SE7702273L - Forfarande for pakittning av halvledarskivor - Google Patents

Forfarande for pakittning av halvledarskivor

Info

Publication number
SE7702273L
SE7702273L SE7702273A SE7702273A SE7702273L SE 7702273 L SE7702273 L SE 7702273L SE 7702273 A SE7702273 A SE 7702273A SE 7702273 A SE7702273 A SE 7702273A SE 7702273 L SE7702273 L SE 7702273L
Authority
SE
Sweden
Prior art keywords
cementing
discs
temperatures
resin
salmon
Prior art date
Application number
SE7702273A
Other languages
English (en)
Inventor
D Schmidt
B Meissner
H-J Rath
D Regler
J Voss
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of SE7702273L publication Critical patent/SE7702273L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SE7702273A 1976-03-01 1977-03-01 Forfarande for pakittning av halvledarskivor SE7702273L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2608427A DE2608427C2 (de) 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben

Publications (1)

Publication Number Publication Date
SE7702273L true SE7702273L (sv) 1977-09-02

Family

ID=5971267

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7702273A SE7702273L (sv) 1976-03-01 1977-03-01 Forfarande for pakittning av halvledarskivor

Country Status (10)

Country Link
US (1) US4300965A (sv)
JP (1) JPS52106683A (sv)
BE (1) BE851892A (sv)
CA (1) CA1075579A (sv)
DE (1) DE2608427C2 (sv)
FR (1) FR2343330A1 (sv)
GB (1) GB1505488A (sv)
IT (1) IT1083481B (sv)
NL (1) NL7614209A (sv)
SE (1) SE7702273L (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
US4530138A (en) * 1982-09-30 1985-07-23 Westinghouse Electric Corp. Method of making a transducer assembly
US4517041A (en) * 1982-09-30 1985-05-14 Magnetic Peripherals Inc. Method for attaching a workpiece to a workpiece carrier
DE3670178D1 (de) * 1986-08-13 1990-05-10 Toshiba Kawasaki Kk Apparat zum zusammenfuegen von halbleiterscheiben.
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
DE10052293A1 (de) * 2000-10-20 2002-04-25 B L E Lab Equipment Gmbh Verfahren zum Aufbringen eines Substrats

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1950468A (en) * 1930-04-18 1934-03-13 Nat Aniline & Chem Co Inc Alkyd resinous composition
US2394689A (en) * 1944-01-07 1946-02-12 American Viscose Corp Method of dyeing
US3335087A (en) * 1965-12-20 1967-08-08 Pennsalt Chemical Corp Method of stripping resins
US3452133A (en) * 1966-03-07 1969-06-24 Schjeldahl Co G T Annealing of metal-plastic laminates
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements
US3586559A (en) * 1968-07-01 1971-06-22 Rohr Corp Method of temporarily securing a workpiece to a workholder
JPS5121334B2 (sv) * 1971-08-27 1976-07-01
DE2247067C3 (de) * 1972-09-26 1979-08-09 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece

Also Published As

Publication number Publication date
JPS5641167B2 (sv) 1981-09-26
DE2608427C2 (de) 1984-07-19
NL7614209A (nl) 1977-09-05
BE851892A (fr) 1977-08-29
GB1505488A (en) 1978-03-30
FR2343330B1 (sv) 1978-10-20
FR2343330A1 (fr) 1977-09-30
JPS52106683A (en) 1977-09-07
US4300965A (en) 1981-11-17
IT1083481B (it) 1985-05-21
DE2608427A1 (de) 1977-09-08
CA1075579A (en) 1980-04-15

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