PL3231254T3 - Moduł LED - Google Patents
Moduł LEDInfo
- Publication number
- PL3231254T3 PL3231254T3 PL15804484T PL15804484T PL3231254T3 PL 3231254 T3 PL3231254 T3 PL 3231254T3 PL 15804484 T PL15804484 T PL 15804484T PL 15804484 T PL15804484 T PL 15804484T PL 3231254 T3 PL3231254 T3 PL 3231254T3
- Authority
- PL
- Poland
- Prior art keywords
- modul
- led
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/305—Frequency-control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B44/00—Circuit arrangements for operating electroluminescent light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D11/00—Devices accepting coins; Devices accepting, dispensing, sorting or counting valuable papers
- G07D11/20—Controlling or monitoring the operation of devices; Data handling
- G07D11/22—Means for sensing or detection
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F19/00—Complete banking systems; Coded card-freed arrangements adapted for dispensing or receiving monies or the like and posting such transactions to existing accounts, e.g. automatic teller machines
- G07F19/20—Automatic teller machines [ATMs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Computer Networks & Wireless Communication (AREA)
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
- Finance (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Credit Cards Or The Like (AREA)
- Telephone Function (AREA)
- Optical Filters (AREA)
- Electroluminescent Light Sources (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014225720.4A DE102014225720A1 (de) | 2014-12-12 | 2014-12-12 | LED-Modul |
EP15804484.2A EP3231254B1 (de) | 2014-12-12 | 2015-12-03 | Led-modul |
PCT/EP2015/078467 WO2016091704A1 (de) | 2014-12-12 | 2015-12-03 | Led-modul |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3231254T3 true PL3231254T3 (pl) | 2021-07-05 |
Family
ID=54780310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15804484T PL3231254T3 (pl) | 2014-12-12 | 2015-12-03 | Moduł LED |
Country Status (10)
Country | Link |
---|---|
US (1) | US10262980B2 (pl) |
EP (1) | EP3231254B1 (pl) |
JP (1) | JP6652246B2 (pl) |
KR (1) | KR102269935B1 (pl) |
CN (1) | CN107006092B (pl) |
DE (1) | DE102014225720A1 (pl) |
ES (1) | ES2861298T3 (pl) |
PL (1) | PL3231254T3 (pl) |
PT (1) | PT3231254T (pl) |
WO (1) | WO2016091704A1 (pl) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018105930A1 (de) * | 2018-03-14 | 2019-09-19 | Siteco Beleuchtungstechnik Gmbh | Parametrierbare Leuchte mit LED-Modul und NFC-fähigem Speichermodul |
CN110868777B (zh) * | 2019-10-29 | 2022-04-05 | 上海一芯智能科技有限公司 | 智能卡的时序发光控制方法及智能卡 |
US11490495B2 (en) * | 2020-04-08 | 2022-11-01 | Nthdegree Technologies Worldwide, Inc. | NFC-powered LED sticker with integral capacitor |
DE102020007194B3 (de) | 2020-08-05 | 2021-07-15 | Preh Gmbh | Verfahren zur Herstellung eines Formlings für eine Komponente einer Leuchteinrichtung mit drahtlos betreibbaren Mikro-Leuchtmitteln |
DE102020120709B3 (de) * | 2020-08-05 | 2021-01-21 | Preh Gmbh | Verfahren zur Herstellung eines Formlings für eine Komponente einer Leuchteinrichtung mit drahtlos betreibbaren Mikro-Leuchtmitteln und zugehörige Leuchteinrichtung |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE251C (de) * | 1877-08-06 | H. ALBERS in Hannover | Drehrolle | |
US4820321A (en) * | 1987-08-13 | 1989-04-11 | American Telephone And Telegraph Company | Method and apparatus for fabricating an expanded beam cylindrically terminated optical fiber taper |
JP3187575B2 (ja) * | 1992-12-22 | 2001-07-11 | 大日本印刷株式会社 | 情報記録媒体の製造方法及び情報記録再生方法 |
JP3427663B2 (ja) * | 1996-06-18 | 2003-07-22 | 凸版印刷株式会社 | 非接触icカード |
JP2001008386A (ja) * | 1999-06-18 | 2001-01-12 | Rohm Co Ltd | 発光装置 |
JP2001034725A (ja) * | 1999-07-22 | 2001-02-09 | Hitachi Maxell Ltd | 非接触icモジュール及びその製造方法、並びに、非接触情報媒体 |
EP1134694A1 (de) | 2000-03-16 | 2001-09-19 | Infineon Technologies AG | Dokument mit integrierter elektronischer Schaltung |
DE102004059465A1 (de) * | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | Erkennungssystem |
