ES271471A1 - Un procedimiento para la producción de componentes eléctricos con proporciones eléctricamente conductoras - Google Patents

Un procedimiento para la producción de componentes eléctricos con proporciones eléctricamente conductoras

Info

Publication number
ES271471A1
ES271471A1 ES271471A ES271471A ES271471A1 ES 271471 A1 ES271471 A1 ES 271471A1 ES 271471 A ES271471 A ES 271471A ES 271471 A ES271471 A ES 271471A ES 271471 A1 ES271471 A1 ES 271471A1
Authority
ES
Spain
Prior art keywords
translation
production
machine
electrical components
legally binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES271471A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES271471A1 publication Critical patent/ES271471A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49009—Dynamoelectric machine
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Windings For Motors And Generators (AREA)
ES271471A 1960-11-03 1961-10-24 Un procedimiento para la producción de componentes eléctricos con proporciones eléctricamente conductoras Expired ES271471A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US66997A US3148098A (en) 1960-11-03 1960-11-03 Method of producing electrical components

Publications (1)

Publication Number Publication Date
ES271471A1 true ES271471A1 (es) 1962-03-16

Family

ID=22073073

Family Applications (1)

Application Number Title Priority Date Filing Date
ES271471A Expired ES271471A1 (es) 1960-11-03 1961-10-24 Un procedimiento para la producción de componentes eléctricos con proporciones eléctricamente conductoras

Country Status (6)

Country Link
US (1) US3148098A (es)
CH (1) CH400271A (es)
DK (1) DK109155C (es)
ES (1) ES271471A1 (es)
GB (1) GB980706A (es)
SE (1) SE300131B (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3234060A (en) * 1961-06-15 1966-02-08 Sperry Rand Corp Method of fabricating a laminated printed circuit structure
US3330032A (en) * 1965-11-24 1967-07-11 Photocircuits Corp Method of producing electrical components
DE1615969B1 (de) * 1967-06-09 1971-03-18 Diehl Fa Kontaktstueck
US3619285A (en) * 1969-12-10 1971-11-09 Rca Corp Method of making a patterned metal film article
US3923566A (en) * 1972-06-21 1975-12-02 Rca Corp Method of fabricating an apertured mask for a cathode-ray tube
US4235664A (en) * 1979-06-29 1980-11-25 Hutchinson Industrial Corporation Unitary type-carrier elements and method of making same
GB2149580B (en) * 1983-11-08 1987-03-11 Standard Telephones Cables Ltd Printed circuit production
US5950305A (en) * 1992-02-14 1999-09-14 Research Organization For Circuit Knowledge Environmentally desirable method of manufacturing printed circuits
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
US5528001A (en) * 1992-02-14 1996-06-18 Research Organization For Circuit Knowledge Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US6083837A (en) * 1996-12-13 2000-07-04 Tessera, Inc. Fabrication of components by coining
DE102005049235B4 (de) * 2004-10-20 2009-07-09 Panasonic Corp., Kadoma Schalter und Verfahren zum Herstellen desselben
CN112770516A (zh) * 2020-12-12 2021-05-07 盐城华昱光电技术有限公司 一种生产高密度双面和多层印制电路板的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2974284A (en) * 1961-03-07 Rotors for electrical indicating instruments
US2427144A (en) * 1936-11-23 1947-09-09 Jansen Franciscus Jo Wilhelmus Mechanical connection for electrical circuits
US2695351A (en) * 1950-01-12 1954-11-23 Beck S Inc Electric circuit components and methods of preparing the same
US2781849A (en) * 1952-03-25 1957-02-19 Hartford Nat Bank & Trust Co Method of forming small apertures in thin metal plate-shaped articles
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
US2943966A (en) * 1953-12-30 1960-07-05 Int Standard Electric Corp Printed electrical circuits
US2772501A (en) * 1956-05-31 1956-12-04 Robert J Malcolm Method of manufacturing electrical circuit components
US2937358A (en) * 1955-04-18 1960-05-17 Gen Electric Printed circuit sandwiched in glass
US2988839A (en) * 1956-06-13 1961-06-20 Rogers Corp Process for making a printed circuit
US2898521A (en) * 1956-09-28 1959-08-04 Cyrus J Creveling Electric circuit component
US2990310A (en) * 1960-05-11 1961-06-27 Burroughs Corp Laminated printed circuit board

Also Published As

Publication number Publication date
GB980706A (en) 1965-01-20
DK109155C (da) 1968-03-25
CH400271A (de) 1965-10-15
US3148098A (en) 1964-09-08
SE300131B (es) 1968-04-08

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