SE457677B - Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort - Google Patents

Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort

Info

Publication number
SE457677B
SE457677B SE8106889A SE8106889A SE457677B SE 457677 B SE457677 B SE 457677B SE 8106889 A SE8106889 A SE 8106889A SE 8106889 A SE8106889 A SE 8106889A SE 457677 B SE457677 B SE 457677B
Authority
SE
Sweden
Prior art keywords
component
foil
windows
connection points
film
Prior art date
Application number
SE8106889A
Other languages
English (en)
Other versions
SE8106889L (sv
Inventor
J Hoppe
Y Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803046192 external-priority patent/DE3046192A1/de
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8106889L publication Critical patent/SE8106889L/sv
Publication of SE457677B publication Critical patent/SE457677B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)

Description

457 677 filmen omkring fönsterområdet. Härigenom kan mikropack- gar i nödfall även för hand inlödas i t.ex. av konventionell art. anordnin- tryckta kopplingar På senaste tiden har man även föreslagit att inbygga kapslade komponenter av ovannämnd art t.ex. i identifieringskort eller liknande databärare. Härvid måste hänsyn tagas till att identi- fieringskort under sin dagliga användning utsättes för kraftiga påkänningar, så att så små dimensioner som möjligt bör eftersträ- kontaktytorna på filmen, från början vara utformade på sådant sät taktgivning t.ex. med kontaktstift blir möjlig, vas. Å andra sidan bör som uppbär kompo- nenten, t, attdirekt kon- när kortet använ- des i automater.
Eftersom kontaktytorna, som vid galvanisk kontaktgivning i en auto- mat måste ha en minsta yta av 1-2 mmz, i detta fall är anordnade omkring fönsterområdet, har hela anordningen motsvarande avsevärt större dimensioner än den egentliga integrerade-kretskomponenten.
Uppfinningen är baserad på uppgiften att utveckla ett bärelement för integrerade-kretskomponenter eller IC- komponenter, som har mindre, till komponenten bättre anpassade dimensioner än hittills kända anordningar.
Denna uppgift löses med en anordning av ifrågavarande slag som ut- märkes av att kontaktytorna på nämnda ena sida av folien ligger i kontur motsvarar konturen av IC- andra sida . huvudsak inom ett område, vars komponten invid foliens nämnda Till följd av lösningen enligt uppfinningen erhålles kompakta och till komponentens dimensioner anpassade, filmburna bärelement, som med fördel kan användas i samtliga fall, då endast mycket små inbyggnadsytor står till förfogande. Till följd av bärelementets små dimensioner erhålles enbart liten angreppsyta gentemot meka- niska påkänningar. Av denna orsak är elementen särskilt lämpade för inbyggnad i bärare såsom identifieringskort, som utsättes för kraftiga mekaniska pàkänningar vid användning. 457 677 Uppfinningen beskrives närmare nedan i exempelform med ledning sv åtföljande ritning, där fig. 1 visar en anordning enligt uppfin- ningen sedd uppifrån, fig. 2 den i fig. 1 visade anordningen i tvärsnitt och fig. 3-6 ytterligare utföringsformer av uppfinningen.
Vid den i fig. 1 och 2 visade utföringsformen är den integrerade- kretskomponenten 6 monterad pà en filmremsa 1. Perforeringen 2, som vanligen föreligger vid filmremsor, t.ex. super-8-filmer, kan användas för transport av filmen under bärelementets tillverknings- faser- På filmremsan är kontaktytor 4 anordnade, vars ledarbanän- dar 7 är förbundna med motsvarande anslutningspunkter 8 på kom- ponenten 6 (se även fig. 2). Kontaktytorna 4 är anordnade på så- dant sätt och deras ytutbredning är vald på sådant sätt, att di- rekt kontaktgivning t.ex. med lämpliga kontaktstift är möjlig un- der anslutningen av bärelementet till en elektrisk apparat. Ledar- banändarna 7 är anordnade över fönster 3, som är utstansade från filmen 1. Vid en särskilt lämplig utföringsform har fönstren 3 sådan form, att ledarban/ändarna fribärande sträcker'sig in i fönsteromrâdet 3 och därmed kan förbindas genom fönstren under kontaktgivningen med komponenten.
För framställning av bärelementet undergår filmen 1 under ett förs- ta arbetsmoment ett stansförlopp på regelbundna avstånd, varvid t.ex. det i fig. 1 visade mönstret med fönstren 3 uppnås. Efter- åt belägges filmen på ena sidan med ett ledande skikt, ur vil- ket enligt kända metoder de för komponentens montering nödvändi- ga ledarbanorna 4, 7 etsas.
Vid den visade utföringsformen är ledarbanorna etsade med sådan form, att över komponentens yta innanför dess kontur kontaktytor- na uppkommer på filmen 1 jämte ledarbanorna 7, som över de utstan- sade fönstren skall förbindas med komponenten.
I och för färdigställande av bärelementet föres ledarbanändarna 7 genom de utstansade fönstren 3 i filmen till anslutningspunkter- na 8 på komponenten 6 och förbindes med dessa genom lödning.
Såsom framgår av fig. 2 kan komponenten hållas flexibel på ett visst avstånd från filmen 1 för kontaktgivning. Om i det senare 457 677 fallet endast litet inbyggnadsdjup står till förfogande för bär- elementet, förbindes komponenten 6 med ledarbanändarna genom fast- limning direkt anliggande mot filmen.
Vid de i fig. 3 och 4 visade bärelementen förberedes kontaktytor- nas ledarbanändar på sådant sätt, att även montering av integre- rade-kretskomponenter blir möjlig med anslutningspunkter, som be- finner sig närmare varandra än vid de första utföringsformerna.
Vid den i fig. 3 visade utföringsformen böjes ledarbanändarna 10 före komponentens 11 kontaktgivning genom de utstansade fönstren 3 till filmens frân kontaktytorna 4 vända sida. Komponentens 11 anslutningspunkter 8 förbindes då med de omböjda banändarna 10.
Vid den i fig. 4 visade utföringsformen böjes banändarna 10 ge- nom de i filmen utstansade fönstren 3 omkring komponenten och för- bindes därefter med komponentens anslutningspunkter. kan före böjningsförloppet fastsättas på filmen 1 med lämpligt bindemedel 12.
Komponenten elst ett Pig. 5 visar en utföringsform av bärelementet enligt uppfinningen, vid vilken komponenten 11 är fastsatt genom limning.
I detta fall förbindes komponentens 11 anslutningspunkter 8 via fi na gulåtrâ- dar 15 genom fönstren 3 i filmen med kontaktytornas l edarbanändar. vid denna utföringsform kan t.ex _ enligt fig. 5 den genom de ut- stansade fönstren 3 utskjutande formen för banändarna 10 vara an- vändbar.
Fig. 6 visar en utföringsform av bärelementet enligt uppfinningen, vid vilken en komponent 11 finnes, som på fram- och baksidan är 8b. De tillämpade teknikerna för kontaktgivning har beskrivits med ledning av fig. 2 och 3. försedd med anslutningspunkter 8a, Förutom möjligheterna att bortetsa kontaktytorna från en ledande filmbeläggning är det även känt att framställa elementen oberoen- de av bärare och film under ett särskilt förlopp i form av ett spindelliknande mönster. Mönstret med ledarbanändarna och kontakt- ytorna fastsättes först under kontaktgivningsförloppet t.ex. me- 457 677 delst ett bindemedel på filmen. Under samma arbetsförlopp kan ledarbanändarna såsom förklarats med ledning av de visade figu- rerna förbindas med komponentens motsvarande anslutningspunkter.
Vid ovannämnda förfaringssätt framställes samtliga kontaktytor och tillhörande banändar gemensamt, eftersom de utgör element i ett gemensamt mönster. Å andra sidan är det även möjligt att fram- ställa elementen (kontaktyta med ledarbana) enskilt och framstäl- la dessa enligt uppfinningen. Elementen kan i detta fall utstan- sas från ledande material, som eventuellt är förbundet med bär- filmen, t.ex. enligt etiketteringsprincipen.

