FR1534329A - Procédé de montage de circuits intégrés - Google Patents
Procédé de montage de circuits intégrésInfo
- Publication number
- FR1534329A FR1534329A FR117930A FR117930A FR1534329A FR 1534329 A FR1534329 A FR 1534329A FR 117930 A FR117930 A FR 117930A FR 117930 A FR117930 A FR 117930A FR 1534329 A FR1534329 A FR 1534329A
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- assembly process
- circuit assembly
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR117930A FR1534329A (fr) | 1966-08-16 | 1967-08-16 | Procédé de montage de circuits intégrés |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57272066A | 1966-08-16 | 1966-08-16 | |
US61897367A | 1967-02-27 | 1967-02-27 | |
FR117930A FR1534329A (fr) | 1966-08-16 | 1967-08-16 | Procédé de montage de circuits intégrés |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1534329A true FR1534329A (fr) | 1968-07-26 |
Family
ID=27244430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR117930A Expired FR1534329A (fr) | 1966-08-16 | 1967-08-16 | Procédé de montage de circuits intégrés |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1534329A (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2088564A1 (fr) * | 1970-05-14 | 1972-01-07 | Siemens Ag | |
FR2156343A1 (fr) * | 1971-10-14 | 1973-05-25 | Philips Nv | |
FR2196570A1 (fr) * | 1972-06-14 | 1974-03-15 | Ibm | |
DE2554965A1 (de) * | 1974-12-20 | 1976-07-01 | Ibm | Elektrische kompaktschaltungsanordnung |
FR2494908A1 (fr) * | 1980-11-21 | 1982-05-28 | Gao Ges Automation Org | Element support pour modules de circuit integre |
FR2535110A1 (fr) * | 1982-10-20 | 1984-04-27 | Radiotechnique Compelec | Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides |
EP0148083A2 (fr) * | 1983-12-23 | 1985-07-10 | Fujitsu Limited | Dispositif semi-conducteur à circuit intégré à vitesse ultra-rapide ayant un support de connexion à multi-couche |
EP0526147A2 (fr) * | 1991-07-25 | 1993-02-03 | Nec Corporation | Dispositif semi-conducteur du type à bande de support et procédé de sa fabrication |
-
1967
- 1967-08-16 FR FR117930A patent/FR1534329A/fr not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2088564A1 (fr) * | 1970-05-14 | 1972-01-07 | Siemens Ag | |
FR2156343A1 (fr) * | 1971-10-14 | 1973-05-25 | Philips Nv | |
FR2196570A1 (fr) * | 1972-06-14 | 1974-03-15 | Ibm | |
DE2554965A1 (de) * | 1974-12-20 | 1976-07-01 | Ibm | Elektrische kompaktschaltungsanordnung |
FR2494908A1 (fr) * | 1980-11-21 | 1982-05-28 | Gao Ges Automation Org | Element support pour modules de circuit integre |
FR2535110A1 (fr) * | 1982-10-20 | 1984-04-27 | Radiotechnique Compelec | Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides |
EP0148083A2 (fr) * | 1983-12-23 | 1985-07-10 | Fujitsu Limited | Dispositif semi-conducteur à circuit intégré à vitesse ultra-rapide ayant un support de connexion à multi-couche |
EP0148083A3 (en) * | 1983-12-23 | 1986-10-08 | Fujitsu Limited | Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board |
US4751482A (en) * | 1983-12-23 | 1988-06-14 | Fujitsu Limited | Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection |
EP0526147A2 (fr) * | 1991-07-25 | 1993-02-03 | Nec Corporation | Dispositif semi-conducteur du type à bande de support et procédé de sa fabrication |
EP0526147A3 (en) * | 1991-07-25 | 1993-08-18 | Nec Corporation | Film-carrier type semiconductor device and process for fabricating the same |
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