RU93054775A - Способ пайки - Google Patents

Способ пайки

Info

Publication number
RU93054775A
RU93054775A RU93054775/08A RU93054775A RU93054775A RU 93054775 A RU93054775 A RU 93054775A RU 93054775/08 A RU93054775/08 A RU 93054775/08A RU 93054775 A RU93054775 A RU 93054775A RU 93054775 A RU93054775 A RU 93054775A
Authority
RU
Russia
Prior art keywords
laser light
soldering
light beams
probe
radiate
Prior art date
Application number
RU93054775/08A
Other languages
English (en)
Other versions
RU2095206C1 (ru
Inventor
Дайкузоно Норио
Original Assignee
С.Л.Т. Джапан Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by С.Л.Т. Джапан Ко., Лтд. filed Critical С.Л.Т. Джапан Ко., Лтд.
Priority claimed from PCT/JP1992/000032 external-priority patent/WO1993013903A1/ja
Publication of RU93054775A publication Critical patent/RU93054775A/ru
Application granted granted Critical
Publication of RU2095206C1 publication Critical patent/RU2095206C1/ru

Links

Claims (1)

  1. Способ пайки электронных компонент одна к другой заключается в следующем. Когда элемент, подлежащий соединению, припаивается к материалу основания путем облучения элемента, подлежащего соединению, лазерными световыми пучками, лазерные световые пучки падают на передающий лазерный свет пробник и излучаются от переднего конца пробника, который в основном контактирует с припоем или элементом, подлежащим соединению.
RU9293054775A 1992-01-17 1992-01-17 Способ пайки RU2095206C1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP92/00032 1992-01-17
PCT/JP1992/000032 WO1993013903A1 (fr) 1992-01-17 1992-01-17 Procede de brasage

Publications (2)

Publication Number Publication Date
RU93054775A true RU93054775A (ru) 1996-02-27
RU2095206C1 RU2095206C1 (ru) 1997-11-10

Family

ID=14042129

Family Applications (1)

Application Number Title Priority Date Filing Date
RU9293054775A RU2095206C1 (ru) 1992-01-17 1992-01-17 Способ пайки

Country Status (7)

Country Link
US (1) US5272310A (ru)
EP (1) EP0584356B1 (ru)
KR (1) KR970004225B1 (ru)
AU (1) AU662893B2 (ru)
DE (2) DE69211850T2 (ru)
RU (1) RU2095206C1 (ru)
WO (1) WO1993013903A1 (ru)

Families Citing this family (18)

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Publication number Priority date Publication date Assignee Title
US6227436B1 (en) * 1990-02-19 2001-05-08 Hitachi, Ltd. Method of fabricating an electronic circuit device and apparatus for performing the method
US6471115B1 (en) 1990-02-19 2002-10-29 Hitachi, Ltd. Process for manufacturing electronic circuit devices
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
US5847356A (en) * 1996-08-30 1998-12-08 Hewlett-Packard Company Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system
US6286746B1 (en) * 1997-08-28 2001-09-11 Axya Medical, Inc. Fused loop of filamentous material and apparatus for making same
US6758610B2 (en) 2001-12-10 2004-07-06 Jds Uniphase Corporation Optical component attachment to optoelectronic packages
KR100688507B1 (ko) * 2004-12-08 2007-03-02 삼성전자주식회사 반도체 칩 검사 장치 및 이를 이용한 반도체 칩 검사 방법
EP2007289A2 (en) * 2006-04-18 2008-12-31 Axya Medical, Inc Multicomponent fused suture loop and apparatus for making same
DE102008002910A1 (de) * 2008-06-26 2010-01-07 Reis Lasertec Gmbh Verfahren und Vorrichtung zum Verbinden von Bauteilen mittels Laserstrahlung
DE102009017659A1 (de) 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
JP2013219404A (ja) * 2013-08-02 2013-10-24 Sumida Corporation アンテナ部品の製造方法
DE102015013312B4 (de) 2015-10-13 2023-06-15 Hochschule Mittweida (Fh) Verfahren und Einrichtung zum schnellen stoffschlüssigen Löten von Körpern odervon Schichten oder von Körpern und Schichten mit Laserstrahlen
EP3340287B1 (en) * 2016-12-23 2020-10-28 Huawei Technologies Co., Ltd. Pattern-based temperature measurement for a bonding device and a bonding system
RU183152U1 (ru) * 2017-11-07 2018-09-12 ООО "Евроинтех" Установка для лазерной пайки
KR102480461B1 (ko) * 2017-11-30 2022-12-21 쌩-고벵 글래스 프랑스 차량용 창유리의 터미널 솔더링 장치 및 방법
DE102019124334A1 (de) * 2019-09-11 2021-03-11 Hesse Gmbh Bondanordnung und Bondwerkzeug
DE102020102938A1 (de) * 2020-02-05 2021-08-05 Marelli Automotive Lighting Reutlingen (Germany) GmbH Schaltungsträgerplatte und Verfahren zum Herstellen einer Schaltungsträgerplatte
CN114260649B (zh) * 2021-12-09 2024-03-12 扬州盛威封头有限公司 封头温压成型工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3304403A (en) * 1963-10-14 1967-02-14 Texas Instruments Inc Laser welding of contacts
US3463898A (en) * 1965-07-09 1969-08-26 Tokyo Shibaura Electric Co Welding device utilizing laser beams
JPS58173093A (ja) * 1982-04-05 1983-10-11 Toshiba Corp ワイヤボンデイング方法
JPS5944669U (ja) * 1982-09-14 1984-03-24 富士通株式会社 レ−ザ−ボンデイングチツプ
US4736743A (en) * 1986-05-12 1988-04-12 Surgical Laser Technology, Inc. Vaporization contact laser probe
JPS6350867A (ja) * 1986-08-21 1988-03-03 Minolta Camera Co Ltd 静電潜像現像剤用キヤリア
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US4906812A (en) * 1988-12-22 1990-03-06 General Electric Company Fiber optic laser joining apparatus
JPH02213075A (ja) * 1989-02-14 1990-08-24 Matsushita Electric Ind Co Ltd リードの接合方法
US4970365A (en) * 1989-09-28 1990-11-13 International Business Machines Corporation Method and apparatus for bonding components leads to pads located on a non-rigid substrate

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