Claims (6)

10 15 20 25 30 35 457 677 Patentkrav
1. Anordning vid ett en IC-komponent uppbärande folieelement, särskilt för identifieringskort, innefattande en grupp elektriska kontaktytor på ena sidan av det bärande foli IC-komponenten är anbragt invid foliens andr taktytorna är elektriskt förbundna med respektive anslutnings- Punktef h0S IC"k0mPOnäfien medelst ledarbanor, genom fönster i folien, eelementet, medan a sida, varvid kon- som sträcker sig k ä n n e t e c k n a d av att kontakt- ytorna (4) på nämnda ena sida av folien (1) ligger i huvudsak inom ett område, vars kontur motsvarar konturen av IC-komponen- ten (6, 11) invid foliens nämnda andra sida.
2. Anordning enligt krav 1, k ä n n e t e c k n a d av att le- darbanornas ändar (7) genom fönstret (3) är direkt förbundna med inom fönstrens (3) omrâde belägna anslutningspunkter (8)
3. Anordning enligt krav 1, k ä n n e t e c k n a d av att le- darbanändarna (10) täcker fönstrens (3) yta och att ans punkterna (8) via fina guldtrådar (15) är förbundna med (10) undersida medelst ett bindemedel. lutnings- ändarnas
4. Anordning enligt krav 1, knä n n e t e c k n a d av att le- darbanändarna (10) är böjda genom fönstren (3) på baksidan av den eventuellt på folien (1) fastlimmade komponenten (11) och förbundna med här befintliga anslutningspunkter (8).
5. Anordning enligt krav 1, k ä n n e t e c k n a d av att le- darbanändarna (10) är förda genom fönstren (3) mellan foliens undersida och komponentens översida och förbundna med de på den- na översida anordnade anslutningspunkterna (8).
6. Anordning enligt krav 1, k ä n n e t e c k n a d av att en del avledarbandändarna är böjda genom fönstren till anslutnings- punkter (Ba) på baksidan av den på folien fastlimmade komponenten (11) och att en del av dessa ändar är förd till omedelbart under. fönstren (3) befintliga anslutningspunkter (Bb).
SE8106889A 1980-11-21 1981-11-19 Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort SE457677B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3043877 1980-11-21
DE19803046192 DE3046192A1 (de) 1980-12-08 1980-12-08 Traegerelement fuer ic-bausteine

