JP4363450B2 - ディスクアレイ装置 - Google Patents
ディスクアレイ装置 Download PDFInfo
- Publication number
- JP4363450B2 JP4363450B2 JP2007044059A JP2007044059A JP4363450B2 JP 4363450 B2 JP4363450 B2 JP 4363450B2 JP 2007044059 A JP2007044059 A JP 2007044059A JP 2007044059 A JP2007044059 A JP 2007044059A JP 4363450 B2 JP4363450 B2 JP 4363450B2
- Authority
- JP
- Japan
- Prior art keywords
- air volume
- hdd
- volume adjusting
- magnetic disk
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/144—Reducing the influence of the temperature by detection, control, regulation of the temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
2 筐体
3,3a〜3c HDDユニット
4,4a〜4c HDD
5,5a〜5c 風量調節機構
6 通風機構
7,8 通気口
9a〜9c 空気の流路
13a〜13c HDDユニット
14a〜14c HDD
15a〜15f 風量調節機構
19a〜19d 空気の流路
23 HDDユニット
24 HDD
25a,25b 風量調節機構
Claims (2)
- 複数の磁気ディスク装置と、
前記複数の磁気ディスク装置を冷却するための少なくとも1つの通風機構と、
各磁気ディスク装置に配され、前記磁気ディスク装置の温度に応じて変形して、前記磁気ディスク装置を冷却するための空気の流量を調節する風量調節機構と、を備え、
前記磁気ディスクの熱は、導体を介して前記風量調節機構に伝導され、
前記風量調節機構は、隣接する磁気ディスク装置の前記風量調節機構と対向するように配置されると共に、前記隣接する磁気ディスク装置の前記風量調節機構との間隙の大きさによって空気の流量を調節することを特徴とするディスクアレイ装置。 - 前記風量調節機構は形状記憶材から形成されていることを特徴とする請求項1に記載のディスクアレイ装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007044059A JP4363450B2 (ja) | 2007-02-23 | 2007-02-23 | ディスクアレイ装置 |
US12/035,750 US7778029B2 (en) | 2007-02-23 | 2008-02-22 | System comprising heat-generator and cooler thereof, and disk array system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007044059A JP4363450B2 (ja) | 2007-02-23 | 2007-02-23 | ディスクアレイ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008210017A JP2008210017A (ja) | 2008-09-11 |
JP4363450B2 true JP4363450B2 (ja) | 2009-11-11 |
Family
ID=39715641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007044059A Expired - Fee Related JP4363450B2 (ja) | 2007-02-23 | 2007-02-23 | ディスクアレイ装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7778029B2 (ja) |
JP (1) | JP4363450B2 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035173A (ja) * | 2005-07-28 | 2007-02-08 | Hitachi Ltd | ディスクアレイ装置 |
US20090321044A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Active heat sink designs |
US20100167636A1 (en) * | 2008-12-26 | 2010-07-01 | Anandaroop Bhattacharya | Active vents for cooling of computing device |
TWI395095B (zh) * | 2009-11-30 | 2013-05-01 | Ibm | 自調整散熱模組及其流量控制裝置 |
CN102111986A (zh) * | 2009-12-25 | 2011-06-29 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其侧板 |
US10852069B2 (en) | 2010-05-04 | 2020-12-01 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a fractal heat sink |
US9228785B2 (en) | 2010-05-04 | 2016-01-05 | Alexander Poltorak | Fractal heat transfer device |
US10041745B2 (en) | 2010-05-04 | 2018-08-07 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
CN103141166B (zh) * | 2010-08-10 | 2015-06-03 | 英派尔科技开发有限公司 | 改进的流体冷却 |
US8339787B2 (en) * | 2010-09-08 | 2012-12-25 | Apple Inc. | Heat valve for thermal management in a mobile communications device |
US8481852B2 (en) * | 2011-02-17 | 2013-07-09 | International Business Machines Corporation | Implementing flex circuit cable and connector with dual shielded air plenum |
EP2698591A4 (en) * | 2011-04-12 | 2014-11-05 | Ngk Insulators Ltd | HEAT FLOW SWITCH |
US20130100610A1 (en) * | 2011-10-19 | 2013-04-25 | Danfoss A/S | Air duct arrangement for cooling a group of at least two heat producing modules |
US20130255931A1 (en) * | 2012-03-30 | 2013-10-03 | General Electric Company | Heat transfer component and het transfer process |
JP5850161B2 (ja) * | 2012-08-09 | 2016-02-03 | 富士通株式会社 | 受熱装置、冷却装置、及び電子装置 |
US9444918B2 (en) | 2013-02-07 | 2016-09-13 | Nokia Corporation | Method and apparatus for providing access to a component |
US9317083B2 (en) * | 2013-02-22 | 2016-04-19 | Skyera, Llc | Thermal regulation for solid state memory |
JP6236843B2 (ja) * | 2013-04-12 | 2017-11-29 | 船井電機株式会社 | 表示装置 |
US20140360699A1 (en) * | 2013-06-07 | 2014-12-11 | Mide Technology Corporation | Variable geometry heat sink assembly |
