JP2013219404A - アンテナ部品の製造方法 - Google Patents
アンテナ部品の製造方法 Download PDFInfo
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- JP2013219404A JP2013219404A JP2013161219A JP2013161219A JP2013219404A JP 2013219404 A JP2013219404 A JP 2013219404A JP 2013161219 A JP2013161219 A JP 2013161219A JP 2013161219 A JP2013161219 A JP 2013161219A JP 2013219404 A JP2013219404 A JP 2013219404A
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- solder layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
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- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
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- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48092—Helix
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/858—Bonding techniques
- H01L2224/85801—Soldering or alloying
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
【解決手段】コイル部品11の接続端部11aが半田層14に接するように、半導体基板12に対してコイル部品11を配線する工程と、半田層14を熱で溶かすことにより、接続端部11aの一部が半田層14に入り込むようにして、半田層14を介してパッド12aとコイル部品11とを電気的に接続する工程と、を経てコイル部品11と半導体基板12を接続してアンテナ部品10を形成するようにした。
【選択図】図4
Description
11 コイル部品(アンテナコイル)
11a 接続端部
12 半導体基板(ICチップ)
12a パッド(接続領域)
13 線材
14 半田層
15 芯線
16 絶縁被膜
20 引出線接続装置
T テンション
t 反力
Claims (5)
- コイル部品と半導体基板を有するアンテナ部品の製造方法であって、
絶縁被覆を有する線材により前記コイル部品を形成し、その両端部の絶縁被膜を除去する工程(A)と、
前記半導体基板の上面に導電性金属により接続領域を形成し、さらに前記接続領域の上面に半田層を形成する工程(B)と、
前記コイル部品の一部が前記半田層に接するように、前記コイル部品を前記接続領域上に配線する工程(C)と、
前記半田層を熱で溶かすことにより、前記両端部を前記半田層に入り込ませ、前記半田層を介して前記接続領域と前記コイル部品を電気的に接続する工程(D)と、
を有することを特徴とするアンテナ部品の製造方法。 - 前記線材がポリウレタン又はポリイミドにより被覆された銅線であることを特徴とする請求項1に記載のアンテナ部品の製造方法。
- 前記半田層が前記接続領域の5倍以上20倍以下の厚さに形成されることを特徴とする請求項1又は2に記載のアンテナ部品の製造方法。
- 前記工程(C)において、前記半田層に接する前記コイル部品の前記一部を前記半導体基板の表面に対し平行に配設することを特徴とする請求項1から3のいずれか1項に記載のアンテナ部品の製造方法。
- 前記工程(C)において、前記半田層に接する前記コイル部品の前記一部を前記半導体基板の表面に対し傾斜して配設することを特徴とする請求項1から3のいずれか1項に記載のアンテナ部品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013161219A JP2013219404A (ja) | 2013-08-02 | 2013-08-02 | アンテナ部品の製造方法 |
US14/445,189 US20150033545A1 (en) | 2013-08-02 | 2014-07-29 | Method for manufacturing antenna part |
CN201810378203.2A CN108493601A (zh) | 2013-08-02 | 2014-08-01 | 天线元件的制造方法 |
CN201410378470.1A CN104347924A (zh) | 2013-08-02 | 2014-08-01 | 天线元件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013161219A JP2013219404A (ja) | 2013-08-02 | 2013-08-02 | アンテナ部品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013219404A true JP2013219404A (ja) | 2013-10-24 |
Family
ID=49591093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013161219A Pending JP2013219404A (ja) | 2013-08-02 | 2013-08-02 | アンテナ部品の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150033545A1 (ja) |
JP (1) | JP2013219404A (ja) |
CN (2) | CN104347924A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104108007A (zh) * | 2014-06-25 | 2014-10-22 | 中国电子科技集团公司第二十研究所 | 一种脊形波导喇叭天线的加工方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7211577B2 (ja) * | 2018-02-28 | 2023-01-24 | 太陽誘電株式会社 | 圧電アクチュエータ、振動発生装置、及び電子機器 |
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JPH05161988A (ja) * | 1991-10-29 | 1993-06-29 | Fujitsu Ltd | レーザーコーン |
JPH05267060A (ja) * | 1992-03-24 | 1993-10-15 | Mitsubishi Electric Corp | 半導体装置 |
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KR101038755B1 (ko) * | 2008-10-09 | 2011-06-03 | 조인셋 주식회사 | 세라믹 칩 어셈블리 |
JP5298755B2 (ja) * | 2008-10-10 | 2013-09-25 | Tdk株式会社 | コイル部品の製造方法 |
DE102011009577A1 (de) * | 2011-01-27 | 2012-08-02 | Texas Instruments Deutschland Gmbh | RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne |
CN102610912B (zh) * | 2012-04-16 | 2015-08-05 | 韦业明 | 基于金属触点的天线电子层及其加工工艺 |
ES2928672T3 (es) * | 2012-09-14 | 2022-11-22 | Jamm Tech Inc | Transpondedores de alta temperatura |
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2013
- 2013-08-02 JP JP2013161219A patent/JP2013219404A/ja active Pending
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2014
- 2014-07-29 US US14/445,189 patent/US20150033545A1/en not_active Abandoned
- 2014-08-01 CN CN201410378470.1A patent/CN104347924A/zh active Pending
- 2014-08-01 CN CN201810378203.2A patent/CN108493601A/zh active Pending
Patent Citations (6)
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JPS6350867Y2 (ja) * | 1982-09-14 | 1988-12-27 | ||
JPH0817132B2 (ja) * | 1991-02-25 | 1996-02-21 | アキュ グスタフソ | 電子回路に巻線を固定する方法 |
JP2782558B2 (ja) * | 1991-06-05 | 1998-08-06 | トローヴァン・リミテッド | 改良形小形トランスポンダ |
JPH05161988A (ja) * | 1991-10-29 | 1993-06-29 | Fujitsu Ltd | レーザーコーン |
JPH05267060A (ja) * | 1992-03-24 | 1993-10-15 | Mitsubishi Electric Corp | 半導体装置 |
JPH08306553A (ja) * | 1995-04-28 | 1996-11-22 | Fujitsu Ten Ltd | 電子部品 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104108007A (zh) * | 2014-06-25 | 2014-10-22 | 中国电子科技集团公司第二十研究所 | 一种脊形波导喇叭天线的加工方法 |
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US20150033545A1 (en) | 2015-02-05 |
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