Publications (2)

Publication Number Publication Date
SE8106889L SE8106889L (sv) 1982-05-22
SE457677B true SE457677B (sv) 1989-01-16

Family

ID=25789226

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8106889A SE457677B (sv) 1980-11-21 1981-11-19 Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort

Country Status (7)

Country Link
US (1) US4549247A (sv)
CH (1) CH661816A5 (sv)
FR (1) FR2494908B1 (sv)
GB (1) GB2088630B (sv)
IT (1) IT1139726B (sv)
NL (1) NL189937C (sv)
SE (1) SE457677B (sv)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
US4713730A (en) * 1985-10-07 1987-12-15 Rockwell International Corporation Microwave plug-in signal amplifying module solderment apparatus
IL80683A0 (en) * 1985-12-20 1987-02-27 Hughes Aircraft Co Chip interface mesa
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP0339763A3 (en) * 1988-04-28 1990-04-25 Citizen Watch Co. Ltd. Ic card
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
KR930024126A (ko) * 1992-05-12 1993-12-22 아키라 기타하라 표면실장소자와 그의 반제품
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE19532755C1 (de) * 1995-09-05 1997-02-20 Siemens Ag Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls
DE19535775C2 (de) * 1995-09-26 2000-06-21 Siemens Ag Verfahren zum elektrischen Verbinden eines Kontaktfeldes eines Halbleiterchips mit zumindest einer Kontaktfläche sowie danach hergestellte Chipkarte
WO1997044823A1 (de) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
DE19635732A1 (de) * 1996-09-03 1998-03-05 Siemens Ag Trägerelement für einen Halbleiterchip
DE19840248A1 (de) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Schaltungschip mit spezifischer Anschlußflächenanordnung
DE102005044001B3 (de) * 2005-09-14 2007-04-12 W.C. Heraeus Gmbh Laminiertes Substrat für die Montage von elektronischen Bauteilen
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés
US3649950A (en) * 1970-01-27 1972-03-14 Amp Inc Post connector and assembly
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente
US4177519A (en) * 1975-07-28 1979-12-04 Sharp Kabushiki Kaisha Electronic control assembly mounted on a flexible carrier and manufacture thereof
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
FR2382101A1 (fr) * 1977-02-28 1978-09-22 Labo Electronique Physique Dispositif a semi-conducteur, comportant des pattes metalliques isolees
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein

Also Published As

Publication number Publication date
IT8125059A0 (it) 1981-11-13
SE8106889L (sv) 1982-05-22
FR2494908B1 (fr) 1986-12-26
US4549247A (en) 1985-10-22
NL189937C (nl) 1993-09-01
CH661816A5 (de) 1987-08-14
IT1139726B (it) 1986-09-24
GB2088630A (en) 1982-06-09
GB2088630B (en) 1985-02-13
NL189937B (nl) 1993-04-01
NL8105002A (nl) 1982-06-16
FR2494908A1 (fr) 1982-05-28

Similar Documents

Publication Publication Date Title
SE457677B (sv) Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort
US4709254A (en) Carrier element for an IC module
US5023751A (en) Method of producing a tape for providing electronic modules, and tape obtained by this method
US4859614A (en) Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet
GB2140207A (en) Assemblies of an ic module and a carrier
SE461693B (sv) Foerfarande foer framstaellning av en databaerare
US5061988A (en) Integrated circuit chip interconnect
JPS62111794A (ja) 素子を備えるカ−ド及び側面にコンタクトを備えるマイクロモジユ−ル
IE56411B1 (en) Integrated circuit chip carrier
US20030015791A1 (en) Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
JP2000505923A (ja) 多数の坦体素子が形成される帯状体又はパネルを形成する非導電性基板
EP0526992B1 (en) Multilayer carrier for mounting an integrated circuit and method of making the same
US4985748A (en) Universal tape for use in tape automated bonding system
JP3978730B2 (ja) 導電性ブリッジを含む電子回路およびこの種のブリッジを製造する方法
CN106233386A (zh) 布线电路基板
US6179659B1 (en) Electrical contact device and associated method of manufacture
EP0493870B1 (en) A TAB package and a liquid-crystal panel unit using the same
US4563811A (en) Method of making a dual-in-line package
US5270570A (en) Lead frame for a multiplicity of terminals
JP2002511196A (ja) 集積回路用基板として用いられるホイル
JP2872421B2 (ja) Ｔａｂ用テープキャリア
JPS6354219B2 (sv)
JPS60161693A (ja) プリント基板
JPS60182147A (ja) ワイヤボンデイング方法
JP2822446B2 (ja) 混成集積回路装置

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 8106889-2

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 8106889-2

Format of ref document f/p: F