US9261926B2 (en) | 2013-06-29 | 2016-02-16 | Intel Corporation | Thermally actuated vents for electronic devices |
WO2015087417A1 (ja) * | 2013-12-11 | 2015-06-18 | 株式会社日立製作所 | ストレージ装置及び制御方法 |
US9818672B2 (en) * | 2014-02-14 | 2017-11-14 | Intel IP Corporation | Flow diversion devices |
US20150271957A1 (en) * | 2014-03-20 | 2015-09-24 | Hamilton Sundstrand Corporation | Cooling flow optimization |
EP3022765A4 (en) | 2014-09-26 | 2017-04-26 | Intel Corporation | Flexible packaging architecture |
US10113818B2 (en) * | 2016-01-27 | 2018-10-30 | Garrett Transportation I Inc. | Bimetallic fin with themo-adjusting turbulation feature |
WO2018013668A1 (en) | 2016-07-12 | 2018-01-18 | Alexander Poltorak | System and method for maintaining efficiency of a heat sink |
US10102883B2 (en) * | 2016-09-30 | 2018-10-16 | Quanta Computer Inc. | Hard drive carrier with reduced airflow-induced vibrations |
US10937464B2 (en) * | 2017-03-17 | 2021-03-02 | Intel Corporation | Solid state memory case with enhanced cooling |
WO2019018446A1 (en) | 2017-07-17 | 2019-01-24 | Fractal Heatsink Technologies, LLC | SYSTEM AND METHOD FOR MULTI-FRACTAL THERMAL DISSIPATOR |
US10555441B2 (en) * | 2018-01-26 | 2020-02-04 | Super Micro Computer Inc. | Winds shroud and server using the same |
US10767896B2 (en) * | 2018-02-15 | 2020-09-08 | Denso International America, Inc. | HVAC system |
US11632874B1 (en) * | 2020-07-22 | 2023-04-18 | ZT Group Int'l, Inc. | Regulating airflow in a computer system |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4851965A (en) * | 1987-03-09 | 1989-07-25 | Unisys Corporation | Directed air management system for cooling multiple heat sinks |
GB2222500A (en) | 1988-09-05 | 1990-03-07 | Philips Electronic Associated | Picture motion measurement |
JPH0332495A (ja) | 1989-06-27 | 1991-02-13 | Komatsu Ltd | 接合用シートの製造法 |
JPH0414896A (ja) | 1990-05-08 | 1992-01-20 | Matsushita Electric Ind Co Ltd | 電子機器筐体の空冷装置 |
US5186385A (en) * | 1990-07-10 | 1993-02-16 | Majco Building Specialties, L.P. | Thermally activated vent damper |
CH680693A5 (ja) * | 1990-08-07 | 1992-10-15 | Sulzer Ag | |
US5428503A (en) * | 1992-03-24 | 1995-06-27 | Hitachi, Ltd. | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon |
JPH07210257A (ja) | 1994-01-17 | 1995-08-11 | Hitachi Ltd | 熱流路可変表面を用いた温度制御装置 |
US5769159A (en) * | 1995-04-19 | 1998-06-23 | Daewoo Electronics Co., Ltd | Apparatus for opening/closing a radiating section by using a shape memory alloy |
JP2692648B2 (ja) * | 1995-06-01 | 1997-12-17 | 日本電気株式会社 | 屋外機器用筐体 |
US6016250A (en) * | 1998-01-30 | 2000-01-18 | Credence Systems Corporation | Self-balancing thermal control device for integrated circuits |
JP2000187975A (ja) | 1998-12-22 | 2000-07-04 | Nec Corp | ディスクアレイ装置 |
US6342004B1 (en) * | 2000-03-01 | 2002-01-29 | Digital Lightwave, Inc. | Automatic fire shutter mechanism for rack mounted chassis systems |
US6330157B1 (en) * | 1999-12-21 | 2001-12-11 | International Business Machines Corporation | Variable thermal exchanger and method thereof |
US6330155B1 (en) * | 2000-03-28 | 2001-12-11 | Qtera Corporation | Method and apparatus for temperature control of electrical devices mounted on circuit boards |
US7038910B1 (en) * | 2002-01-07 | 2006-05-02 | Wave7 Optics, Inc. | System and method for removing heat from a subscriber optical interface |
JP2004295718A (ja) * | 2003-03-28 | 2004-10-21 | Hitachi Ltd | 情報処理装置の液例システム |
JP4009232B2 (ja) | 2003-06-27 | 2007-11-14 | 日本無線株式会社 | 加入者系無線アクセスシステム用基地局 |
-
2007
- 2007-02-23 JP JP2007044059A patent/JP4363450B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-22 US US12/035,750 patent/US7778029B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7778029B2 (en) | 2010-08-17 |
JP2008210017A (ja) | 2008-09-11 |
US20080205004A1 (en) | 2008-08-28 |
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