SE300131B - - Google Patents
Info
- Publication number
- SE300131B SE300131B SE10560/61A SE1056061A SE300131B SE 300131 B SE300131 B SE 300131B SE 10560/61 A SE10560/61 A SE 10560/61A SE 1056061 A SE1056061 A SE 1056061A SE 300131 B SE300131 B SE 300131B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49009—Dynamoelectric machine
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49119—Brush
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacture Of Motors, Generators (AREA)
- Windings For Motors And Generators (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66997A US3148098A (en) | 1960-11-03 | 1960-11-03 | Method of producing electrical components |
Publications (1)
Publication Number | Publication Date |
---|---|
SE300131B true SE300131B (es) | 1968-04-08 |
Family
ID=22073073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE10560/61A SE300131B (es) | 1960-11-03 | 1961-10-24 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3148098A (es) |
CH (1) | CH400271A (es) |
DK (1) | DK109155C (es) |
ES (1) | ES271471A1 (es) |
GB (1) | GB980706A (es) |
SE (1) | SE300131B (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3234060A (en) * | 1961-06-15 | 1966-02-08 | Sperry Rand Corp | Method of fabricating a laminated printed circuit structure |
US3330032A (en) * | 1965-11-24 | 1967-07-11 | Photocircuits Corp | Method of producing electrical components |
DE1615969B1 (de) * | 1967-06-09 | 1971-03-18 | Diehl Fa | Kontaktstueck |
US3619285A (en) * | 1969-12-10 | 1971-11-09 | Rca Corp | Method of making a patterned metal film article |
US3923566A (en) * | 1972-06-21 | 1975-12-02 | Rca Corp | Method of fabricating an apertured mask for a cathode-ray tube |
US4235664A (en) * | 1979-06-29 | 1980-11-25 | Hutchinson Industrial Corporation | Unitary type-carrier elements and method of making same |
GB2149580B (en) * | 1983-11-08 | 1987-03-11 | Standard Telephones Cables Ltd | Printed circuit production |
US5528001A (en) * | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
US5950305A (en) * | 1992-02-14 | 1999-09-14 | Research Organization For Circuit Knowledge | Environmentally desirable method of manufacturing printed circuits |
US5584120A (en) * | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
US5343616B1 (en) * | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
US6083837A (en) * | 1996-12-13 | 2000-07-04 | Tessera, Inc. | Fabrication of components by coining |
DE102005049235B4 (de) * | 2004-10-20 | 2009-07-09 | Panasonic Corp., Kadoma | Schalter und Verfahren zum Herstellen desselben |
CN112770516A (zh) * | 2020-12-12 | 2021-05-07 | 盐城华昱光电技术有限公司 | 一种生产高密度双面和多层印制电路板的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2974284A (en) * | 1961-03-07 | Rotors for electrical indicating instruments | ||
US2427144A (en) * | 1936-11-23 | 1947-09-09 | Jansen Franciscus Jo Wilhelmus | Mechanical connection for electrical circuits |
US2695351A (en) * | 1950-01-12 | 1954-11-23 | Beck S Inc | Electric circuit components and methods of preparing the same |
US2781849A (en) * | 1952-03-25 | 1957-02-19 | Hartford Nat Bank & Trust Co | Method of forming small apertures in thin metal plate-shaped articles |
US2777192A (en) * | 1952-12-03 | 1957-01-15 | Philco Corp | Method of forming a printed circuit and soldering components thereto |
US2943966A (en) * | 1953-12-30 | 1960-07-05 | Int Standard Electric Corp | Printed electrical circuits |
US2772501A (en) * | 1956-05-31 | 1956-12-04 | Robert J Malcolm | Method of manufacturing electrical circuit components |
US2937358A (en) * | 1955-04-18 | 1960-05-17 | Gen Electric | Printed circuit sandwiched in glass |
US2988839A (en) * | 1956-06-13 | 1961-06-20 | Rogers Corp | Process for making a printed circuit |
US2898521A (en) * | 1956-09-28 | 1959-08-04 | Cyrus J Creveling | Electric circuit component |
US2990310A (en) * | 1960-05-11 | 1961-06-27 | Burroughs Corp | Laminated printed circuit board |
-
1960
- 1960-11-03 US US66997A patent/US3148098A/en not_active Expired - Lifetime
-
1961
- 1961-10-17 GB GB37145/61A patent/GB980706A/en not_active Expired
- 1961-10-24 SE SE10560/61A patent/SE300131B/xx unknown
- 1961-10-24 ES ES271471A patent/ES271471A1/es not_active Expired
- 1961-10-27 CH CH1249461A patent/CH400271A/de unknown
- 1961-11-01 DK DK433761AA patent/DK109155C/da active
Also Published As
Publication number | Publication date |
---|---|
DK109155C (da) | 1968-03-25 |
US3148098A (en) | 1964-09-08 |
GB980706A (en) | 1965-01-20 |
CH400271A (de) | 1965-10-15 |
ES271471A1 (es) | 1962-03-16 |