RU93054775A - Способ пайки - Google Patents
Способ пайкиInfo
- Publication number
- RU93054775A RU93054775A RU93054775/08A RU93054775A RU93054775A RU 93054775 A RU93054775 A RU 93054775A RU 93054775/08 A RU93054775/08 A RU 93054775/08A RU 93054775 A RU93054775 A RU 93054775A RU 93054775 A RU93054775 A RU 93054775A
- Authority
- RU
- Russia
- Prior art keywords
- laser light
- soldering
- light beams
- probe
- radiate
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims 2
- 239000000523 sample Substances 0.000 claims 2
- 230000001678 irradiating Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Claims (1)
- Способ пайки электронных компонент одна к другой заключается в следующем. Когда элемент, подлежащий соединению, припаивается к материалу основания путем облучения элемента, подлежащего соединению, лазерными световыми пучками, лазерные световые пучки падают на передающий лазерный свет пробник и излучаются от переднего конца пробника, который в основном контактирует с припоем или элементом, подлежащим соединению.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP92/00032 | 1992-01-17 | ||
PCT/JP1992/000032 WO1993013903A1 (fr) | 1992-01-17 | 1992-01-17 | Procede de brasage |
Publications (2)
Publication Number | Publication Date |
---|---|
RU93054775A true RU93054775A (ru) | 1996-02-27 |
RU2095206C1 RU2095206C1 (ru) | 1997-11-10 |
Family
ID=14042129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU9293054775A RU2095206C1 (ru) | 1992-01-17 | 1992-01-17 | Способ пайки |
Country Status (7)
Country | Link |
---|---|
US (1) | US5272310A (ru) |
EP (1) | EP0584356B1 (ru) |
KR (1) | KR970004225B1 (ru) |
AU (1) | AU662893B2 (ru) |
DE (2) | DE69211850T2 (ru) |
RU (1) | RU2095206C1 (ru) |
WO (1) | WO1993013903A1 (ru) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6227436B1 (en) * | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
US5904868A (en) * | 1994-06-16 | 1999-05-18 | International Business Machines Corporation | Mounting and/or removing of components using optical fiber tools |
US5847356A (en) * | 1996-08-30 | 1998-12-08 | Hewlett-Packard Company | Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system |
US6286746B1 (en) * | 1997-08-28 | 2001-09-11 | Axya Medical, Inc. | Fused loop of filamentous material and apparatus for making same |
US6758610B2 (en) | 2001-12-10 | 2004-07-06 | Jds Uniphase Corporation | Optical component attachment to optoelectronic packages |
KR100688507B1 (ko) * | 2004-12-08 | 2007-03-02 | 삼성전자주식회사 | 반도체 칩 검사 장치 및 이를 이용한 반도체 칩 검사 방법 |
EP2007289A2 (en) * | 2006-04-18 | 2008-12-31 | Axya Medical, Inc | Multicomponent fused suture loop and apparatus for making same |
DE102008002910A1 (de) * | 2008-06-26 | 2010-01-07 | Reis Lasertec Gmbh | Verfahren und Vorrichtung zum Verbinden von Bauteilen mittels Laserstrahlung |
DE102009017659A1 (de) | 2009-04-16 | 2010-10-28 | Schott Ag | Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat |
JP2013219404A (ja) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | アンテナ部品の製造方法 |
DE102015013312B4 (de) | 2015-10-13 | 2023-06-15 | Hochschule Mittweida (Fh) | Verfahren und Einrichtung zum schnellen stoffschlüssigen Löten von Körpern odervon Schichten oder von Körpern und Schichten mit Laserstrahlen |
EP3340287B1 (en) * | 2016-12-23 | 2020-10-28 | Huawei Technologies Co., Ltd. | Pattern-based temperature measurement for a bonding device and a bonding system |
RU183152U1 (ru) * | 2017-11-07 | 2018-09-12 | ООО "Евроинтех" | Установка для лазерной пайки |
KR102480461B1 (ko) * | 2017-11-30 | 2022-12-21 | 쌩-고벵 글래스 프랑스 | 차량용 창유리의 터미널 솔더링 장치 및 방법 |
DE102019124334A1 (de) * | 2019-09-11 | 2021-03-11 | Hesse Gmbh | Bondanordnung und Bondwerkzeug |
DE102020102938A1 (de) * | 2020-02-05 | 2021-08-05 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Schaltungsträgerplatte und Verfahren zum Herstellen einer Schaltungsträgerplatte |
CN114260649B (zh) * | 2021-12-09 | 2024-03-12 | 扬州盛威封头有限公司 | 封头温压成型工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3304403A (en) * | 1963-10-14 | 1967-02-14 | Texas Instruments Inc | Laser welding of contacts |
US3463898A (en) * | 1965-07-09 | 1969-08-26 | Tokyo Shibaura Electric Co | Welding device utilizing laser beams |
JPS58173093A (ja) * | 1982-04-05 | 1983-10-11 | Toshiba Corp | ワイヤボンデイング方法 |
JPS5944669U (ja) * | 1982-09-14 | 1984-03-24 | 富士通株式会社 | レ−ザ−ボンデイングチツプ |
US4736743A (en) * | 1986-05-12 | 1988-04-12 | Surgical Laser Technology, Inc. | Vaporization contact laser probe |
JPS6350867A (ja) * | 1986-08-21 | 1988-03-03 | Minolta Camera Co Ltd | 静電潜像現像剤用キヤリア |
US4893742A (en) * | 1988-12-21 | 1990-01-16 | Hughes Aircraft Company | Ultrasonic laser soldering |
US4906812A (en) * | 1988-12-22 | 1990-03-06 | General Electric Company | Fiber optic laser joining apparatus |
JPH02213075A (ja) * | 1989-02-14 | 1990-08-24 | Matsushita Electric Ind Co Ltd | リードの接合方法 |
US4970365A (en) * | 1989-09-28 | 1990-11-13 | International Business Machines Corporation | Method and apparatus for bonding components leads to pads located on a non-rigid substrate |
-
1992
- 1992-01-17 DE DE69211850T patent/DE69211850T2/de not_active Expired - Fee Related
- 1992-01-17 EP EP92903329A patent/EP0584356B1/en not_active Expired - Lifetime
- 1992-01-17 KR KR1019930702220A patent/KR970004225B1/ko not_active IP Right Cessation
- 1992-01-17 DE DE0584356T patent/DE584356T1/de active Pending
- 1992-01-17 RU RU9293054775A patent/RU2095206C1/ru active
- 1992-01-17 AU AU11690/92A patent/AU662893B2/en not_active Ceased
- 1992-01-17 WO PCT/JP1992/000032 patent/WO1993013903A1/ja active IP Right Grant
- 1992-03-16 US US07/852,050 patent/US5272310A/en not_active Expired - Fee Related
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