 1984-06-16 DE DE19843422495 patent/DE3422495A1/en not_active Withdrawn
- 1984-06-20 SE SE8403302A patent/SE8403302L/en not_active Application Discontinuation
- 1984-06-21 FR FR8409771A patent/FR2549294A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE8403302L (en) | 1984-12-23 |
DE3422495A1 (en) | 1985-01-10 |
IT8421384A1 (en) | 1985-12-13 |
GB2142185A (en) | 1985-01-09 |
IT8421384A0 (en) | 1984-06-13 |
GB8414923D0 (en) | 1984-07-18 |
FR2549294A1 (en) | 1985-01-18 |
IT1174192B (en) | 1987-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8403302-6 Effective date: 19860527 |