RU2015136239A - Архитектура создания гибких корпусов - Google Patents

Архитектура создания гибких корпусов Download PDF

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RU2015136239A
RU2015136239A RU2015136239A RU2015136239A RU2015136239A RU 2015136239 A RU2015136239 A RU 2015136239A RU 2015136239 A RU2015136239 A RU 2015136239A RU 2015136239 A RU2015136239 A RU 2015136239A RU 2015136239 A RU2015136239 A RU 2015136239A
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crystal
substrate
layer
flexible
crystals
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RU2015136239A
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RU2623697C2 (ru
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Бок Энг ЧЕА
Джексон Чунг Пенг КОНГ
Шанггар ПЕРИАМАН
Майкл СКИННЕР
Ен Хсианг ЧУ
Кхенг Тат МАР
РАЗАК Ридза Эффенди АБД
Коои Чи ООИ
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Интел Корпорейшн
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Claims (55)

1. Способ, содержащий этапы, на которых:
заделывают некоторое множество кремниевых кристаллов в гибкую подложку;
формируют гибкий прокладочный слой поверх заделанных кристаллов;
формируют тонкопленочный теплораспространяющий слой поверх подложки, противоположный гибкому прокладочному слою;
придают форму подложке с кристаллами и прокладкой; и
отверждают подложку, имеющую приданную форму.
2. Корпус, содержащий:
некоторое множество кремниевых кристаллов, заделанных в гибкой подложке;
гибкий прокладочный слой поверх заделанных кристаллов;
тонкопленочный теплораспространяющий слой поверх подложки, противоположный гибкому прокладочному слою,
причем гибкой подложке с кристаллами и прокладкой придана искривленная форма, и гибкая подложка отверждена так, что гибкая подложка сохраняет свою форму.
3. Корпус по п. 2, в котором гибкая прокладка содержит эластомер, несущий металлический слой.
4. Корпус по п. 2, в котором гибкая прокладка содержит множество чередующихся металлических и диэлектрических слоев.
5. Корпус по п. 2, в котором тонкопленочный теплораспространяющий слой содержит композит на основе меди.
6. Корпус по п. 2, дополнительно содержащий тонкопленочный теплораспространяющий слой поверх второй подложки, противоположный гибкой прокладке.
7. Электронная вычислительная система, содержащая:
источник электропитания;
устройство отображения; и
полупроводниковый модуль вычислительного устройства, имеющий некоторое множество кремниевых кристаллов, заделанных в гибкую подложку, гибкий прокладочный слой поверх заделанных кристаллов, и тонкопленочный теплораспространяющий слой поверх подложки, противоположный гибкому прокладочному слою, причем гибкой подложке с кристаллами и прокладкой придана искривленная форма, и гибкая подложка отверждена так, что гибкая подложка сохраняет свою форму.
8. Способ, содержащий этапы, на которых:
прикрепляют некоторое множество кристаллов к подложке;
заформовывают прикрепленные кристаллы;
формируют металлические контактные площадки и трассировку на формовочном компаунде; и
соединяют, по меньшей мере, один кристалл из этого множества кристаллов со сформированными металлическими контактными площадками и трассировкой.
9. Корпус, содержащий:
некоторый первый кристалл;
некоторый первый слой формовочного компаунда поверх первого кристалла;
слой межсоединений поверх первого слоя формовочного компаунда;
некоторый второй кристалл поверх этого слоя межсоединений и имеющий электрическое сопряжение с этим слоем межсоединений; и
некоторый второй слой формовочного компаунда поверх второго кристалла.
10. Корпус по п. 9, в котором первый кристалл имеет электрическое сопряжение с этим слоем межсоединений через проходящее через кремний сквозное отверстие в первом кристалле, которое простирается от верхней поверхности первого кристалла к схемам внутри первого кристалла, и второй кристалл имеет электрическое сопряжение с этим слоем межсоединений через монтажные площадки, сформированные на донной части второго кристалла.
11. Корпус по п. 9, дополнительно содержащий гибкую подложку под первым кристаллом, при этом гибкая подложка является теплопроводной и имеет тепловое сопряжение с первым кристаллом.
12. Корпус по п. 9, в котором второй кристалл не находится над первым кристаллом, и второй кристалл смещен от первого кристалла в боковом направлении.
13. Корпус по п. 9, дополнительно содержащий область электрического контакта поверх первого формовочного компаунда, сопряженную со слоем межсоединений, для соединения второго кристалла с внешним устройством.
14. Электронная вычислительная система, содержащая:
источник электропитания;
устройство отображения; и
полупроводниковый модуль вычислительного устройства, имеющий некоторый первый кристалл, некоторый первый слой формовочного компаунда поверх первого кристалла, слой межсоединений поверх первого слоя формовочного некоторый второй кристалл поверх этого слоя межсоединений и имеющий электрическое сопряжение с этим слоем межсоединений, и некоторый второй слой формовочного компаунда поверх второго кристалла.
15. Способ, содержащий этапы, на которых:
прикрепляют некоторое множество кристаллов к подложке;
заформовывают прикрепленные кристаллы и подложку посредством теплопроводного формовочного компаунда; и
наносят поверх формовочного компаунда теплопроводный слой в качестве теплораспределителя.
16. Корпус, содержащий:
подложку;
кристалл на подложке и соединенный с подложкой;
теплопроводный формовочный компаунд поверх кристалла и подложки; и
теплораспределитель поверх формовочного компаунда.
17. Корпус по п. 16, в котором формовочный компаунд наполнен теплопроводными материалами.
18. Корпус по п. 16, в котором теплораспределитель выполнен из теплопроводного материала, такого как медь или алюминий.
19. Корпус по п. 16, дополнительно содержащий теплопроводное сквозное отверстие через формованную часть для того, чтобы соединять теплораспределитель с подложкой.
20. Электронная вычислительная система, содержащая:
источник электропитания;
устройство отображения; и
полупроводниковый модуль вычислительного устройства, имеющий: подложку, кристалл на подложке и соединенный с подложкой, теплопроводный формовочный компаунд поверх кристалла и подложки и теплораспределитель поверх формовочного компаунда;
второй кристалл.
RU2015136239A 2014-09-26 2014-09-26 Архитектура создания гибких корпусов RU2623697C2 (ru)

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US20170345763A1 (en) 2017-11-30
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TW201622081A (zh) 2016-06-16
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CN105659375B (zh) 2021-08-24
EP3022765A1 (en) 2016-05-25
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