SE8302798D0 - Improved electroless gold plating - Google Patents

Improved electroless gold plating

Info

Publication number
SE8302798D0
SE8302798D0 SE8302798A SE8302798A SE8302798D0 SE 8302798 D0 SE8302798 D0 SE 8302798D0 SE 8302798 A SE8302798 A SE 8302798A SE 8302798 A SE8302798 A SE 8302798A SE 8302798 D0 SE8302798 D0 SE 8302798D0
Authority
SE
Sweden
Prior art keywords
alkali metal
gold
electroless
nickel
copper
Prior art date
Application number
SE8302798A
Other languages
English (en)
Other versions
SE8302798L (sv
Inventor
M F El-Shazly
A Halecky
K D Baker
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of SE8302798D0 publication Critical patent/SE8302798D0/sv
Publication of SE8302798L publication Critical patent/SE8302798L/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cosmetics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE8302798A 1982-06-07 1983-05-18 Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet SE8302798L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38561782A 1982-06-07 1982-06-07

Publications (2)

Publication Number Publication Date
SE8302798D0 true SE8302798D0 (sv) 1983-05-18
SE8302798L SE8302798L (sv) 1983-12-08

Family

ID=23522165

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8302798A SE8302798L (sv) 1982-06-07 1983-05-18 Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet

Country Status (14)

Country Link
JP (1) JPS591668A (sv)
AT (1) AT380902B (sv)
AU (1) AU541923B2 (sv)
BE (1) BE896977A (sv)
CA (1) CA1188458A (sv)
CH (1) CH655132A5 (sv)
DE (1) DE3320308C2 (sv)
DK (1) DK231783A (sv)
ES (1) ES8407520A1 (sv)
FR (1) FR2528073B1 (sv)
GB (1) GB2121444B (sv)
IT (1) IT1171818B (sv)
NL (1) NL8302029A (sv)
SE (1) SE8302798L (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050719A (en) * 1976-08-24 1977-09-27 Cunningham Walter F Color coded indexing system
WO1986001477A1 (en) * 1984-08-27 1986-03-13 Toyota Jidosha Kabushiki Kaisha Structure for supporting a steering column tube
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (de) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Saures Bad fuer das stromlose Abscheiden von Goldschichten
JPS6452082A (en) * 1987-06-22 1989-02-28 Gen Electric Electroless gold plating composition and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
DE10101375A1 (de) * 2001-01-13 2002-07-18 Forschungszentrum Juelich Gmbh Punktkontakte für Halbleiter und deren Herstellung
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
IT8348420A0 (it) 1983-06-03
GB2121444B (en) 1986-03-12
AT380902B (de) 1986-07-25
FR2528073B1 (fr) 1986-02-14
GB8315556D0 (en) 1983-07-13
CA1188458A (en) 1985-06-11
SE8302798L (sv) 1983-12-08
ES523032A0 (es) 1984-09-16
DE3320308A1 (de) 1983-12-08
NL8302029A (nl) 1984-01-02
DE3320308C2 (de) 1985-05-15
DK231783D0 (da) 1983-05-24
ATA193183A (de) 1985-12-15
DK231783A (da) 1983-12-08
ES8407520A1 (es) 1984-09-16
FR2528073A1 (fr) 1983-12-09
JPS591668A (ja) 1984-01-07
CH655132A5 (de) 1986-03-27
AU1486083A (en) 1983-12-15
IT1171818B (it) 1987-06-10
AU541923B2 (en) 1985-01-31
GB2121444A (en) 1983-12-21
BE896977A (fr) 1983-12-06

Similar Documents

Publication Publication Date Title
ES8305853A1 (es) Un metodo de disposicion no electrolitico para depositar oro sobre un sustrato.
SE8302798D0 (sv) Improved electroless gold plating
US4169171A (en) Bright electroless plating process and plated articles produced thereby
EP0866735A4 (en) USE OF PALLADIUM DIP COATING FOR SELECTIVE INITIATION OF THE ELECTRICITY COATING OF TI AND W ALLOYS FOR WAFER PRODUCTION
GB2164063B (en) Selective electroless deposition on insulating substrates
FR2442278A2 (fr) Composition et procede pour depot continu et non electrolytique de cuivre, a l'aide d'un hypophosphite comme reducteur et en presence d'ions cobalt ou nickel
SE8203005L (sv) Elektrofri legeringspletering
ES8307932A1 (es) Un metodo para formar un revestimiento de oro sobre un sustrato.
EP0747507A4 (sv)
JP2833026B2 (ja) 無電解錫めっき方法
TW583349B (en) Method for enhancing the solderability of a surface
US5035744A (en) Electroless gold plating solution
JPS56156749A (en) Chemical copper plating solution
CA2076088C (en) Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US4474838A (en) Electroless direct deposition of gold on metallized ceramics
US4228201A (en) Method for rendering a non-platable semiconductor substrate platable
US4419390A (en) Method for rendering non-platable semiconductor substrates platable
Mallory The electroless nickel plating bath
GB1322203A (en) Method of electroless plating of gold
GB1058915A (en) Autocatalytic metal plating
JPS57120664A (en) Formation of nickel film
Rajagopal et al. Plating on magnesium alloy
GB1260390A (en) Method of electrolessly nickel plating a substrate
JP2000239852A (ja) 銅パターンの選択的活性化方法およびこれに用いる活性化剤
JPS56136970A (en) Chemical copper plating bath

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8302798-7

Effective date: 19880519