JP2007155554A (ja) * | 2005-12-06 | 2007-06-21 | Fujitsu Ltd | Rfidタグの位置を検出する位置検出装置 |
DE102005062827A1 (de) * | 2005-12-27 | 2007-06-28 | Bundesdruckerei Gmbh | Dokument mit einem Datenspeicher, Vorrichtung und Verfahren zum Lesen eines Funketiketts und Computerprogrammprodukt |
DE102006008345B3 (de) | 2006-02-21 | 2007-08-23 | Bundesdruckerei Gmbh | Sicherheits- und/oder Wertdokument |
DE102006033713A1 (de) * | 2006-05-30 | 2007-12-06 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes Bauelement, Vorrichtung mit einem organischen lichtemittierenden Bauelement und Beleuchtungseinrichtung sowie Verfahren zur Herstellung eines organischen lichtemittierenden Bauelements |
JP2008068785A (ja) * | 2006-09-15 | 2008-03-27 | Toyoda Gosei Co Ltd | 車両用発光装置 |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
JP2008134816A (ja) * | 2006-11-28 | 2008-06-12 | Philtech Inc | Rfパウダー粒子、rfパウダー、およびrfパウダーの励起方法 |
DE102008024780A1 (de) | 2008-05-23 | 2009-11-26 | Osram Gesellschaft mit beschränkter Haftung | Drahtlos speisbares Leuchtmittel |
DE102008024779A1 (de) * | 2008-05-23 | 2009-11-26 | Osram Gesellschaft mit beschränkter Haftung | Drahtlos speisbares Leuchtmodul |
WO2009157081A1 (ja) * | 2008-06-26 | 2009-12-30 | 富士通株式会社 | Rfidタグ |
WO2010122671A1 (ja) * | 2009-04-20 | 2010-10-28 | Matsuno Yuuji | 間接副資材のicタグ装置と間接副資材のデータ管理・電子認証及び決済装置 |
US8474726B2 (en) * | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
JP5648413B2 (ja) * | 2009-11-09 | 2015-01-07 | 東芝ライテック株式会社 | 照明装置 |
DE102010028444B4 (de) | 2010-04-30 | 2016-06-23 | Bundesdruckerei Gmbh | Dokument mit einem Chip und Verfahren zur Herstellung eines Dokuments |
KR101624811B1 (ko) * | 2011-09-12 | 2016-05-26 | 히타치가세이가부시끼가이샤 | Rfid 태그 및 자동 인식 시스템 |
KR20130042154A (ko) | 2011-10-18 | 2013-04-26 | 삼성전자주식회사 | 발광 소자 및 그 제조 방법, 이를 이용한 발광 소자 모듈 |
US9312314B2 (en) | 2012-02-02 | 2016-04-12 | Koninklijke Philips N.V. | Light apparatus for generating light |
DE102012203251B8 (de) | 2012-03-01 | 2013-11-07 | Bundesdruckerei Gmbh | Kontaktlose Datenübertragungseinrichtung, diese enthaltendes Sicherheits- bzw. Wertdokument |
DE102013106858A1 (de) | 2012-07-19 | 2014-01-23 | Samsung Electro-Mechanics Co., Ltd. | Substrat für ein LED-Modul und Verfahren zu dessen Herstellung |
WO2014083916A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社村田製作所 | アンテナモジュール |
DE102013207998A1 (de) * | 2013-05-02 | 2014-11-06 | Bundesdruckerei Gmbh | Sicherheits- oder Wertprodukt mit elektrolumineszierendem Sicherheitselement und Verfahren zur Herstellung desselben |
DE102013210842A1 (de) | 2013-06-11 | 2014-12-11 | Bundesdruckerei Gmbh | Dokument mit einer integrierten Anzeigevorrichtung |
JP3187575U (ja) * | 2013-09-23 | 2013-12-05 | 群光電能科技股▲ふん▼有限公司 | Led駆動装置 |
-
2014
- 2014-12-12 DE DE102014225720.4A patent/DE102014225720A1/de not_active Withdrawn
-
2015
- 2015-12-03 CN CN201580063050.7A patent/CN107006092B/zh active Active
- 2015-12-03 EP EP15804484.2A patent/EP3231254B1/de active Active
- 2015-12-03 US US15/534,953 patent/US10262980B2/en active Active
- 2015-12-03 WO PCT/EP2015/078467 patent/WO2016091704A1/de active Application Filing
- 2015-12-03 KR KR1020177013582A patent/KR102269935B1/ko active IP Right Grant
- 2015-12-03 ES ES15804484T patent/ES2861298T3/es active Active
- 2015-12-03 JP JP2017525796A patent/JP6652246B2/ja active Active
- 2015-12-03 PL PL15804484T patent/PL3231254T3/pl unknown
- 2015-12-03 PT PT158044842T patent/PT3231254T/pt unknown
Also Published As
Publication number | Publication date |
---|---|
KR102269935B1 (ko) | 2021-06-25 |
CN107006092B (zh) | 2020-04-21 |
US10262980B2 (en) | 2019-04-16 |
WO2016091704A1 (de) | 2016-06-16 |
EP3231254B1 (de) | 2021-03-03 |
US20170373049A1 (en) | 2017-12-28 |
EP3231254A1 (de) | 2017-10-18 |
ES2861298T3 (es) | 2021-10-06 |
JP6652246B2 (ja) | 2020-02-19 |
KR20170093803A (ko) | 2017-08-16 |
CN107006092A (zh) | 2017-08-01 |
JP2018508969A (ja) | 2018-03-29 |
DE102014225720A1 (de) | 2016-06-16 |
PT3231254T (pt) | 2021-03-31 |
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